TW200627064A - Photosensitive resin composition, method for preparating the same, and dry film resist comprising the same - Google Patents

Photosensitive resin composition, method for preparating the same, and dry film resist comprising the same

Info

Publication number
TW200627064A
TW200627064A TW094142171A TW94142171A TW200627064A TW 200627064 A TW200627064 A TW 200627064A TW 094142171 A TW094142171 A TW 094142171A TW 94142171 A TW94142171 A TW 94142171A TW 200627064 A TW200627064 A TW 200627064A
Authority
TW
Taiwan
Prior art keywords
resin composition
photosensitive resin
same
dry film
film resist
Prior art date
Application number
TW094142171A
Other languages
English (en)
Other versions
TWI310880B (en
Inventor
In-Ho Yoon
Bong-Gi Kim
Chang-Seok Rho
Sang-Ki Kang
Kyung-Rock Byun
Chan-Seok Park
Original Assignee
Dongjin Semichem Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dongjin Semichem Co Ltd filed Critical Dongjin Semichem Co Ltd
Publication of TW200627064A publication Critical patent/TW200627064A/zh
Application granted granted Critical
Publication of TWI310880B publication Critical patent/TWI310880B/zh

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0005—Production of optical devices or components in so far as characterised by the lithographic processes or materials used therefor
    • G03F7/0007—Filters, e.g. additive colour filters; Components for display devices
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/029—Inorganic compounds; Onium compounds; Organic compounds having hetero atoms other than oxygen, nitrogen or sulfur
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
TW094142171A 2004-11-30 2005-11-30 Photosensitive resin composition, method for preparating the same, and dry film resist comprising the same TWI310880B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020040099483A KR100599810B1 (ko) 2004-11-30 2004-11-30 감광성 수지 조성물, 이의 제조방법 및 이를 포함하는드라이 필름 레지스트

Publications (2)

Publication Number Publication Date
TW200627064A true TW200627064A (en) 2006-08-01
TWI310880B TWI310880B (en) 2009-06-11

Family

ID=36612045

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094142171A TWI310880B (en) 2004-11-30 2005-11-30 Photosensitive resin composition, method for preparating the same, and dry film resist comprising the same

Country Status (5)

Country Link
US (1) US20060141392A1 (zh)
JP (1) JP4628260B2 (zh)
KR (1) KR100599810B1 (zh)
CN (1) CN1782873B (zh)
TW (1) TWI310880B (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI409588B (zh) * 2010-09-07 2013-09-21 Daxin Materials Corp 感光性樹脂組成物

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KR100903356B1 (ko) 2003-05-07 2009-06-23 주식회사 동진쎄미켐 알칼리 가용성 감광성 수지 조성물 및 이를 이용한 드라이필름 레지스트
TWI290931B (en) * 2005-07-01 2007-12-11 Eternal Chemical Co Ltd Photoimageable composition
KR100648465B1 (ko) * 2005-09-30 2006-11-27 삼성전기주식회사 인쇄회로기판의 미세 회로 형성 방법
JPWO2008010400A1 (ja) * 2006-07-20 2009-12-17 コニカミノルタエムジー株式会社 感光性平版印刷版材料
KR101300006B1 (ko) * 2006-09-28 2013-08-26 주식회사 동진쎄미켐 전자 소자용 화합물 및 이를 포함하는 전자 소자
KR20090108781A (ko) * 2008-04-14 2009-10-19 주식회사 동진쎄미켐 흑색 도전성 페이스트 조성물, 이를 포함하는 전자파차폐용 필터 및 표시 장치
WO2011079187A1 (en) * 2009-12-23 2011-06-30 Momentive Performance Materials Inc. Network copolymer crosslinked compositions and products comprising the same
KR20120021488A (ko) * 2010-08-03 2012-03-09 주식회사 동진쎄미켐 네가티브 감광성 수지 조성물
TWI502031B (zh) * 2012-03-01 2015-10-01 Eternal Materials Co Ltd 抗蝕刻組成物及其應用
CN103048884A (zh) * 2012-12-05 2013-04-17 北京化工大学常州先进材料研究院 一种含有吖啶酮衍生物作为光引发剂的感光性组合物
JP6136414B2 (ja) * 2013-03-19 2017-05-31 日立化成株式会社 感光性樹脂組成物、感光性エレメント、レジストパターン付き基板の製造方法及びプリント配線板の製造方法
KR101895910B1 (ko) * 2016-01-19 2018-09-07 삼성에스디아이 주식회사 감광성 수지 조성물, 감광성 수지막 및 이를 포함하는 컬러필터
JP6701602B2 (ja) 2016-03-02 2020-05-27 株式会社リコー 活性エネルギー線硬化型組成物、硬化物、組成物収容容器、像形成装置、及び像形成方法
CN113741147A (zh) * 2021-09-22 2021-12-03 深圳惠美亚科技有限公司 一种具有高解析度和优异附着力的光致抗蚀剂
CN116836438B (zh) * 2023-07-11 2024-02-09 江西塔益莱高分子材料有限公司 一种pcb干膜树脂及其制备方法

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EP0627476B1 (en) * 1992-12-21 1999-08-04 Adell Co., Ltd. Photopolymerization initiator composition for visible ray polymerizable adhesive
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JP4096857B2 (ja) * 2003-09-30 2008-06-04 三菱化学株式会社 青紫色レーザー感光性画像形成材料、青紫色レーザー感光性画像形成材及び画像形成方法
KR101190921B1 (ko) * 2004-07-22 2012-10-12 도레이 카부시키가이샤 감광성 페이스트 및 디스플레이 패널용 부재의 제조 방법
JP4357392B2 (ja) * 2004-09-03 2009-11-04 富士フイルム株式会社 染料含有ネガ型硬化性組成物、カラーフィルタおよびその製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI409588B (zh) * 2010-09-07 2013-09-21 Daxin Materials Corp 感光性樹脂組成物

Also Published As

Publication number Publication date
JP4628260B2 (ja) 2011-02-09
TWI310880B (en) 2009-06-11
CN1782873A (zh) 2006-06-07
KR100599810B1 (ko) 2006-07-12
KR20060060419A (ko) 2006-06-05
US20060141392A1 (en) 2006-06-29
JP2006154825A (ja) 2006-06-15
CN1782873B (zh) 2010-07-07

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Legal Events

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MM4A Annulment or lapse of patent due to non-payment of fees