TW200717632A - Substrate processing apparatus and substrate processing method, and computer-readable storage medium - Google Patents

Substrate processing apparatus and substrate processing method, and computer-readable storage medium

Info

Publication number
TW200717632A
TW200717632A TW095122476A TW95122476A TW200717632A TW 200717632 A TW200717632 A TW 200717632A TW 095122476 A TW095122476 A TW 095122476A TW 95122476 A TW95122476 A TW 95122476A TW 200717632 A TW200717632 A TW 200717632A
Authority
TW
Taiwan
Prior art keywords
substrate
substrate processing
processing apparatus
drying
unit
Prior art date
Application number
TW095122476A
Other languages
English (en)
Other versions
TWI312539B (zh
Inventor
Koukichi Hiroshiro
Yuji Kamikawa
Takayuki Toshima
Naoki Shindo
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2005182321A external-priority patent/JP4498986B2/ja
Priority claimed from JP2005182320A external-priority patent/JP4584783B2/ja
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of TW200717632A publication Critical patent/TW200717632A/zh
Application granted granted Critical
Publication of TWI312539B publication Critical patent/TWI312539B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02057—Cleaning during device manufacture
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
TW095122476A 2005-06-22 2006-06-22 Substrate processing apparatus and substrate processing method, and computer-readable storage medium TW200717632A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005182321A JP4498986B2 (ja) 2005-06-22 2005-06-22 基板処理装置および基板処理方法ならびにコンピュータ読取可能な記憶媒体
JP2005182320A JP4584783B2 (ja) 2005-06-22 2005-06-22 基板処理装置および基板処理方法、ならびにコンピュータ読取可能な記憶媒体

Publications (2)

Publication Number Publication Date
TW200717632A true TW200717632A (en) 2007-05-01
TWI312539B TWI312539B (zh) 2009-07-21

Family

ID=37570360

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095122476A TW200717632A (en) 2005-06-22 2006-06-22 Substrate processing apparatus and substrate processing method, and computer-readable storage medium

Country Status (5)

Country Link
US (2) US8015984B2 (zh)
EP (1) EP1909313A4 (zh)
KR (2) KR101133394B1 (zh)
TW (1) TW200717632A (zh)
WO (1) WO2006137330A1 (zh)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI452613B (zh) * 2007-09-27 2014-09-11 Dainippon Screen Mfg 基板處理裝置及基板處理方法
CN110634770A (zh) * 2018-06-25 2019-12-31 东京毅力科创株式会社 基板处理装置、基板处理方法以及存储介质

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4630881B2 (ja) * 2007-03-05 2011-02-09 シャープ株式会社 基板洗浄装置
JP5138515B2 (ja) 2008-09-05 2013-02-06 東京エレクトロン株式会社 蒸気発生器、蒸気発生方法および基板処理装置
US8169353B2 (en) * 2009-09-30 2012-05-01 Qualcomm, Incorporated Wideband digital to analog converter with built-in load attenuator
US20110289795A1 (en) * 2010-02-16 2011-12-01 Tomoatsu Ishibashi Substrate drying apparatus, substrate drying method and control program
KR20120028079A (ko) * 2010-09-14 2012-03-22 삼성모바일디스플레이주식회사 기판의 세정 장치 및 세정 방법
JP5627518B2 (ja) * 2011-03-16 2014-11-19 大日本スクリーン製造株式会社 基板処理装置および電源管理方法
JP4846057B1 (ja) * 2011-03-17 2011-12-28 ジャパン・フィールド株式会社 被洗浄物の洗浄装置
KR102092702B1 (ko) * 2011-06-14 2020-05-28 삼성디스플레이 주식회사 기판 세정 장치
US8702871B2 (en) * 2011-08-30 2014-04-22 Taiwan Semiconductor Manufacturing Company, Ltd. Package assembly cleaning process using vaporized solvent
CN103042002B (zh) * 2013-01-07 2014-10-29 莱芜钢铁集团有限公司 一种焦油加工生产线及化验仪器清洗干燥装置
US8872685B2 (en) 2013-03-15 2014-10-28 Qualcomm Incorporated Techniques to reduce harmonic distortions of impedance attenuators for low-power wideband high-resolution DACs
TWI620237B (zh) * 2015-01-16 2018-04-01 弘塑科技股份有限公司 整合水分去除與乾燥之處理設備及半導體晶圓之處理方法
JP6456792B2 (ja) * 2015-08-07 2019-01-23 東京エレクトロン株式会社 基板液処理装置、基板液処理方法及び記憶媒体
TW201713751A (zh) * 2015-10-06 2017-04-16 聯華電子股份有限公司 酸槽補酸系統與方法
JP2017157800A (ja) * 2016-03-04 2017-09-07 東京エレクトロン株式会社 液処理方法、基板処理装置、及び記憶媒体
US20170365492A1 (en) * 2016-06-16 2017-12-21 Applied Materials, Inc. Wafer processor door interface
US10962285B2 (en) * 2018-07-13 2021-03-30 Taiwan Semiconductor Manufacturing Co., Ltd. Wafer drying system
JP7241568B2 (ja) * 2019-03-04 2023-03-17 東京エレクトロン株式会社 基板処理装置、基板処理方法および記憶媒体
JP7281925B2 (ja) * 2019-03-07 2023-05-26 東京エレクトロン株式会社 基板処理装置、基板処理方法および記憶媒体
CN115507640A (zh) * 2022-10-21 2022-12-23 滁州钰顺企业管理咨询合伙企业(有限合伙) 一种晶圆背面蚀刻后干燥的方法

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US4778532A (en) 1985-06-24 1988-10-18 Cfm Technologies Limited Partnership Process and apparatus for treating wafers with process fluids
JP3204503B2 (ja) * 1990-09-13 2001-09-04 株式会社日立製作所 蒸気洗浄方法及びその装置
US5575079A (en) * 1993-10-29 1996-11-19 Tokyo Electron Limited Substrate drying apparatus and substrate drying method
JPH08211592A (ja) 1995-02-07 1996-08-20 Nikon Corp 洗浄乾燥方法及び洗浄乾燥装置
KR980012044A (ko) * 1996-03-01 1998-04-30 히가시 데츠로 기판건조장치 및 기판건조방법
US6068002A (en) * 1997-04-02 2000-05-30 Tokyo Electron Limited Cleaning and drying apparatus, wafer processing system and wafer processing method
JPH10321584A (ja) * 1997-05-22 1998-12-04 Mitsubishi Electric Corp 乾燥装置および乾燥方法
JPH11176798A (ja) 1997-12-08 1999-07-02 Toshiba Corp 基板洗浄・乾燥装置及び方法
JP2000040686A (ja) * 1998-07-22 2000-02-08 Mitsubishi Electric Corp 半導体製造方法、半導体製造装置、及び混合ガス生成装置
JP3869671B2 (ja) 2001-03-22 2007-01-17 大日本スクリーン製造株式会社 基板処理方法および基板処理装置
KR100454241B1 (ko) 2001-12-28 2004-10-26 한국디엔에스 주식회사 웨이퍼 건조 장비
TW200303581A (en) * 2002-02-28 2003-09-01 Tech Ltd A Method and apparatus for cleaning and drying semiconductor wafer
US6928748B2 (en) * 2003-10-16 2005-08-16 Taiwan Semiconductor Manufacturing Co., Ltd Method to improve post wafer etch cleaning process
JP4122024B2 (ja) 2005-11-29 2008-07-23 オリンパス株式会社 内視鏡挿入補助具
JP2007273758A (ja) * 2006-03-31 2007-10-18 Dainippon Screen Mfg Co Ltd 基板処理装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI452613B (zh) * 2007-09-27 2014-09-11 Dainippon Screen Mfg 基板處理裝置及基板處理方法
CN110634770A (zh) * 2018-06-25 2019-12-31 东京毅力科创株式会社 基板处理装置、基板处理方法以及存储介质

Also Published As

Publication number Publication date
WO2006137330A1 (ja) 2006-12-28
TWI312539B (zh) 2009-07-21
EP1909313A4 (en) 2011-11-09
US8303724B2 (en) 2012-11-06
KR20080020988A (ko) 2008-03-06
EP1909313A1 (en) 2008-04-09
KR101124049B1 (ko) 2012-03-26
KR101133394B1 (ko) 2012-04-09
US20110290280A1 (en) 2011-12-01
US20090101186A1 (en) 2009-04-23
US8015984B2 (en) 2011-09-13
KR20110028534A (ko) 2011-03-18

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