TW200722211A - Cutting blade exchanging device - Google Patents
Cutting blade exchanging deviceInfo
- Publication number
- TW200722211A TW200722211A TW095134964A TW95134964A TW200722211A TW 200722211 A TW200722211 A TW 200722211A TW 095134964 A TW095134964 A TW 095134964A TW 95134964 A TW95134964 A TW 95134964A TW 200722211 A TW200722211 A TW 200722211A
- Authority
- TW
- Taiwan
- Prior art keywords
- cutting blade
- gripping
- exchanging device
- blade
- cutting
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
- B23Q3/00—Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine
- B23Q3/155—Arrangements for automatic insertion or removal of tools, e.g. combined with manual handling
- B23Q3/1552—Arrangements for automatic insertion or removal of tools, e.g. combined with manual handling parts of devices for automatically inserting or removing tools
- B23Q3/1554—Transfer mechanisms, e.g. tool gripping arms; Drive mechanisms therefore
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
- B23Q3/00—Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine
- B23Q3/155—Arrangements for automatic insertion or removal of tools, e.g. combined with manual handling
- B23Q3/15513—Arrangements for automatic insertion or removal of tools, e.g. combined with manual handling the tool being taken from a storage device and transferred to a tool holder by means of transfer devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B27—WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
- B27B—SAWS FOR WOOD OR SIMILAR MATERIAL; COMPONENTS OR ACCESSORIES THEREFOR
- B27B5/00—Sawing machines working with circular or cylindrical saw blades; Components or equipment therefor
- B27B5/29—Details; Component parts; Accessories
- B27B5/30—Details; Component parts; Accessories for mounting or securing saw blades or saw spindles
- B27B5/32—Devices for securing circular saw blades to the saw spindle
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
- B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
- B28D5/029—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels with a plurality of cutting blades
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Forests & Forestry (AREA)
- Physics & Mathematics (AREA)
- Wood Science & Technology (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Dicing (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005298856A JP4837973B2 (ja) | 2005-10-13 | 2005-10-13 | 切削ブレードの交換装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200722211A true TW200722211A (en) | 2007-06-16 |
TWI367138B TWI367138B (zh) | 2012-07-01 |
Family
ID=38017611
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW095134964A TW200722211A (en) | 2005-10-13 | 2006-09-21 | Cutting blade exchanging device |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP4837973B2 (zh) |
KR (1) | KR101265706B1 (zh) |
CN (1) | CN100537129C (zh) |
TW (1) | TW200722211A (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8079121B2 (en) | 2007-05-24 | 2011-12-20 | Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd. | Pressing device for latching and releasing chucking device |
Families Citing this family (27)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5014892B2 (ja) * | 2007-06-25 | 2012-08-29 | 株式会社ディスコ | ブレード交換工具 |
JP5101979B2 (ja) * | 2007-10-15 | 2012-12-19 | 株式会社ディスコ | ブレードケース |
JP5199777B2 (ja) * | 2008-08-04 | 2013-05-15 | 株式会社ディスコ | 切削装置 |
JP5457131B2 (ja) * | 2009-10-07 | 2014-04-02 | 株式会社ディスコ | ブレード交換装置 |
CN102194731B (zh) * | 2010-03-12 | 2013-03-27 | 北京北方微电子基地设备工艺研究中心有限责任公司 | 一种位置校准系统及等离子体处理装置 |
JP5695359B2 (ja) * | 2010-07-28 | 2015-04-01 | 株式会社ディスコ | 加工装置 |
JP5216075B2 (ja) * | 2010-12-22 | 2013-06-19 | Towa株式会社 | ブレード着脱装置 |
JP2014091208A (ja) * | 2012-11-06 | 2014-05-19 | Disco Abrasive Syst Ltd | 工具着脱治具 |
JP5268178B1 (ja) * | 2013-02-18 | 2013-08-21 | 卓也 蔵田 | 先端工具の交換治具および交換方法 |
WO2016058294A1 (zh) * | 2014-10-14 | 2016-04-21 | 山东新安凯科控科技有限公司 | 一种多功能机床 |
CN206998601U (zh) * | 2017-07-03 | 2018-02-13 | 广州蓝圣智能科技有限公司 | 电动打磨机自动换砂轮片机构 |
JP6966883B2 (ja) * | 2017-07-04 | 2021-11-17 | 株式会社ディスコ | ブレード脱着治具、ブレード脱着方法、ブレード取り出し方法、及び切削装置 |
JP6998158B2 (ja) * | 2017-09-07 | 2022-01-18 | 株式会社ディスコ | 切削ブレード供給装置 |
JP6998159B2 (ja) | 2017-09-07 | 2022-01-18 | 株式会社ディスコ | 切削ブレード供給装置 |
JP6612372B2 (ja) * | 2018-01-30 | 2019-11-27 | Towa株式会社 | フランジ交換機構、切断装置、フランジ交換方法および切断品の製造方法 |
JP7126749B2 (ja) * | 2018-03-19 | 2022-08-29 | 株式会社ディスコ | 切削装置 |
JP6657553B2 (ja) * | 2018-10-17 | 2020-03-04 | 株式会社東京精密 | ブレード着脱装置及びブレード着脱方法 |
CN109570600A (zh) * | 2019-01-06 | 2019-04-05 | 重庆欣天利智能重工有限公司 | 一种立铣机床用辅助加工工装 |
JP7157674B2 (ja) * | 2019-01-30 | 2022-10-20 | 株式会社ディスコ | ブレード交換ユニット |
JP7205047B2 (ja) * | 2019-01-30 | 2023-01-17 | 株式会社東京精密 | 被搬送物の位置決め装置及び位置決め方法 |
CN109866063A (zh) * | 2019-04-23 | 2019-06-11 | 杭州红凌服饰有限公司 | 一种数控机床换刀装置 |
JP2021013968A (ja) * | 2019-07-10 | 2021-02-12 | 株式会社ディスコ | 加工装置 |
JP7248557B2 (ja) * | 2019-10-24 | 2023-03-29 | Towa株式会社 | ブレード交換装置、切断装置、及び、切断品の製造方法 |
JP2021181129A (ja) * | 2020-05-18 | 2021-11-25 | 株式会社ディスコ | ブレード交換装置及びブレード交換装置の調整方法 |
KR102246541B1 (ko) * | 2020-09-28 | 2021-04-30 | (주)네온테크 | 하이브리드 블레이드 체인지 모듈 및 이를 사용한 블레이드 자동 공급 방법 |
JP2022100501A (ja) | 2020-12-24 | 2022-07-06 | 株式会社ディスコ | 切削装置 |
CN114473632B (zh) * | 2022-01-27 | 2023-03-03 | 东莞宝钢钢材部件有限公司 | 一种快速确认摆剪偏转角度的装置 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2617876B2 (ja) * | 1994-02-04 | 1997-06-04 | 株式会社ディスコ | ブレードオートチェンジャー |
JPH07276227A (ja) * | 1994-04-06 | 1995-10-24 | Disco Abrasive Syst Ltd | オートブレードチェンジャー |
JP4481667B2 (ja) | 2004-02-02 | 2010-06-16 | 株式会社ディスコ | 切削方法 |
-
2005
- 2005-10-13 JP JP2005298856A patent/JP4837973B2/ja active Active
-
2006
- 2006-09-21 TW TW095134964A patent/TW200722211A/zh unknown
- 2006-10-12 CN CNB2006101318341A patent/CN100537129C/zh active Active
- 2006-10-13 KR KR1020060099756A patent/KR101265706B1/ko active IP Right Grant
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8079121B2 (en) | 2007-05-24 | 2011-12-20 | Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd. | Pressing device for latching and releasing chucking device |
Also Published As
Publication number | Publication date |
---|---|
JP2007105829A (ja) | 2007-04-26 |
KR101265706B1 (ko) | 2013-05-21 |
JP4837973B2 (ja) | 2011-12-14 |
CN1947931A (zh) | 2007-04-18 |
KR20070041384A (ko) | 2007-04-18 |
CN100537129C (zh) | 2009-09-09 |
TWI367138B (zh) | 2012-07-01 |
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