TW200611894A - Compound, polymer compound, positive resist composition, and method for forming resist pattern - Google Patents

Compound, polymer compound, positive resist composition, and method for forming resist pattern

Info

Publication number
TW200611894A
TW200611894A TW094120312A TW94120312A TW200611894A TW 200611894 A TW200611894 A TW 200611894A TW 094120312 A TW094120312 A TW 094120312A TW 94120312 A TW94120312 A TW 94120312A TW 200611894 A TW200611894 A TW 200611894A
Authority
TW
Taiwan
Prior art keywords
compound
resist composition
positive resist
resist pattern
polymer compound
Prior art date
Application number
TW094120312A
Other languages
Chinese (zh)
Other versions
TWI305201B (en
Inventor
Toshiyuki Ogata
Syogo Matsumaru
Hideo Hada
Original Assignee
Tokyo Ohka Kogyo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Ohka Kogyo Co Ltd filed Critical Tokyo Ohka Kogyo Co Ltd
Publication of TW200611894A publication Critical patent/TW200611894A/en
Application granted granted Critical
Publication of TWI305201B publication Critical patent/TWI305201B/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
    • G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
    • G03F7/0397—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition the macromolecular compound having an alicyclic moiety in a side chain
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
    • C07C69/00—Esters of carboxylic acids; Esters of carbonic or haloformic acids
    • C07C69/74—Esters of carboxylic acids having an esterified carboxyl group bound to a carbon atom of a ring other than a six-membered aromatic ring
    • C07C69/757—Esters of carboxylic acids having an esterified carboxyl group bound to a carbon atom of a ring other than a six-membered aromatic ring having any of the groups OH, O—metal, —CHO, keto, ether, acyloxy, groups, groups, or in the acid moiety
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/10—Esters
    • C08F220/26—Esters containing oxygen in addition to the carboxy oxygen
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
    • C07C2603/00—Systems containing at least three condensed rings
    • C07C2603/56—Ring systems containing bridged rings
    • C07C2603/58—Ring systems containing bridged rings containing three rings
    • C07C2603/70—Ring systems containing bridged rings containing three rings containing only six-membered rings
    • C07C2603/74—Adamantanes
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
    • C07C2603/00—Systems containing at least three condensed rings
    • C07C2603/56—Ring systems containing bridged rings
    • C07C2603/90—Ring systems containing bridged rings containing more than four rings
    • C07C2603/91—Polycyclopentadienes; Hydrogenated polycyclopentadienes

Landscapes

  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Organic Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Materials For Photolithography (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)

Abstract

A positive resist composition, which can favorably develop a resist pattern with good resolution by using an acid generator that generates acid whose strength is week, are provided. The positive resist composition of the present invention includes a polymer including constitutional unit (a1) represented by a general formula (II) and an acid generator (B) that generates acid on exposure.
TW094120312A 2004-06-21 2005-06-17 Compound, polymer compound, positive resist composition, and method for forming resist pattern TWI305201B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004182299A JP2006001907A (en) 2004-06-21 2004-06-21 Compound, polymer, positive resist composition, and resist pattern formation method

Publications (2)

Publication Number Publication Date
TW200611894A true TW200611894A (en) 2006-04-16
TWI305201B TWI305201B (en) 2009-01-11

Family

ID=35509602

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094120312A TWI305201B (en) 2004-06-21 2005-06-17 Compound, polymer compound, positive resist composition, and method for forming resist pattern

Country Status (3)

Country Link
JP (1) JP2006001907A (en)
TW (1) TWI305201B (en)
WO (1) WO2005123655A1 (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4738803B2 (en) * 2004-12-14 2011-08-03 東京応化工業株式会社 Polymer compound, positive resist composition, and resist pattern forming method
JP4191150B2 (en) 2005-02-16 2008-12-03 東京応化工業株式会社 Positive resist composition and resist pattern forming method
JP4684740B2 (en) * 2005-05-19 2011-05-18 東京応化工業株式会社 Positive resist composition and resist pattern forming method
JP2006330180A (en) * 2005-05-24 2006-12-07 Tokyo Ohka Kogyo Co Ltd Positive photoresist composition, thick film photoresist laminated body, method for manufacturing thick film resist pattern, and method for manufacturing connecting terminal
JP4925954B2 (en) * 2007-07-20 2012-05-09 東京応化工業株式会社 Positive resist composition and resist pattern forming method
JP2009053688A (en) * 2007-07-30 2009-03-12 Fujifilm Corp Positive resist composition and pattern forming method

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1130864A (en) * 1997-07-10 1999-02-02 Fuji Photo Film Co Ltd Positive photoresist composition for exposure to far uv ray
JP2002182393A (en) * 2000-10-04 2002-06-26 Jsr Corp Radiation sensitive resin composition

Also Published As

Publication number Publication date
WO2005123655A1 (en) 2005-12-29
TWI305201B (en) 2009-01-11
JP2006001907A (en) 2006-01-05

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