KR100787325B1 - 광 경화성 및 열 경화성 수지 조성물 및 그의 경화물 및 이를 이용하여 얻어지는 프린트 배선판 - Google Patents

광 경화성 및 열 경화성 수지 조성물 및 그의 경화물 및 이를 이용하여 얻어지는 프린트 배선판 Download PDF

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Publication number
KR100787325B1
KR100787325B1 KR1020060095264A KR20060095264A KR100787325B1 KR 100787325 B1 KR100787325 B1 KR 100787325B1 KR 1020060095264 A KR1020060095264 A KR 1020060095264A KR 20060095264 A KR20060095264 A KR 20060095264A KR 100787325 B1 KR100787325 B1 KR 100787325B1
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KR
South Korea
Prior art keywords
photocurable
group
thermosetting resin
resin composition
compound
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KR1020060095264A
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Korean (ko)
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KR20070037998A (ko
Inventor
노부히또 이또오
마사오 아리마
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다이요 잉키 세이조 가부시키가이샤
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/10—Esters; Ether-esters
    • C08K5/101—Esters; Ether-esters of monocarboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/031—Organic compounds not covered by group G03F7/029
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings

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  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials For Photolithography (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
KR1020060095264A 2005-10-04 2006-09-29 광 경화성 및 열 경화성 수지 조성물 및 그의 경화물 및 이를 이용하여 얻어지는 프린트 배선판 Active KR100787325B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005290765A JP4849860B2 (ja) 2005-10-04 2005-10-04 光硬化性・熱硬化性樹脂組成物及びその硬化物並びにそれを用いて得られるプリント配線板
JPJP-P-2005-00290765 2005-10-04

Publications (2)

Publication Number Publication Date
KR20070037998A KR20070037998A (ko) 2007-04-09
KR100787325B1 true KR100787325B1 (ko) 2007-12-21

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Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020060095264A Active KR100787325B1 (ko) 2005-10-04 2006-09-29 광 경화성 및 열 경화성 수지 조성물 및 그의 경화물 및 이를 이용하여 얻어지는 프린트 배선판

Country Status (4)

Country Link
JP (1) JP4849860B2 (enExample)
KR (1) KR100787325B1 (enExample)
CN (1) CN1945434B (enExample)
TW (1) TW200727078A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101010103B1 (ko) * 2008-03-26 2011-01-24 다이요 홀딩스 가부시키가이샤 광 경화성 수지 조성물, 그의 드라이 필름 및 경화물, 및 이들을 이용한 인쇄 배선판

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JP4975579B2 (ja) * 2007-10-01 2012-07-11 太陽ホールディングス株式会社 組成物、ドライフィルム、硬化物及びプリント配線板
JP5513711B2 (ja) * 2007-10-01 2014-06-04 太陽ホールディングス株式会社 感光性樹脂組成物及びその硬化物
JP5376793B2 (ja) * 2007-11-07 2013-12-25 太陽ホールディングス株式会社 光硬化性樹脂組成物及びその硬化物パターン、並びに該硬化物パターンを具備するプリント配線板
KR101612569B1 (ko) * 2008-03-28 2016-04-14 다이요 홀딩스 가부시키가이샤 경화성 수지 조성물과 그의 경화물, 및 인쇄 배선판
JP2009239181A (ja) * 2008-03-28 2009-10-15 Taiyo Ink Mfg Ltd プリント配線板用樹脂組成物、ドライフィルムおよびプリント配線板
CN102199273B (zh) * 2010-03-25 2014-07-09 株式会社艾迪科 光固化树脂和使用该树脂的分散剂
JP6084353B2 (ja) * 2010-12-28 2017-02-22 太陽インキ製造株式会社 光硬化性樹脂組成物の製造方法、ドライフィルムの製造方法、硬化物の製造方法およびプリント配線板の製造方法
JP5660690B2 (ja) * 2013-08-02 2015-01-28 太陽ホールディングス株式会社 感光性樹脂組成物及びその硬化物
CN107207837B (zh) * 2015-01-21 2020-04-07 太阳油墨制造株式会社 热固化性树脂组合物、干膜、固化物和印刷电路板
JP6892668B2 (ja) * 2016-10-14 2021-06-23 互応化学工業株式会社 感光性樹脂組成物
JP7109186B2 (ja) * 2017-12-27 2022-07-29 株式会社Ｄｎｐファインケミカル ウレタン（メタ）アクリレート系組成物、活性エネルギー線重合性組成物、及び積層体

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JPS61272A (ja) * 1984-06-12 1986-01-06 Taiyo Ink Seizo Kk インキ組成物
JPH0717737B2 (ja) * 1987-11-30 1995-03-01 太陽インキ製造株式会社 感光性熱硬化性樹脂組成物及びソルダーレジストパターン形成方法
JP2684948B2 (ja) * 1993-02-03 1997-12-03 株式会社日本触媒 液状感光性樹脂組成物
EP0774476A4 (en) * 1995-06-06 2002-01-16 Nof Corp THERMALIZING COMPOSITION, METHOD FOR FINISHING AND ITEMS COATED ITEMS
JP3963602B2 (ja) * 1999-01-27 2007-08-22 富士フイルム株式会社 遠紫外線露光用ポジ型フォトレジスト組成物
TW494276B (en) * 1999-05-06 2002-07-11 Solar Blak Water Co Ltd Solder resist ink composition
WO2001053375A1 (en) * 2000-01-18 2001-07-26 Taiyo Ink Manufacturing Co., Ltd. Polynuclear epoxy compound, resin obtained therefrom curable with actinic energy ray, and photocurable/thermosetting resin composition containing the same
KR100748219B1 (ko) * 2000-03-29 2007-08-09 각고우호우진 가나가와 다이가쿠 광경화성·열경화성 수지조성물, 그의 감광성 드라이필름및 이를 이용한 패턴 형성방법
JP2003076015A (ja) * 2001-09-07 2003-03-14 Nichigo Morton Co Ltd 感光性樹脂組成物及びそれを用いたドライフィルム
JP4328593B2 (ja) * 2003-09-18 2009-09-09 太陽インキ製造株式会社 カルボキシル基含有感光性樹脂を含有する組成物
JP4309225B2 (ja) * 2003-10-14 2009-08-05 太陽インキ製造株式会社 硬化性組成物、その硬化物及びそれを用いたプリント配線板
JP3912405B2 (ja) * 2003-11-11 2007-05-09 三菱化学株式会社 硬化性組成物、硬化物、カラーフィルタ及び液晶表示装置
JP4489566B2 (ja) * 2003-11-27 2010-06-23 太陽インキ製造株式会社 硬化性樹脂組成物、その硬化物、およびプリント配線板
JP4815952B2 (ja) * 2005-08-26 2011-11-16 Ｊｓｒ株式会社 重合体、カラーフィルタ用感放射線性組成物、カラーフィルタおよびカラー液晶表示パネル

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KR20050051574A (ko) * 2003-11-27 2005-06-01 다이요 잉키 세이조 가부시키가이샤 경화성 수지 조성물, 그의 경화물 및 인쇄 배선판

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101010103B1 (ko) * 2008-03-26 2011-01-24 다이요 홀딩스 가부시키가이샤 광 경화성 수지 조성물, 그의 드라이 필름 및 경화물, 및 이들을 이용한 인쇄 배선판

Also Published As

Publication number Publication date
JP4849860B2 (ja) 2012-01-11
TWI336026B (enExample) 2011-01-11
JP2007101830A (ja) 2007-04-19
CN1945434B (zh) 2010-05-12
CN1945434A (zh) 2007-04-11
KR20070037998A (ko) 2007-04-09
TW200727078A (en) 2007-07-16

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