DE602005014007D1 - Lichtempfindliche harzzusammensetzung und lichtempfindlicher trockener film durch verwendung davon - Google Patents

Lichtempfindliche harzzusammensetzung und lichtempfindlicher trockener film durch verwendung davon

Info

Publication number
DE602005014007D1
DE602005014007D1 DE602005014007T DE602005014007T DE602005014007D1 DE 602005014007 D1 DE602005014007 D1 DE 602005014007D1 DE 602005014007 T DE602005014007 T DE 602005014007T DE 602005014007 T DE602005014007 T DE 602005014007T DE 602005014007 D1 DE602005014007 D1 DE 602005014007D1
Authority
DE
Germany
Prior art keywords
light
resin composition
dry film
sensitive
photosensitive resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE602005014007T
Other languages
English (en)
Inventor
Teruhiro Uematsu
Naoya Katsumata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Ohka Kogyo Co Ltd
Original Assignee
Tokyo Ohka Kogyo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Ohka Kogyo Co Ltd filed Critical Tokyo Ohka Kogyo Co Ltd
Publication of DE602005014007D1 publication Critical patent/DE602005014007D1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/031—Organic compounds not covered by group G03F7/029
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/46—Polymerisation initiated by wave energy or particle radiation
    • C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
    • C08F2/50—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light with sensitising agents
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
    • Y10S430/1053—Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
    • Y10S430/1055—Radiation sensitive composition or product or process of making
    • Y10S430/106—Binder containing
    • Y10S430/111—Polymer of unsaturated acid or ester
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
    • Y10S430/146—Laser beam

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Materials For Photolithography (AREA)
  • Polymerisation Methods In General (AREA)
  • Non-Silver Salt Photosensitive Materials And Non-Silver Salt Photography (AREA)
  • Photometry And Measurement Of Optical Pulse Characteristics (AREA)
DE602005014007T 2004-11-25 2005-11-22 Lichtempfindliche harzzusammensetzung und lichtempfindlicher trockener film durch verwendung davon Active DE602005014007D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004340886A JP4315892B2 (ja) 2004-11-25 2004-11-25 感光性樹脂組成物、およびこれを用いた感光性ドライフィルム
PCT/JP2005/021939 WO2006057423A2 (en) 2004-11-25 2005-11-22 Photosensitive resin composition and photosensitive dry film by the use thereof

Publications (1)

Publication Number Publication Date
DE602005014007D1 true DE602005014007D1 (de) 2009-05-28

Family

ID=36498365

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602005014007T Active DE602005014007D1 (de) 2004-11-25 2005-11-22 Lichtempfindliche harzzusammensetzung und lichtempfindlicher trockener film durch verwendung davon

Country Status (9)

Country Link
US (1) US7662541B2 (de)
EP (1) EP1825328B1 (de)
JP (1) JP4315892B2 (de)
KR (1) KR20070070238A (de)
CN (1) CN101124517B (de)
AT (1) ATE428957T1 (de)
DE (1) DE602005014007D1 (de)
TW (1) TWI307344B (de)
WO (1) WO2006057423A2 (de)

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Publication number Priority date Publication date Assignee Title
JP4942969B2 (ja) * 2005-09-16 2012-05-30 富士フイルム株式会社 パターン形成材料及びパターン形成方法
JP5023878B2 (ja) * 2006-08-11 2012-09-12 住友化学株式会社 重合性樹脂組成物
JP5293934B2 (ja) * 2007-06-13 2013-09-18 Ｊｓｒ株式会社 着色層形成用感放射線性組成物、カラーフィルタおよびカラー液晶表示素子
JP5546801B2 (ja) * 2008-06-10 2014-07-09 富士フイルム株式会社 紫外光レーザー露光用感光性樹脂組成物、パターン形成方法、その方法を用いて製造したカラーフィルタ、カラーフィルタの製造方法および液晶表示装置
WO2009154194A1 (ja) * 2008-06-18 2009-12-23 日立化成工業株式会社 感光性樹脂組成物、並びにこれを用いた感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造法
JP2010266768A (ja) * 2009-05-18 2010-11-25 Sanyo Chem Ind Ltd 感光性樹脂組成物
JP2011064749A (ja) * 2009-09-15 2011-03-31 Dnp Fine Chemicals Co Ltd 感光性着色組成物
TWI556958B (zh) * 2010-09-14 2016-11-11 東京應化工業股份有限公司 基質劑及含嵌段共聚物之層的圖型形成方法
KR101548412B1 (ko) 2012-12-28 2015-08-28 코오롱인더스트리 주식회사 드라이 필름 포토 레지스트용 감광성 수지 조성물
JP6079277B2 (ja) * 2013-02-04 2017-02-15 日本ゼオン株式会社 感放射線樹脂組成物及び電子部品
US10392458B2 (en) * 2013-07-08 2019-08-27 Lg Chem, Ltd. Resin blend
JP2015152854A (ja) * 2014-02-18 2015-08-24 旭化成イーマテリアルズ株式会社 感光性樹脂組成物、感光性樹脂積層体及びレジストパターン形成方法
JP6361191B2 (ja) * 2014-03-14 2018-07-25 日立化成株式会社 感光性樹脂組成物、感光性エレメント、レジストパターンの形成方法及びタッチパネルの製造方法
CN103923449B (zh) * 2014-04-04 2016-08-24 广州市聚赛龙工程塑料股份有限公司 激光直接成型的pc/abs复合材料及制备方法和应用
TWI647532B (zh) * 2014-07-01 2019-01-11 南韓商東友精細化工有限公司 光敏樹脂組成物
CN108227379A (zh) * 2017-12-11 2018-06-29 珠海市能动科技光学产业有限公司 一种含有纤维素材料的干膜光阻剂
US11343918B2 (en) * 2017-12-20 2022-05-24 Sumitomo Electric Industries, Ltd. Method of making printed circuit board and laminated structure
WO2021036538A1 (zh) * 2019-08-29 2021-03-04 浙江福斯特新材料研究院有限公司 一种感光性树脂组合物及其应用
JP7495477B2 (ja) * 2020-03-19 2024-06-04 富士フイルム株式会社 転写フィルム、感光性材料、パターン形成方法、回路基板の製造方法、タッチパネルの製造方法
EP4151410A1 (de) * 2021-09-17 2023-03-22 Arkema France Lichtempfindliche zusammensetzung

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US3479185A (en) * 1965-06-03 1969-11-18 Du Pont Photopolymerizable compositions and layers containing 2,4,5-triphenylimidazoyl dimers
US3873319A (en) * 1974-01-31 1975-03-25 Minnesota Mining & Mfg Dry-film negative photoresist having amidized styrene-maleic anhydride binder material
US4459349A (en) * 1981-03-27 1984-07-10 Toyo Boseki Kabushiki Kaisha Photosensitive resin composition
US4410621A (en) 1981-04-03 1983-10-18 Toyo Boseki Kabushiki Kaisha Photosensitive resin containing a combination of diphenyl-imiazolyl dimer and a heterocyclic mercaptan
JPS5956403A (ja) * 1982-09-27 1984-03-31 Mitsubishi Chem Ind Ltd 光重合性組成物
JPS61172139A (ja) * 1985-01-25 1986-08-02 Fuji Photo Film Co Ltd 光重合性組成物
US5034429A (en) * 1987-06-03 1991-07-23 Hitachi Chemical Co., Ltd. Photopolymerizable composition
CA2015894A1 (en) 1989-05-30 1990-11-30 Mohammad Z. Ali High sensitivity photopolymerizable compositions containing hydrogen donating mercaptans
KR100644847B1 (ko) * 1999-02-26 2006-11-13 쇼와 덴코 가부시키가이샤 칼라필터용 광중합 개시제, 감광성 착색 조성물 및 칼라필터
KR100728520B1 (ko) * 1999-08-27 2007-06-14 도요 잉키 세이조 가부시끼가이샤 컬러필터 및 컬러 액정 디스플레이 디바이스
TWI251123B (en) * 1999-09-17 2006-03-11 Hitachi Chemical Co Ltd Photosensitive resin composition, photosensitive element using the resin composition, method of manufacturing resist pattern, and method of manufacturing printed wiring board
CN1126005C (zh) * 1999-12-30 2003-10-29 奇美实业股份有限公司 感光性树脂组成物
TWI255393B (en) 2000-03-21 2006-05-21 Hitachi Chemical Co Ltd Photosensitive resin composition, photosensitive element using the same, process for producing resist pattern and process for producing printed wiring board
TWI240149B (en) * 2000-06-22 2005-09-21 Hitachi Chemical Co Ltd Photosensitive resin composition, photosensitive element comprising the same, process for producing resist pattern, and process for producing printed circuit board
US6716897B2 (en) * 2000-12-22 2004-04-06 Toyo Ink Mfg. Co., Ltd. Colored composition for color filter and color filter
JP2002220409A (ja) * 2001-01-29 2002-08-09 Showa Denko Kk 光重合性組成物及びドライフィルム、それらを用いたプリント配線板の製造方法
AU2002255353A1 (en) * 2001-05-15 2002-11-25 Showa Denko K. K. Photosensitive coloring compositon, color filter using the compositon and method of producing the same
AU2003224454A1 (en) * 2002-02-28 2003-09-09 Showa Denko K.K. Thiol compound, photopolymerization initiator composition and photosensitive composition
JP2004198542A (ja) * 2002-12-16 2004-07-15 Showa Denko Kk カラーフィルターブラックマトリックスレジスト組成物及びその組成物に用いる感光性組成物
JP2004317850A (ja) * 2003-04-17 2004-11-11 Hitachi Chem Co Ltd 感光性樹脂組成物、これを用いた感光性エレメント、レジストパターンの製造方法およびプリント配線板の製造方法
JP4208145B2 (ja) * 2004-11-12 2009-01-14 富士フイルム株式会社 パターン形成用組成物、パターン形成材料、及びパターン形成装置並びにパターン形成方法
JP2007086165A (ja) 2005-09-20 2007-04-05 Fujifilm Corp 感光性組成物、これを用いた平版印刷版原版及び画像記録方法

Also Published As

Publication number Publication date
TWI307344B (en) 2009-03-11
JP2006153984A (ja) 2006-06-15
EP1825328B1 (de) 2009-04-15
ATE428957T1 (de) 2009-05-15
CN101124517B (zh) 2011-04-13
EP1825328A2 (de) 2007-08-29
US7662541B2 (en) 2010-02-16
WO2006057423A3 (en) 2007-09-27
WO2006057423A2 (en) 2006-06-01
KR20070070238A (ko) 2007-07-03
TW200628496A (en) 2006-08-16
JP4315892B2 (ja) 2009-08-19
CN101124517A (zh) 2008-02-13
US20070292804A1 (en) 2007-12-20

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