TW200706632A - ThermoplastIC resin composition for semiconductor, adhesive film, lead frame or semiconductor device compirisng the same, and method for manufacture of semiconductor device using the same - Google Patents

ThermoplastIC resin composition for semiconductor, adhesive film, lead frame or semiconductor device compirisng the same, and method for manufacture of semiconductor device using the same

Info

Publication number
TW200706632A
TW200706632A TW095126400A TW95126400A TW200706632A TW 200706632 A TW200706632 A TW 200706632A TW 095126400 A TW095126400 A TW 095126400A TW 95126400 A TW95126400 A TW 95126400A TW 200706632 A TW200706632 A TW 200706632A
Authority
TW
Taiwan
Prior art keywords
semiconductor
adhesive film
semiconductor device
lead frame
thermoplastic resin
Prior art date
Application number
TW095126400A
Other languages
English (en)
Chinese (zh)
Other versions
TWI320053B (enExample
Inventor
Kiyohide Tateoka
Toshiyasu Kawai
Yoshiyuki Tanabe
Tomohiro Nagoya
Naoko Tomoda
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Publication of TW200706632A publication Critical patent/TW200706632A/zh
Application granted granted Critical
Publication of TWI320053B publication Critical patent/TWI320053B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J179/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09J161/00 - C09J177/00
    • C09J179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C09J179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/02—Polyamines
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1057—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain
    • C08G73/106—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain containing silicon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/14—Polyamide-imides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/35—Heat-activated
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2479/00—Presence of polyamine or polyimide
    • C09J2479/08—Presence of polyamine or polyimide polyimide
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24942—Structurally defined web or sheet [e.g., overall dimension, etc.] including components having same physical characteristic in differing degree
    • Y10T428/2495—Thickness [relative or absolute]
    • Y10T428/24959—Thickness [relative or absolute] of adhesive layers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2852—Adhesive compositions
    • Y10T428/2896—Adhesive compositions including nitrogen containing condensation polymer [e.g., polyurethane, polyisocyanate, etc.]

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Die Bonding (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
TW095126400A 2005-07-20 2006-07-19 ThermoplastIC resin composition for semiconductor, adhesive film, lead frame or semiconductor device compirisng the same, and method for manufacture of semiconductor device using the same TW200706632A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005209920 2005-07-20
JP2005251907 2005-08-31

Publications (2)

Publication Number Publication Date
TW200706632A true TW200706632A (en) 2007-02-16
TWI320053B TWI320053B (enExample) 2010-02-01

Family

ID=37668780

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095126400A TW200706632A (en) 2005-07-20 2006-07-19 ThermoplastIC resin composition for semiconductor, adhesive film, lead frame or semiconductor device compirisng the same, and method for manufacture of semiconductor device using the same

Country Status (6)

Country Link
US (1) US7843045B2 (enExample)
JP (1) JP4900244B2 (enExample)
KR (1) KR20080020691A (enExample)
MY (1) MY140876A (enExample)
TW (1) TW200706632A (enExample)
WO (1) WO2007010902A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI387066B (zh) * 2007-03-01 2013-02-21 日東電工股份有限公司 熱硬化型黏晶膜

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8404564B2 (en) * 2007-04-06 2013-03-26 Hitachi Chemical Company, Ltd. Adhesive film for semiconductor, composite sheet, and method for producing semiconductor chip using them
JP5125702B2 (ja) * 2008-04-07 2013-01-23 株式会社デンソー 電子装置の製造方法
US9486879B2 (en) * 2010-11-22 2016-11-08 Dowa Electronics Materials Co., Ltd. Bonding material and bonding body, and bonding method
US10224258B2 (en) * 2013-03-22 2019-03-05 Applied Materials, Inc. Method of curing thermoplastics with microwave energy
WO2018022680A1 (en) 2016-07-28 2018-02-01 3M Innovative Properties Company Segmented silicone polyamide block copolymers and articles containing the same
CN109476815B (zh) 2016-07-28 2021-05-04 3M创新有限公司 分段有机硅聚酰胺嵌段共聚物和包含其的制品
KR101949015B1 (ko) * 2017-04-14 2019-04-29 (주)휴이노베이션 성형용 이형 필름
KR101966958B1 (ko) * 2018-09-07 2019-04-09 (주)아이피아이테크 반도체 패키지용 폴리이미드 필름

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5212279A (en) * 1990-10-22 1993-05-18 Hitachi Chemical Co., Ltd. Hot-melt adhesive and its use in polyimide film and printed circuit board
JPH05105850A (ja) * 1991-10-16 1993-04-27 Sumitomo Bakelite Co Ltd エレクトロニクス用接着テープ
JPH10330616A (ja) 1997-05-30 1998-12-15 Hitachi Chem Co Ltd 耐熱樹脂ペースト
JP3702593B2 (ja) 1997-08-05 2005-10-05 宇部興産株式会社 フッ素含有ポリイミド、基板積層体およびポリアミック酸溶液
JP4272406B2 (ja) * 2002-10-29 2009-06-03 三井化学株式会社 感光性樹脂組成物、ドライフィルム及びそれを用いた加工品
JP2005209920A (ja) 2004-01-23 2005-08-04 Casio Micronics Co Ltd プリント配線基板、その製造方法および製造装置、配線回路パターン、ならびにプリント配線板
JP4477381B2 (ja) 2004-03-03 2010-06-09 株式会社リコー レーザダイオード駆動回路
JP4332084B2 (ja) * 2004-07-15 2009-09-16 三井化学株式会社 Ｎ−アルキル置換アミノフェノール類の製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI387066B (zh) * 2007-03-01 2013-02-21 日東電工股份有限公司 熱硬化型黏晶膜

Also Published As

Publication number Publication date
KR20080020691A (ko) 2008-03-05
US7843045B2 (en) 2010-11-30
JPWO2007010902A1 (ja) 2009-01-29
JP4900244B2 (ja) 2012-03-21
TWI320053B (enExample) 2010-02-01
WO2007010902A1 (ja) 2007-01-25
US20090091012A1 (en) 2009-04-09
MY140876A (en) 2010-01-29

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