TW200637666A - Substrate processing equipment - Google Patents

Substrate processing equipment

Info

Publication number
TW200637666A
TW200637666A TW095107164A TW95107164A TW200637666A TW 200637666 A TW200637666 A TW 200637666A TW 095107164 A TW095107164 A TW 095107164A TW 95107164 A TW95107164 A TW 95107164A TW 200637666 A TW200637666 A TW 200637666A
Authority
TW
Taiwan
Prior art keywords
substrate
air knife
equipment
exhaust port
substrate processing
Prior art date
Application number
TW095107164A
Other languages
English (en)
Other versions
TWI285136B (en
Inventor
Takao Matsumoto
Satoshi Yamamoto
Original Assignee
Dainippon Screen Mfg
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dainippon Screen Mfg filed Critical Dainippon Screen Mfg
Publication of TW200637666A publication Critical patent/TW200637666A/zh
Application granted granted Critical
Publication of TWI285136B publication Critical patent/TWI285136B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H01L21/02052—Wet cleaning only
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Nonlinear Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Optics & Photonics (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Cleaning In General (AREA)
TW095107164A 2005-03-30 2006-03-03 Substrate processing equipment TWI285136B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005097719A JP4494269B2 (ja) 2005-03-30 2005-03-30 基板処理装置

Publications (2)

Publication Number Publication Date
TW200637666A true TW200637666A (en) 2006-11-01
TWI285136B TWI285136B (en) 2007-08-11

Family

ID=37030120

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095107164A TWI285136B (en) 2005-03-30 2006-03-03 Substrate processing equipment

Country Status (4)

Country Link
JP (1) JP4494269B2 (zh)
KR (1) KR100770503B1 (zh)
CN (1) CN100440446C (zh)
TW (1) TWI285136B (zh)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4730286B2 (ja) * 2006-11-24 2011-07-20 トヨタ自動車株式会社 異物除去装置および異物除去方法
KR101043830B1 (ko) * 2008-11-12 2011-06-22 주식회사 엘지실트론 반도체 제조 설비
KR200452969Y1 (ko) * 2008-12-29 2011-04-04 주식회사 케이씨텍 대면적 기판의 건조장치
CN101697665B (zh) * 2009-11-06 2011-04-06 深南电路有限公司 用于加工电路板的热风整平机
CN102679696A (zh) * 2011-03-14 2012-09-19 无锡康力电子有限公司 超薄玻璃清洗后的干燥装置
DE102011109568A1 (de) * 2011-08-05 2013-02-07 Rena Gmbh Abluftsystem und Verfahren dazu
CN103851887B (zh) * 2012-12-07 2016-01-27 深南电路有限公司 Pcb干燥机
JP6259372B2 (ja) * 2014-07-31 2018-01-10 ＡｖａｎＳｔｒａｔｅ株式会社 ガラス基板の製造方法、及び、ガラス基板の製造装置
CN104442037B (zh) * 2014-11-29 2017-02-22 河南国花彩印包装有限公司 一种用于印刷机的封闭式除尘装置
JP6209572B2 (ja) * 2015-01-28 2017-10-04 芝浦メカトロニクス株式会社 基板処理装置
CN107008695A (zh) * 2016-01-28 2017-08-04 深圳长城开发科技股份有限公司 除尘装置
CN205692805U (zh) * 2016-05-09 2016-11-16 合肥鑫晟光电科技有限公司 基板处理设备
CN108074835A (zh) * 2016-11-09 2018-05-25 盟立自动化股份有限公司 湿式制程装置
CN107065433B (zh) * 2017-05-08 2021-01-26 京东方科技集团股份有限公司 干燥装置
CN106925568B (zh) * 2017-05-16 2019-12-06 捷开通讯(深圳)有限公司 粉尘自动清除装置及分板机
CN107144120B (zh) * 2017-05-19 2019-06-28 惠科股份有限公司 一种显示面板干燥装置
CN107388785A (zh) * 2017-07-28 2017-11-24 武汉华星光电技术有限公司 基板热干燥设备
JP2019042694A (ja) * 2017-09-05 2019-03-22 シャープ株式会社 基板処理装置
KR102399869B1 (ko) * 2019-09-12 2022-05-20 키오시아 가부시키가이샤 기판 처리 장치
CN110779320A (zh) * 2019-09-17 2020-02-11 苏州晶洲装备科技有限公司 一种新型风干系统及具有该系统的oled基板剥离设备
JP7055839B2 (ja) * 2020-06-25 2022-04-18 芝浦メカトロニクス株式会社 基板処理装置
JP7031831B1 (ja) 2021-03-16 2022-03-08 株式会社アルフテクノ 乾燥装置

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05296572A (ja) * 1992-04-24 1993-11-09 Nippon Upro Kk 給湯機の消音器構造
JP3526692B2 (ja) * 1995-07-21 2004-05-17 大日本スクリーン製造株式会社 基板の液切り装置
JPH11354487A (ja) * 1998-06-03 1999-12-24 Dainippon Screen Mfg Co Ltd 基板乾燥装置および基板乾燥方法
JP2000252254A (ja) * 1999-02-26 2000-09-14 Dainippon Screen Mfg Co Ltd 基板処理装置
JP2002022359A (ja) * 2000-07-07 2002-01-23 Matsushita Electric Ind Co Ltd 基板の乾燥装置
JP2002130756A (ja) * 2000-10-24 2002-05-09 Yoshinosuke Tabata 換気扇
JP2003017457A (ja) * 2001-07-03 2003-01-17 Dainippon Screen Mfg Co Ltd 基板洗浄方法及び装置
KR100432053B1 (ko) * 2001-07-05 2004-05-17 (주)케이.씨.텍 건조장치
JP3754905B2 (ja) * 2001-09-10 2006-03-15 東京エレクトロン株式会社 基板乾燥装置
KR100904278B1 (ko) * 2001-11-12 2009-06-25 도쿄엘렉트론가부시키가이샤 기판처리장치
JP3865717B2 (ja) * 2003-06-27 2007-01-10 東京応化工業株式会社 基板乾燥装置および基板乾燥方法
KR100527789B1 (ko) * 2003-07-08 2005-11-09 태화일렉트론(주) 엘씨디 패널 건조장치의 에어나이프 구조
JP2005071632A (ja) * 2003-08-25 2005-03-17 Fujitsu Hitachi Plasma Display Ltd プラズマディスプレイパネルの製造方法及びその装置
JP4152871B2 (ja) * 2003-12-03 2008-09-17 東京エレクトロン株式会社 ノズル及び基板処理装置

Also Published As

Publication number Publication date
TWI285136B (en) 2007-08-11
CN1840997A (zh) 2006-10-04
KR100770503B1 (ko) 2007-10-25
CN100440446C (zh) 2008-12-03
JP4494269B2 (ja) 2010-06-30
JP2006278859A (ja) 2006-10-12
KR20060106754A (ko) 2006-10-12

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees