TW200512534A - Liquid photo solder resist composition and photo solder resist film thereof - Google Patents

Liquid photo solder resist composition and photo solder resist film thereof

Info

Publication number
TW200512534A
TW200512534A TW093114704A TW93114704A TW200512534A TW 200512534 A TW200512534 A TW 200512534A TW 093114704 A TW093114704 A TW 093114704A TW 93114704 A TW93114704 A TW 93114704A TW 200512534 A TW200512534 A TW 200512534A
Authority
TW
Taiwan
Prior art keywords
solder resist
photo solder
resist composition
resistance
liquid photo
Prior art date
Application number
TW093114704A
Other languages
Chinese (zh)
Other versions
TWI263862B (en
Inventor
Chan-Hyo Park
Sung-Bae Moon
Dong-Hun Bong
Chang-Beom Chung
Original Assignee
Kolon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kolon Inc filed Critical Kolon Inc
Publication of TW200512534A publication Critical patent/TW200512534A/en
Application granted granted Critical
Publication of TWI263862B publication Critical patent/TWI263862B/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F283/00—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
    • C08F283/10—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polymers containing more than one epoxy radical per molecule
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0048—Photosensitive materials characterised by the solvents or agents facilitating spreading, e.g. tensio-active agents
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0388—Macromolecular compounds which are rendered insoluble or differentially wettable with ethylenic or acetylenic bands in the side chains of the photopolymer
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/105—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having substances, e.g. indicators, for forming visible images
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H05K3/287—Photosensitive compositions

Abstract

The present invention is directed to a liquid photo solder resist composition and a solder resist film prepared from the composition. In the liquid photo solder resist composition including a UV-curing resin developable with an aqueous alkali solution, a UV-reactive acrylic monomer, an epoxy resin, a photopolymerization initiator, and an organic solvent, the epoxy resin has an isocyanurate structure comprising one epoxy group and at least two acryl groups in one molecule as prepared by steps including: (a) reacting a cyanurate compound with an acrylate-based monomer to yield a product having acryl groups; and (b) adding an epichlorohydrine to the product of the step (a). The photo solder resist film prepared from the liquid photo solder resist composition guarantees a wide dry control width without surface stickiness and provides excellent properties such as resistance to solder heat, resolution, resistance to plating, and resistance to acid/alkali solutions, thereby being useful for a protection film of printed circuit boards and color filters having a high-density ultrafine conductive pattern.
TW093114704A 2003-09-22 2004-05-25 Liquid photo solder resist composition and photo solder resist film thereof TWI263862B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR10-2003-0065528A KR100522002B1 (en) 2003-09-22 2003-09-22 liquid photo solder resist composition and photo solder resist film thereof

Publications (2)

Publication Number Publication Date
TW200512534A true TW200512534A (en) 2005-04-01
TWI263862B TWI263862B (en) 2006-10-11

Family

ID=34374142

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093114704A TWI263862B (en) 2003-09-22 2004-05-25 Liquid photo solder resist composition and photo solder resist film thereof

Country Status (5)

Country Link
JP (1) JP2007506137A (en)
KR (1) KR100522002B1 (en)
CN (1) CN1856737A (en)
TW (1) TWI263862B (en)
WO (1) WO2005029177A1 (en)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101052767B1 (en) * 2005-04-15 2011-07-29 코오롱인더스트리 주식회사 UV and thermosetting resin composition
CN101225184B (en) * 2007-01-19 2011-01-26 财团法人工业技术研究院 Resin composition
JP5553973B2 (en) * 2008-07-09 2014-07-23 富士フイルム株式会社 Colored curable composition, color filter, method for producing color filter, and liquid crystal display element
KR101539612B1 (en) * 2008-07-18 2015-07-28 주식회사 동진쎄미켐 The reactive monomers for a polyimide precursor and a negative-type photosensitive polyimide precursor using the same
CN102317343B (en) * 2009-02-10 2013-07-31 日产化学工业株式会社 Long chain alkylene group-containing epoxy compound
JP5517636B2 (en) * 2010-01-15 2014-06-11 テルモ株式会社 Electronic thermometer and control method
JP5521800B2 (en) * 2010-06-08 2014-06-18 Ｊｓｒ株式会社 Radiation-sensitive resin composition, cured film, method for forming cured film, and display element
JP2013101287A (en) * 2011-11-10 2013-05-23 Toyo Ink Sc Holdings Co Ltd Coloring composition for color filter, and color filter
EP2883109A1 (en) * 2012-08-09 2015-06-17 3M Innovative Properties Company Photocurable compositions
JP7085791B2 (en) * 2017-04-21 2022-06-17 日本化薬株式会社 Photosensitive resin composition and its cured product

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5872140A (en) * 1981-10-26 1983-04-30 Hitachi Chem Co Ltd Photosetting resin composition
DE3371988D1 (en) * 1983-07-26 1987-07-16 Dainippon Ink & Chemicals Curable resin composition and its use
JP3217126B2 (en) * 1992-06-18 2001-10-09 タムラ化研株式会社 Photosensitive resin composition
TW424172B (en) * 1995-04-19 2001-03-01 Hitachi Chemical Co Ltd Photosensitive resin composition and photosensitive element using the same

Also Published As

Publication number Publication date
KR20050029761A (en) 2005-03-28
JP2007506137A (en) 2007-03-15
CN1856737A (en) 2006-11-01
WO2005029177A1 (en) 2005-03-31
KR100522002B1 (en) 2005-10-18
TWI263862B (en) 2006-10-11

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees