TW200628991A - Pattern-forming material, pattern-forming device and pattern-forming method - Google Patents

Pattern-forming material, pattern-forming device and pattern-forming method

Info

Publication number
TW200628991A
TW200628991A TW094146022A TW94146022A TW200628991A TW 200628991 A TW200628991 A TW 200628991A TW 094146022 A TW094146022 A TW 094146022A TW 94146022 A TW94146022 A TW 94146022A TW 200628991 A TW200628991 A TW 200628991A
Authority
TW
Taiwan
Prior art keywords
pattern
forming
forming material
sensitive layer
light
Prior art date
Application number
TW094146022A
Other languages
Chinese (zh)
Inventor
Masanobu Takashima
Kimi Ikeda
Original Assignee
Fuji Photo Film Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Photo Film Co Ltd filed Critical Fuji Photo Film Co Ltd
Publication of TW200628991A publication Critical patent/TW200628991A/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0005—Production of optical devices or components in so far as characterised by the lithographic processes or materials used therefor
    • G03F7/0007—Filters, e.g. additive colour filters; Components for display devices
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/031—Organic compounds not covered by group G03F7/029
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Engineering & Computer Science (AREA)
  • Architecture (AREA)
  • Structural Engineering (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Materials For Photolithography (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)

Abstract

The present invention provides pattern-forming material which is used for the purpose of forming a permanent pattern like as a solider resist and has good shape surface of resist obtained by using a high transparent substance as a support substance and is capable of forming a more highly fine pattern as well as to provide a pattern-forming device having said pattern-forming material, and a permanent pattern-forming method using the above pattern-forming material. Therefore, provided are a pattern-forming material characterized in that at least a light-sensitive layer is provided on a support with a haze value of less than 5.0%, in which the light - sensitive layer comprising at least a binder, a polymerizable compound, an optical polymerization initiator, a heat crosslinking agent and a hetero-condensed cyclic compound, as well as a pattern-forming device comprising said pattern-forming material and an pattern-forming method using said pattern-forming material and conducting exposure.
TW094146022A 2004-12-24 2005-12-23 Pattern-forming material, pattern-forming device and pattern-forming method TW200628991A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004374931A JP4583916B2 (en) 2004-12-24 2004-12-24 Pattern forming material, pattern forming apparatus and permanent pattern forming method

Publications (1)

Publication Number Publication Date
TW200628991A true TW200628991A (en) 2006-08-16

Family

ID=36601648

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094146022A TW200628991A (en) 2004-12-24 2005-12-23 Pattern-forming material, pattern-forming device and pattern-forming method

Country Status (5)

Country Link
JP (1) JP4583916B2 (en)
KR (1) KR20070085581A (en)
CN (1) CN101084470B (en)
TW (1) TW200628991A (en)
WO (1) WO2006068048A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI707203B (en) * 2015-03-31 2020-10-11 日商東京應化工業股份有限公司 Photosensitive resin composition for dry etching and method for producing resist pattern for dry etching

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007108172A1 (en) * 2006-03-16 2007-09-27 Fujifilm Corporation Photosensitive composition, photosensitive film, photosensitive layered product, method of forming permanent pattern, and printed wiring board
KR101110030B1 (en) * 2009-11-30 2012-02-29 전남대학교산학협력단 System and method for providing recommended words using context in a mobile communication terminal
KR101374373B1 (en) * 2011-05-12 2014-03-17 한국생산기술연구원 Composite sheet and substrate for display device using the same
KR101374372B1 (en) * 2011-05-12 2014-03-17 한국생산기술연구원 Composite sheet and substrate for display device using the same
CN108398748A (en) * 2011-12-29 2018-08-14 长泰品原电子科技有限公司 Fiber coupler and its male end and female end
CN103275627B (en) * 2013-05-23 2014-11-12 安徽溢彩玻璃器皿有限公司 Heat transfer printing adhesive for metal shell and preparation method thereof
JP6499568B2 (en) * 2015-11-30 2019-04-10 富士フイルム株式会社 Photosensitive composition, method for producing cured film, cured film, touch panel, and display device

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0628180B1 (en) * 1992-02-24 1998-09-16 E.I. Du Pont De Nemours And Company Pliable, aqueous processable, photoimageable permanent coatings for printed circuits
JPH10104831A (en) * 1996-10-02 1998-04-24 Mitsui Petrochem Ind Ltd Photosensitive resin composition
JPH1184650A (en) * 1997-09-03 1999-03-26 Hitachi Chem Co Ltd Photosensitive resin composition, photosensitive element and production of printed circuit board using that
JPH11240109A (en) * 1998-02-25 1999-09-07 Hitachi Chem Co Ltd Laminated film for forming permanent protecting coating film and manufacture of permanent protecting coating film using this laminated film
JP2000003039A (en) * 1998-06-16 2000-01-07 Fuji Photo Film Co Ltd Photosensitive resin composition, photosensitive element, insulating resin material, and production of multilayer interconnection board using the same
JP2000047381A (en) * 1998-07-02 2000-02-18 Morton Internatl Inc 1-part type optical-image forming composition for formation of solder mask
JP4389130B2 (en) * 1999-09-24 2009-12-24 日立化成工業株式会社 Photosensitive element, method for producing resist pattern using the same, and method for producing printed wiring board
JP2004006440A (en) * 2002-04-10 2004-01-08 Fuji Photo Film Co Ltd Laser apparatus, exposure head, and exposure device
WO2003085457A1 (en) * 2002-04-10 2003-10-16 Fuji Photo Film Co., Ltd. Exposure head, exposure apparatus, and its application
JP4279053B2 (en) * 2002-06-07 2009-06-17 富士フイルム株式会社 Exposure head and exposure apparatus
JP3852613B2 (en) * 2003-02-12 2006-12-06 三菱化学株式会社 Photosensitive composition, and image forming material, image forming material, and image forming method using the same
JP2004341478A (en) * 2003-04-25 2004-12-02 Hitachi Chem Co Ltd Photosensitive element, resist pattern forming method using the same, method for manufacturing printed circuit board and photosensitive resin composition
JP2004348114A (en) * 2003-04-28 2004-12-09 Hitachi Chem Co Ltd Photosensitive element, resist pattern forming method, and method for manufacturing printed wiring board
JP2004335639A (en) * 2003-05-06 2004-11-25 Fuji Photo Film Co Ltd Projection aligner
JP2006113402A (en) * 2004-10-15 2006-04-27 Hitachi Chem Co Ltd Photosensitive resin composition, photosensitive element, method for forming permanent protective film and printed wiring board

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI707203B (en) * 2015-03-31 2020-10-11 日商東京應化工業股份有限公司 Photosensitive resin composition for dry etching and method for producing resist pattern for dry etching

Also Published As

Publication number Publication date
KR20070085581A (en) 2007-08-27
WO2006068048A1 (en) 2006-06-29
JP2006184326A (en) 2006-07-13
CN101084470A (en) 2007-12-05
CN101084470B (en) 2012-03-21
JP4583916B2 (en) 2010-11-17

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