TW200627067A - Pattern-forming material, pattern-forming device, and pattern-forming method - Google Patents

Pattern-forming material, pattern-forming device, and pattern-forming method

Info

Publication number
TW200627067A
TW200627067A TW094141826A TW94141826A TW200627067A TW 200627067 A TW200627067 A TW 200627067A TW 094141826 A TW094141826 A TW 094141826A TW 94141826 A TW94141826 A TW 94141826A TW 200627067 A TW200627067 A TW 200627067A
Authority
TW
Taiwan
Prior art keywords
pattern
forming
forming material
binder
value
Prior art date
Application number
TW094141826A
Other languages
Chinese (zh)
Other versions
TWI460541B (en
Inventor
Hidenori Takahashi
Yuichi Wakata
Original Assignee
Fuji Photo Film Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Photo Film Co Ltd filed Critical Fuji Photo Film Co Ltd
Publication of TW200627067A publication Critical patent/TW200627067A/en
Application granted granted Critical
Publication of TWI460541B publication Critical patent/TWI460541B/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/46—Polymerisation initiated by wave energy or particle radiation
    • C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
    • C08F2/50—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light with sensitising agents
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0005—Production of optical devices or components in so far as characterised by the lithographic processes or materials used therefor
    • G03F7/0007—Filters, e.g. additive colour filters; Components for display devices
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Materials For Photolithography (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Polymerisation Methods In General (AREA)

Abstract

The purpose of the present invention is to provide a pattern-forming material which is excellent in resolution, tenting property, developing property and resist-stripping property by prescribing both the I/O value of the binder contained in the photosensitive layer and the glass transition temperature within a certain numeral range, a pattern-forming device having said pattern-forming material, and a pattern-forming method using the above pattern-forming material. Therefore, provided is a pattern-forming material characterized in that it has at least one photosensitive layer on a support, and said photosensitive layer comprises a binder, a polymerizable compound and a photopolymerization initiator, wherein said binder has an I/O value in the range of 0.300 to 0.650 and an acid value in the range of 130 to 250 (mgKOH/g). The binder contains a copolymer which preferably includes 30% by mass or more of a monomer which constitutes a homopolymer having a I/O value of 0.35 or less. Moreover, provided are a pattern-forming device having the above pattern-forming material and a pattern-forming method using the above pattern-forming material.
TW094141826A 2004-11-30 2005-11-29 Pattern-forming material, pattern-forming device, and pattern-forming method TWI460541B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004347638A JP4500657B2 (en) 2004-11-30 2004-11-30 Pattern forming material, pattern forming apparatus and pattern forming method

Publications (2)

Publication Number Publication Date
TW200627067A true TW200627067A (en) 2006-08-01
TWI460541B TWI460541B (en) 2014-11-11

Family

ID=36564966

Family Applications (2)

Application Number Title Priority Date Filing Date
TW094141826A TWI460541B (en) 2004-11-30 2005-11-29 Pattern-forming material, pattern-forming device, and pattern-forming method
TW102140681A TWI514076B (en) 2004-11-30 2005-11-29 Pattern-forming material, pattern-forming device, and pattern-forming method

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW102140681A TWI514076B (en) 2004-11-30 2005-11-29 Pattern-forming material, pattern-forming device, and pattern-forming method

Country Status (5)

Country Link
JP (1) JP4500657B2 (en)
KR (3) KR101516613B1 (en)
CN (1) CN101103310B (en)
TW (2) TWI460541B (en)
WO (1) WO2006059532A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI805865B (en) * 2019-03-22 2023-06-21 南韓商Ｌｇ化學股份有限公司 Stripper composition for removing photoresists and method for stripping photoresists using the same

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006208730A (en) * 2005-01-27 2006-08-10 Fuji Photo Film Co Ltd Pattern forming material, apparatus, and method
JP4942969B2 (en) * 2005-09-16 2012-05-30 富士フイルム株式会社 Pattern forming material and pattern forming method
TWI546574B (en) * 2011-06-01 2016-08-21 Jsr股份有限公司 Coloring composition, color filter and display element
CN103918021B (en) * 2012-09-18 2016-05-25 深圳市柔宇科技有限公司 Large scale display screen and manufacture method thereof
JP7308014B2 (en) * 2017-02-23 2023-07-13 旭化成株式会社 Photosensitive resin composition and photosensitive resin laminate
JP6968633B2 (en) * 2017-09-07 2021-11-17 東京応化工業株式会社 Photosensitive composition and photopolymerization initiator used therein
JP7327485B2 (en) * 2019-08-14 2023-08-16 株式会社レゾナック Photosensitive resin composition, photosensitive element, method for forming resist pattern, and method for producing printed wiring board
JP7437212B2 (en) * 2020-03-26 2024-02-22 株式会社オーク製作所 Exposure equipment and exposure method
KR102325273B1 (en) * 2021-05-07 2021-11-10 황록연 Method for manufacturing spacer in lens for camera and spacer manufacturing therefrom

Family Cites Families (13)

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Publication number Priority date Publication date Assignee Title
DE3931467A1 (en) * 1989-09-21 1991-04-04 Hoechst Ag POLYMERIZABLE MIXTURE BY RADIATION AND METHOD FOR PRODUCING A SOLDER STOP MASK
JPH04240854A (en) * 1991-01-25 1992-08-28 Hitachi Chem Co Ltd Photosensitive resin composition and photosensitive element using same
JPH07199458A (en) * 1993-07-22 1995-08-04 E I Du Pont De Nemours & Co Multilayer, optical-image-forming and aqueously processable element for printed circuit
JP3239881B2 (en) * 1998-11-16 2001-12-17 キヤノン株式会社 Optical system and projection device using the same
JP2001159817A (en) * 1999-12-03 2001-06-12 Hitachi Chem Co Ltd Photosensitive resin composition, photosensitive element using same, method for producing resist pattern and method for producing printed wiring board
JP2001318461A (en) * 2000-05-11 2001-11-16 Nichigo Morton Co Ltd Photosensitive resin composition and photosensitive film using the same
JP4096682B2 (en) * 2002-10-04 2008-06-04 三菱化学株式会社 Blue-violet laser photosensitive composition, and image forming material, image forming material, and image forming method using the same
JP4448707B2 (en) * 2003-02-06 2010-04-14 富士フイルム株式会社 Photosensitive planographic printing plate
JP4305732B2 (en) * 2003-04-17 2009-07-29 日立化成工業株式会社 Photosensitive resin composition, photosensitive element using the same, method for producing resist pattern, and method for producing printed wiring board
JP2004335639A (en) * 2003-05-06 2004-11-25 Fuji Photo Film Co Ltd Projection aligner
JP4244156B2 (en) * 2003-05-07 2009-03-25 富士フイルム株式会社 Projection exposure equipment
JP4450689B2 (en) * 2003-07-31 2010-04-14 富士フイルム株式会社 Exposure head
JP4708785B2 (en) * 2003-12-26 2011-06-22 富士フイルム株式会社 Image exposure method and apparatus

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI805865B (en) * 2019-03-22 2023-06-21 南韓商Ｌｇ化學股份有限公司 Stripper composition for removing photoresists and method for stripping photoresists using the same

Also Published As

Publication number Publication date
KR20130101590A (en) 2013-09-13
TWI514076B (en) 2015-12-21
JP2006154556A (en) 2006-06-15
TWI460541B (en) 2014-11-11
KR101516613B1 (en) 2015-05-04
CN101103310B (en) 2012-03-14
WO2006059532A1 (en) 2006-06-08
TW201407283A (en) 2014-02-16
KR20150009609A (en) 2015-01-26
CN101103310A (en) 2008-01-09
KR101528784B1 (en) 2015-06-15
KR20070084581A (en) 2007-08-24
KR101338091B1 (en) 2013-12-06
JP4500657B2 (en) 2010-07-14

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