DE602005009273D1 - Epoxidharzzusammensetzung für Halbleitereinkapselung und daraus hergestellter Halbleiter - Google Patents

Epoxidharzzusammensetzung für Halbleitereinkapselung und daraus hergestellter Halbleiter

Info

Publication number
DE602005009273D1
DE602005009273D1 DE200560009273 DE602005009273T DE602005009273D1 DE 602005009273 D1 DE602005009273 D1 DE 602005009273D1 DE 200560009273 DE200560009273 DE 200560009273 DE 602005009273 T DE602005009273 T DE 602005009273T DE 602005009273 D1 DE602005009273 D1 DE 602005009273D1
Authority
DE
Germany
Prior art keywords
epoxy resin
resin composition
semiconductor
encapsulation
made therefrom
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE200560009273
Other languages
English (en)
Inventor
Takahiro Uchida
Masato Shimizu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Denko Corp
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Publication of DE602005009273D1 publication Critical patent/DE602005009273D1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/621—Phenols
    • A—HUMAN NECESSITIES
    • A23—FOODS OR FOODSTUFFS; TREATMENT THEREOF, NOT COVERED BY OTHER CLASSES
    • A23N—MACHINES OR APPARATUS FOR TREATING HARVESTED FRUIT, VEGETABLES OR FLOWER BULBS IN BULK, NOT OTHERWISE PROVIDED FOR; PEELING VEGETABLES OR FRUIT IN BULK; APPARATUS FOR PREPARING ANIMAL FEEDING- STUFFS
    • A23N15/00—Machines or apparatus for other treatment of fruits or vegetables for human purposes; Machines or apparatus for topping or skinning flower bulbs
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D3/00—Cutting work characterised by the nature of the cut made; Apparatus therefor
    • B26D3/24—Cutting work characterised by the nature of the cut made; Apparatus therefor to obtain segments other than slices, e.g. cutting pies
    • B26D3/26—Cutting work characterised by the nature of the cut made; Apparatus therefor to obtain segments other than slices, e.g. cutting pies specially adapted for cutting fruit or vegetables, e.g. for onions
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C08G59/686—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing nitrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49579—Lead-frames or other flat leads characterised by the materials of the lead frames or layers thereon
    • H01L23/49582—Metallic layers on lead frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y10T428/31529—Next to metal

Landscapes

  • Chemical & Material Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Forests & Forestry (AREA)
  • Mechanical Engineering (AREA)
  • Food Science & Technology (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
DE200560009273 2004-03-31 2005-03-31 Epoxidharzzusammensetzung für Halbleitereinkapselung und daraus hergestellter Halbleiter Active DE602005009273D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004105688 2004-03-31

Publications (1)

Publication Number Publication Date
DE602005009273D1 true DE602005009273D1 (de) 2008-10-09

Family

ID=34880075

Family Applications (1)

Application Number Title Priority Date Filing Date
DE200560009273 Active DE602005009273D1 (de) 2004-03-31 2005-03-31 Epoxidharzzusammensetzung für Halbleitereinkapselung und daraus hergestellter Halbleiter

Country Status (9)

Country Link
US (1) US20050221094A1 (de)
EP (1) EP1582546B1 (de)
KR (1) KR100769792B1 (de)
CN (1) CN100567436C (de)
AT (1) ATE406399T1 (de)
DE (1) DE602005009273D1 (de)
MY (1) MY136908A (de)
SG (1) SG115811A1 (de)
TW (1) TWI324619B (de)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7990727B1 (en) * 2006-04-03 2011-08-02 Aprolase Development Co., Llc Ball grid array stack
TW200831583A (en) * 2006-09-29 2008-08-01 Nippon Catalytic Chem Ind Curable resin composition, optical material, and method of regulating optical material
JP5711076B2 (ja) 2011-08-10 2015-04-30 日東電工株式会社 光半導体装置用エポキシ樹脂組成物およびそれを用いた光半導体装置
US8872358B2 (en) * 2012-02-07 2014-10-28 Shin-Etsu Chemical Co., Ltd. Sealant laminated composite, sealed semiconductor devices mounting substrate, sealed semiconductor devices forming wafer, semiconductor apparatus, and method for manufacturing semiconductor apparatus
US8796049B2 (en) * 2012-07-30 2014-08-05 International Business Machines Corporation Underfill adhesion measurements at a microscopic scale
WO2017099193A1 (ja) * 2015-12-11 2017-06-15 日本化薬株式会社 エポキシ樹脂組成物、エポキシ樹脂組成物成型体、硬化物および半導体装置
WO2018034856A1 (en) * 2016-08-19 2018-02-22 Dow Global Technologies Llc Epoxy resin compositions containing an internal mold release agent

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2708191B2 (ja) * 1988-09-20 1998-02-04 株式会社日立製作所 半導体装置
JPH09208805A (ja) * 1994-11-09 1997-08-12 Nitto Denko Corp 光半導体素子封止用エポキシ樹脂組成物
JP3261907B2 (ja) * 1994-12-02 2002-03-04 信越化学工業株式会社 半導体封止用エポキシ樹脂組成物及び半導体装置
JPH09316177A (ja) * 1996-05-31 1997-12-09 Sumitomo Bakelite Co Ltd 半導体封止用エポキシ樹脂組成物
JPH10158474A (ja) * 1996-12-03 1998-06-16 Hitachi Chem Co Ltd 光半導体素子封止用エポキシ樹脂組成物、及び該エポキシ樹脂組成物を用いて封止された光半導体装置
US6291704B1 (en) * 1998-01-20 2001-09-18 Alliedsignal Inc. Polymerizable halogenated vinyl ethers
JPH11228788A (ja) * 1998-02-16 1999-08-24 Nitto Denko Corp 半導体装置及び半導体封止用エポキシ樹脂組成物
JP3851441B2 (ja) * 1998-04-23 2006-11-29 日東電工株式会社 光半導体素子封止用エポキシ樹脂組成物及び光半導体装置
JP2000103938A (ja) * 1998-09-25 2000-04-11 Matsushita Electric Works Ltd 封止用のエポキシ樹脂組成物および半導体装置
JP2002220511A (ja) * 2001-01-25 2002-08-09 Matsushita Electric Works Ltd 封止用エポキシ樹脂組成物及び半導体装置
JP4092890B2 (ja) * 2001-05-31 2008-05-28 株式会社日立製作所 マルチチップモジュール
JP2004059700A (ja) * 2002-07-26 2004-02-26 Matsushita Electric Works Ltd 封止用エポキシ樹脂組成物及び半導体装置

Also Published As

Publication number Publication date
TWI324619B (en) 2010-05-11
KR20060045026A (ko) 2006-05-16
KR100769792B1 (ko) 2007-10-25
EP1582546A1 (de) 2005-10-05
MY136908A (en) 2008-11-28
SG115811A1 (en) 2005-10-28
EP1582546B1 (de) 2008-08-27
CN1676565A (zh) 2005-10-05
ATE406399T1 (de) 2008-09-15
CN100567436C (zh) 2009-12-09
TW200538480A (en) 2005-12-01
US20050221094A1 (en) 2005-10-06

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