TW200712764A - Photosensitive resin composition and photosensitive element - Google Patents
Photosensitive resin composition and photosensitive elementInfo
- Publication number
- TW200712764A TW200712764A TW095127314A TW95127314A TW200712764A TW 200712764 A TW200712764 A TW 200712764A TW 095127314 A TW095127314 A TW 095127314A TW 95127314 A TW95127314 A TW 95127314A TW 200712764 A TW200712764 A TW 200712764A
- Authority
- TW
- Taiwan
- Prior art keywords
- resin composition
- photosensitive
- photosensitive resin
- reacting
- component
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/022—Quinonediazides
- G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
- G03F7/0233—Macromolecular quinonediazides; Macromolecular additives, e.g. binders characterised by the polymeric binders or the macromolecular additives other than the macromolecular quinonediazides
- G03F7/0236—Condensation products of carbonyl compounds and phenolic compounds, e.g. novolak resins
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0005—Production of optical devices or components in so far as characterised by the lithographic processes or materials used therefor
- G03F7/0007—Filters, e.g. additive colour filters; Components for display devices
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/008—Azides
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/022—Quinonediazides
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Materials For Photolithography (AREA)
- Phenolic Resins Or Amino Resins (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005250086 | 2005-08-30 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200712764A true TW200712764A (en) | 2007-04-01 |
TWI328717B TWI328717B (zh) | 2010-08-11 |
Family
ID=37808578
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW095127314A TW200712764A (en) | 2005-08-30 | 2006-07-26 | Photosensitive resin composition and photosensitive element |
Country Status (6)
Country | Link |
---|---|
US (1) | US8034529B2 (zh) |
JP (1) | JP4600477B2 (zh) |
KR (1) | KR100937264B1 (zh) |
CN (3) | CN103869614A (zh) |
TW (1) | TW200712764A (zh) |
WO (1) | WO2007026475A1 (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI401544B (zh) * | 2007-05-16 | 2013-07-11 | Tokuyama Corp | Photoresist |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4766115B2 (ja) * | 2006-08-24 | 2011-09-07 | ダイキン工業株式会社 | 半導体ドライプロセス後の残渣除去液及びそれを用いた残渣除去方法 |
JP5076611B2 (ja) * | 2006-10-06 | 2012-11-21 | 日立化成工業株式会社 | 電極パターンの形成方法 |
JP5076511B2 (ja) * | 2007-01-17 | 2012-11-21 | 大日本印刷株式会社 | 液晶配向制御用突起形成用組成物 |
JP5444749B2 (ja) * | 2008-02-25 | 2014-03-19 | 日立化成株式会社 | ポジ型感光性樹脂組成物、レジストパターンの製造方法及び電子部品 |
KR101325866B1 (ko) * | 2008-05-15 | 2013-11-05 | 코오롱인더스트리 주식회사 | 필름형 감광성 전사재료 |
US8426985B2 (en) | 2008-09-04 | 2013-04-23 | Hitachi Chemical Company, Ltd. | Positive-type photosensitive resin composition, method for producing resist pattern, and electronic component |
KR101397771B1 (ko) * | 2008-12-26 | 2014-05-20 | 히타치가세이가부시끼가이샤 | 포지티브형 감광성 수지 조성물, 레지스트 패턴의 제조 방법, 반도체 장치 및 전자 디바이스 |
JP6177495B2 (ja) * | 2011-06-01 | 2017-08-09 | 日立化成株式会社 | ポジ型感光性樹脂組成物及び感光性フィルム |
KR20150096372A (ko) | 2012-12-12 | 2015-08-24 | 히타치가세이가부시끼가이샤 | 감광성 수지 조성물 및 이것을 사용한 감광성 필름 |
KR101728820B1 (ko) * | 2013-12-12 | 2017-04-20 | 제일모직 주식회사 | 포지티브형 감광성 수지 조성물, 감광성 수지막, 및 표시 소자 |
CN104865797A (zh) * | 2014-02-24 | 2015-08-26 | 日立化成株式会社 | 感光性树脂组合物、使用其的感光性元件、抗蚀图形的形成方法及触摸面板的制造方法 |
CN106597813B (zh) * | 2016-12-22 | 2018-08-14 | 深圳市华星光电技术有限公司 | 量子点发光层图案化的方法、量子点彩膜及显示装置 |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4564575A (en) | 1984-01-30 | 1986-01-14 | International Business Machines Corporation | Tailoring of novolak and diazoquinone positive resists by acylation of novolak |
GB8505402D0 (en) * | 1985-03-02 | 1985-04-03 | Ciba Geigy Ag | Modified phenolic resins |
JPS61243869A (ja) | 1985-04-19 | 1986-10-30 | Taiyo Ink Seizo Kk | レジストインキ組成物 |
US5208138A (en) | 1990-02-05 | 1993-05-04 | Morton International, Inc. | High contrast high thermal stability positive photoresists having novolak resins of lowered hydroxyl content |
US5182184A (en) * | 1990-02-05 | 1993-01-26 | Morton International, Inc. | Novolak resins of lowered hydroxyl content and high contrast high thermal stability positive photoresists prepared therefrom |
JP2802801B2 (ja) | 1990-03-02 | 1998-09-24 | 株式会社アサヒ化学研究所 | 感光性熱硬化性樹脂組成物及びソルダーレジストパターン形成方法 |
JPH06192387A (ja) | 1992-12-24 | 1994-07-12 | Toagosei Chem Ind Co Ltd | 活性エネルギー線硬化性樹脂 |
JPH0741716A (ja) | 1993-07-28 | 1995-02-10 | Nissan Chem Ind Ltd | ソルダーレジストインキ樹脂組成物 |
JP3851366B2 (ja) | 1995-10-30 | 2006-11-29 | ナショナル スターチ アンド ケミカル インベストメント ホールディング コーポレイション | 感光性樹脂組成物 |
CN1088527C (zh) * | 1997-01-06 | 2002-07-31 | 住友电木株式会社 | 光敏性树脂组合物成像过程的方法 |
JP2001114853A (ja) | 1999-10-21 | 2001-04-24 | Nippon Shokubai Co Ltd | カルボキシル基を有するノボラック型フェノール樹脂および該フェノール樹脂を用いたポジ型感光性樹脂組成物 |
JP3964326B2 (ja) | 2000-09-20 | 2007-08-22 | 太陽インキ製造株式会社 | カルボキシル基含有感光性樹脂、それを含有するアルカリ現像可能な光硬化性・熱硬化性組成物及びその硬化物 |
JP3710717B2 (ja) * | 2001-03-06 | 2005-10-26 | 東京応化工業株式会社 | 厚膜用ポジ型ホトレジスト組成物、ホトレジスト膜およびこれを用いたバンプ形成方法 |
CN100524019C (zh) * | 2001-08-29 | 2009-08-05 | 住友化学工业株式会社 | 光刻胶组合物 |
CN1469198A (zh) * | 2002-07-01 | 2004-01-21 | 关西涂料株式会社 | 正型感光性涂料组合物、正型感光性树脂的制造方法及图形的形成方法 |
US6887643B2 (en) * | 2002-08-05 | 2005-05-03 | Toray Industries, Inc. | Photosensitive resin precursor composition |
EP1475665B1 (en) * | 2003-04-07 | 2009-12-30 | Toray Industries, Inc. | Positive-type photosensitive resin composition |
JP2005221726A (ja) * | 2004-02-05 | 2005-08-18 | Fuji Photo Film Co Ltd | 感光性転写材料、液晶配向制御用突起及びその形成方法、並びに、液晶表示装置 |
-
2006
- 2006-07-19 US US12/065,110 patent/US8034529B2/en not_active Expired - Fee Related
- 2006-07-19 CN CN201410128975.2A patent/CN103869614A/zh active Pending
- 2006-07-19 CN CN201110409304XA patent/CN102520580A/zh active Pending
- 2006-07-19 CN CNA2006800312810A patent/CN101253449A/zh active Pending
- 2006-07-19 JP JP2007533133A patent/JP4600477B2/ja not_active Expired - Fee Related
- 2006-07-19 WO PCT/JP2006/314291 patent/WO2007026475A1/ja active Application Filing
- 2006-07-19 KR KR1020077028891A patent/KR100937264B1/ko active IP Right Grant
- 2006-07-26 TW TW095127314A patent/TW200712764A/zh not_active IP Right Cessation
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI401544B (zh) * | 2007-05-16 | 2013-07-11 | Tokuyama Corp | Photoresist |
Also Published As
Publication number | Publication date |
---|---|
KR100937264B1 (ko) | 2010-01-18 |
US8034529B2 (en) | 2011-10-11 |
CN103869614A (zh) | 2014-06-18 |
JPWO2007026475A1 (ja) | 2009-03-05 |
KR20080014025A (ko) | 2008-02-13 |
JP4600477B2 (ja) | 2010-12-15 |
TWI328717B (zh) | 2010-08-11 |
CN101253449A (zh) | 2008-08-27 |
US20090214979A1 (en) | 2009-08-27 |
CN102520580A (zh) | 2012-06-27 |
WO2007026475A1 (ja) | 2007-03-08 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TW200712764A (en) | Photosensitive resin composition and photosensitive element | |
TW200834240A (en) | Positive photosensitive resin composition | |
TW200641536A (en) | Positive resist composition and pattern-forming method using the same | |
TW200708896A (en) | Alkaline-developable photosensitive colored composition | |
TW200722926A (en) | Positive resist composition for immersion exposure and pattern-forming method using the same | |
WO2008096601A1 (ja) | 感光性ポリイミド樹脂組成物 | |
WO2008076148A3 (en) | Distortion estimation | |
TW200734818A (en) | Photosensitive resin composition | |
TW200604251A (en) | Positive photosensitive resin composition, method for producing patterns and electronic parts | |
ATE479071T1 (de) | Stellvorrichtung | |
WO2009040661A3 (en) | Thick film resists | |
FR2884618B1 (fr) | Dispositif limitant l'apparition d'artefacts de decodage pour gamma camera a masque code. | |
NZ598184A (en) | Composition for aqueous coating material and process for its production, and two-component curable aqueous coating material kit | |
TW200628974A (en) | Resist composition | |
DE602005011083D1 (de) | Positiv arbeitende strahlungsempfindliche Harzzusammensetzung | |
TWI263867B (en) | Positively photosensitive resin composition and method of pattern formation | |
TW200739265A (en) | Positive photoresist composition and method of forming photoresist pattern using the same | |
TW200738776A (en) | Phenol resin, process for producing thereof, epoxy resin and use thereof | |
TW200639187A (en) | Polymer, resist composition and patterning process | |
TW200702414A (en) | Photosensitive epoxy resin adhesive composition and use thereof | |
BRPI0705955A (pt) | composições de toner | |
MY167816A (en) | Positive photosensitive resin composition, cured film, protecting film, insulating film, and semiconductor device and display device using the same | |
TW200611894A (en) | Compound, polymer compound, positive resist composition, and method for forming resist pattern | |
TW200632550A (en) | Negative resist composition and process for forming resist pattern | |
TW200606587A (en) | Positive photoresist composition and resist pattern formation method |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |