TW200707765A - Structure and method of fabricating high-density, trench-based non-volatile random access SONOS memory cells for SOC applications - Google Patents

Structure and method of fabricating high-density, trench-based non-volatile random access SONOS memory cells for SOC applications

Info

Publication number
TW200707765A
TW200707765A TW095112633A TW95112633A TW200707765A TW 200707765 A TW200707765 A TW 200707765A TW 095112633 A TW095112633 A TW 095112633A TW 95112633 A TW95112633 A TW 95112633A TW 200707765 A TW200707765 A TW 200707765A
Authority
TW
Taiwan
Prior art keywords
trench
memory cells
density
random access
volatile random
Prior art date
Application number
TW095112633A
Other languages
English (en)
Chinese (zh)
Inventor
Herbert L Ho
Jack A Mandelman
Tak H Ning
Yoichi Otani
Original Assignee
Ibm
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibm filed Critical Ibm
Publication of TW200707765A publication Critical patent/TW200707765A/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B43/00—EEPROM devices comprising charge-trapping gate insulators
    • H10B43/30—EEPROM devices comprising charge-trapping gate insulators characterised by the memory core region
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B43/00—EEPROM devices comprising charge-trapping gate insulators
    • H10B43/30—EEPROM devices comprising charge-trapping gate insulators characterised by the memory core region
    • H10B43/35—EEPROM devices comprising charge-trapping gate insulators characterised by the memory core region with cell select transistors, e.g. NAND
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B43/00—EEPROM devices comprising charge-trapping gate insulators
    • H10B43/40—EEPROM devices comprising charge-trapping gate insulators characterised by the peripheral circuit region
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B69/00—Erasable-and-programmable ROM [EPROM] devices not provided for in groups H10B41/00 - H10B63/00, e.g. ultraviolet erasable-and-programmable ROM [UVEPROM] devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/60—Insulated-gate field-effect transistors [IGFET]
    • H10D30/69—IGFETs having charge trapping gate insulators, e.g. MNOS transistors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/60—Insulated-gate field-effect transistors [IGFET]
    • H10D30/69—IGFETs having charge trapping gate insulators, e.g. MNOS transistors
    • H10D30/693—Vertical IGFETs having charge trapping gate insulators
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C16/00—Erasable programmable read-only memories
    • G11C16/02—Erasable programmable read-only memories electrically programmable
    • G11C16/04—Erasable programmable read-only memories electrically programmable using variable threshold transistors, e.g. FAMOS
    • G11C16/0466—Erasable programmable read-only memories electrically programmable using variable threshold transistors, e.g. FAMOS comprising cells with charge storage in an insulating layer, e.g. metal-nitride-oxide-silicon [MNOS], silicon-oxide-nitride-oxide-silicon [SONOS]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D89/00—Aspects of integrated devices not covered by groups H10D84/00 - H10D88/00
    • H10D89/10—Integrated device layouts

Landscapes

  • Non-Volatile Memory (AREA)
  • Semiconductor Memories (AREA)
TW095112633A 2005-04-12 2006-04-10 Structure and method of fabricating high-density, trench-based non-volatile random access SONOS memory cells for SOC applications TW200707765A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/907,686 US7816728B2 (en) 2005-04-12 2005-04-12 Structure and method of fabricating high-density trench-based non-volatile random access SONOS memory cells for SOC applications

Publications (1)

Publication Number Publication Date
TW200707765A true TW200707765A (en) 2007-02-16

Family

ID=37082387

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095112633A TW200707765A (en) 2005-04-12 2006-04-10 Structure and method of fabricating high-density, trench-based non-volatile random access SONOS memory cells for SOC applications

Country Status (6)

Country Link
US (2) US7816728B2 (cg-RX-API-DMAC7.html)
EP (1) EP1869709A4 (cg-RX-API-DMAC7.html)
JP (1) JP5241485B2 (cg-RX-API-DMAC7.html)
CN (1) CN101147263A (cg-RX-API-DMAC7.html)
TW (1) TW200707765A (cg-RX-API-DMAC7.html)
WO (1) WO2006110781A2 (cg-RX-API-DMAC7.html)

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Also Published As

Publication number Publication date
US20080057647A1 (en) 2008-03-06
WO2006110781A2 (en) 2006-10-19
US20060226474A1 (en) 2006-10-12
CN101147263A (zh) 2008-03-19
US7807526B2 (en) 2010-10-05
EP1869709A4 (en) 2008-07-16
JP5241485B2 (ja) 2013-07-17
WO2006110781A3 (en) 2007-04-19
US7816728B2 (en) 2010-10-19
EP1869709A2 (en) 2007-12-26
JP2008536336A (ja) 2008-09-04

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