TW200727078A - Photosetting/Thermosetting resin composition, cured product of the same and printed wiring board obtained using the same - Google Patents
Photosetting/Thermosetting resin composition, cured product of the same and printed wiring board obtained using the sameInfo
- Publication number
- TW200727078A TW200727078A TW095135391A TW95135391A TW200727078A TW 200727078 A TW200727078 A TW 200727078A TW 095135391 A TW095135391 A TW 095135391A TW 95135391 A TW95135391 A TW 95135391A TW 200727078 A TW200727078 A TW 200727078A
- Authority
- TW
- Taiwan
- Prior art keywords
- same
- photosetting
- wiring board
- printed wiring
- resin composition
- Prior art date
Links
- 229920001187 thermosetting polymer Polymers 0.000 title abstract 4
- 239000011342 resin composition Substances 0.000 title abstract 3
- 239000011347 resin Substances 0.000 abstract 3
- 229920005989 resin Polymers 0.000 abstract 3
- 150000001732 carboxylic acid derivatives Chemical class 0.000 abstract 2
- 150000001875 compounds Chemical class 0.000 abstract 2
- 239000011248 coating agent Substances 0.000 abstract 1
- 238000000576 coating method Methods 0.000 abstract 1
- 150000004292 cyclic ethers Chemical group 0.000 abstract 1
- 150000004294 cyclic thioethers Chemical group 0.000 abstract 1
- 230000002542 deteriorative effect Effects 0.000 abstract 1
- 239000000945 filler Substances 0.000 abstract 1
- 238000003384 imaging method Methods 0.000 abstract 1
- 239000003999 initiator Substances 0.000 abstract 1
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 abstract 1
- 238000004519 manufacturing process Methods 0.000 abstract 1
- 230000035945 sensitivity Effects 0.000 abstract 1
- 229910000679 solder Inorganic materials 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/10—Esters; Ether-esters
- C08K5/101—Esters; Ether-esters of monocarboxylic acids
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
- G03F7/031—Organic compounds not covered by group G03F7/029
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
Landscapes
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- General Physics & Mathematics (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Materials For Photolithography (AREA)
- Macromonomer-Based Addition Polymer (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005290765A JP4849860B2 (ja) | 2005-10-04 | 2005-10-04 | 光硬化性・熱硬化性樹脂組成物及びその硬化物並びにそれを用いて得られるプリント配線板 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200727078A true TW200727078A (en) | 2007-07-16 |
| TWI336026B TWI336026B (enExample) | 2011-01-11 |
Family
ID=38028841
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW095135391A TW200727078A (en) | 2005-10-04 | 2006-09-25 | Photosetting/Thermosetting resin composition, cured product of the same and printed wiring board obtained using the same |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP4849860B2 (enExample) |
| KR (1) | KR100787325B1 (enExample) |
| CN (1) | CN1945434B (enExample) |
| TW (1) | TW200727078A (enExample) |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5513711B2 (ja) * | 2007-10-01 | 2014-06-04 | 太陽ホールディングス株式会社 | 感光性樹脂組成物及びその硬化物 |
| JP4975579B2 (ja) * | 2007-10-01 | 2012-07-11 | 太陽ホールディングス株式会社 | 組成物、ドライフィルム、硬化物及びプリント配線板 |
| JP5376793B2 (ja) * | 2007-11-07 | 2013-12-25 | 太陽ホールディングス株式会社 | 光硬化性樹脂組成物及びその硬化物パターン、並びに該硬化物パターンを具備するプリント配線板 |
| JP5449688B2 (ja) * | 2008-03-26 | 2014-03-19 | 太陽ホールディングス株式会社 | 光硬化性熱硬化性樹脂組成物、そのドライフィルム及び硬化物並びにそれらを用いたプリント配線板 |
| WO2009119821A1 (ja) * | 2008-03-28 | 2009-10-01 | 太陽インキ製造株式会社 | 硬化性樹脂組成物とその硬化物、およびプリント配線板 |
| JP2009239181A (ja) * | 2008-03-28 | 2009-10-15 | Taiyo Ink Mfg Ltd | プリント配線板用樹脂組成物、ドライフィルムおよびプリント配線板 |
| CN102199273B (zh) * | 2010-03-25 | 2014-07-09 | 株式会社艾迪科 | 光固化树脂和使用该树脂的分散剂 |
| JP6084353B2 (ja) * | 2010-12-28 | 2017-02-22 | 太陽インキ製造株式会社 | 光硬化性樹脂組成物の製造方法、ドライフィルムの製造方法、硬化物の製造方法およびプリント配線板の製造方法 |
| JP5660690B2 (ja) * | 2013-08-02 | 2015-01-28 | 太陽ホールディングス株式会社 | 感光性樹脂組成物及びその硬化物 |
| JP6268310B2 (ja) * | 2015-01-21 | 2018-01-24 | 太陽インキ製造株式会社 | 絶縁性熱硬化性樹脂組成物、ドライフィルム、硬化物およびプリント配線板 |
| JP6892668B2 (ja) * | 2016-10-14 | 2021-06-23 | 互応化学工業株式会社 | 感光性樹脂組成物 |
| JP7109186B2 (ja) * | 2017-12-27 | 2022-07-29 | 株式会社Ｄｎｐファインケミカル | ウレタン（メタ）アクリレート系組成物、活性エネルギー線重合性組成物、及び積層体 |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61272A (ja) * | 1984-06-12 | 1986-01-06 | Taiyo Ink Seizo Kk | インキ組成物 |
| JPH0717737B2 (ja) * | 1987-11-30 | 1995-03-01 | 太陽インキ製造株式会社 | 感光性熱硬化性樹脂組成物及びソルダーレジストパターン形成方法 |
| JP2684948B2 (ja) * | 1993-02-03 | 1997-12-03 | 株式会社日本触媒 | 液状感光性樹脂組成物 |
| WO1996039454A1 (fr) * | 1995-06-06 | 1996-12-12 | Nof Corporation | Composition thermodurcissable, procede de finition d'un revetement et articles en etant revetus |
| JP3963602B2 (ja) * | 1999-01-27 | 2007-08-22 | 富士フイルム株式会社 | 遠紫外線露光用ポジ型フォトレジスト組成物 |
| TW494276B (en) * | 1999-05-06 | 2002-07-11 | Solar Blak Water Co Ltd | Solder resist ink composition |
| TW524813B (en) * | 2000-01-18 | 2003-03-21 | Taiyo Ink Mfg Co Ltd | Polynuclear epoxy compound, resin obtained therefrom curable with actinic energy ray, and photocurable/thermosetting resin composition containing the same |
| EP1276011B1 (en) * | 2000-03-29 | 2004-05-26 | Kanagawa University | Photocurable/thermosetting resin composition, photosensitive dry film formed therefrom, and method of forming pattern with the same |
| JP2003076015A (ja) * | 2001-09-07 | 2003-03-14 | Nichigo Morton Co Ltd | 感光性樹脂組成物及びそれを用いたドライフィルム |
| JP4328593B2 (ja) * | 2003-09-18 | 2009-09-09 | 太陽インキ製造株式会社 | カルボキシル基含有感光性樹脂を含有する組成物 |
| JP4309225B2 (ja) * | 2003-10-14 | 2009-08-05 | 太陽インキ製造株式会社 | 硬化性組成物、その硬化物及びそれを用いたプリント配線板 |
| JP3912405B2 (ja) * | 2003-11-11 | 2007-05-09 | 三菱化学株式会社 | 硬化性組成物、硬化物、カラーフィルタ及び液晶表示装置 |
| TW200519535A (en) * | 2003-11-27 | 2005-06-16 | Taiyo Ink Mfg Co Ltd | Hardenable resin composition, hardened body thereof, and printed circuit board |
| JP4489566B2 (ja) * | 2003-11-27 | 2010-06-23 | 太陽インキ製造株式会社 | 硬化性樹脂組成物、その硬化物、およびプリント配線板 |
| JP4815952B2 (ja) * | 2005-08-26 | 2011-11-16 | Ｊｓｒ株式会社 | 重合体、カラーフィルタ用感放射線性組成物、カラーフィルタおよびカラー液晶表示パネル |
-
2005
- 2005-10-04 JP JP2005290765A patent/JP4849860B2/ja not_active Expired - Lifetime
-
2006
- 2006-09-25 TW TW095135391A patent/TW200727078A/zh unknown
- 2006-09-29 KR KR1020060095264A patent/KR100787325B1/ko active Active
- 2006-10-08 CN CN2006101404506A patent/CN1945434B/zh active Active
Also Published As
| Publication number | Publication date |
|---|---|
| CN1945434A (zh) | 2007-04-11 |
| TWI336026B (enExample) | 2011-01-11 |
| KR100787325B1 (ko) | 2007-12-21 |
| JP2007101830A (ja) | 2007-04-19 |
| JP4849860B2 (ja) | 2012-01-11 |
| CN1945434B (zh) | 2010-05-12 |
| KR20070037998A (ko) | 2007-04-09 |
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