TWI251123B - Photosensitive resin composition, photosensitive element using the resin composition, method of manufacturing resist pattern, and method of manufacturing printed wiring board - Google Patents

Abstract

A photosensitive resin composition containing (A) a binder polymer, (B1) a photopolymerizable compound having at least one polymerizable cyclic ether group in the molecule, and (C1) a photo-acid generator, a photosensitive resin composition containing (A) a binder polymer, (B2) a photopolymerizable compound having at least one polymerizable ethylenically unsaturated group in the molecule, and (C1) a photo-acid generator, and a photosensitive resin composition containing (A) a binder polymer, (B1) a photopolymerizable compound having at least one polymerizable cyclic ether group in the molecule, (B2) a photopolymerizable compound having at least one polymerizable ethylenically unsaturated group in the molecule, and (C2) a radical polymerization initiator are disclosed. Moreover, a photosensitive element using the photosensitive resin composition, a method of manufacturing a resist pattern, and a method of manufacturing a printed wiring board are also disclosed.

Description

1251123 Ministry of Economic Affairs, Intellectual Property Office, Staff and Consumers Co., Ltd. Printed by A7 B7 V. Inventive Description (1) [Technical Field] The present invention relates to a photosensitive resin composition, a photosensitive member using the photosensitive resin composition, and a resist pattern Manufacturing method, and manufacturing method of printed circuit board. [Background Art] In the field of manufacturing printed circuit boards, as a resist material for etching, plating, or the like, a photosensitive resin composition and a photosensitive composition thereof and a support and a protective film are widely used. Sexual components. The printed circuit board is formed by laminating a photosensitive element on a steel substrate, removing the hardened portion by a developing solution after pattern exposure, and then performing etching or plating to form a pattern, and then peeling off the hardened portion from the substrate. . With regard to photosensitive elements, with the recent increase in the density of printed circuit boards, the requirements for high resolution and high adhesion have been increasing. On the other hand, from the viewpoint of improving the operation efficiency, a photosensitive resin composition having high sensitivity and low plating bath contamination is expected, which is related to the type and amount of the light initiator used. A light-initiating agent having a high sensitivity, which is described in German Patent No. 2,027,467, European Patent Publication No. n.786, European Patent Publication No. 220, European Patent Publication No. 589, and Sakamoto Kaiping Although it is described in the publication No. 6-69631, these have a tendency to be contaminated by an electroplating bath. Others, for the light-initiating agent, the light-initiating agent 2,4,5_triphenyl-mercapone is combined with the hydrogen atom supply source compound to obtain a high sensitivity--------- - II (Please read the notes on the back and fill out this page). This paper size is suitable for the home (CNS) A4 specification (21Q x 297 public) 1 311830 1251123 A7 V. Invention description (2) Photoreactive resin The composition is as described in the specification of U.S. Patent No. 3,479 & No, J, 4/y, 185, but to adjust the sensitivity to the required hemorrhoids < madness, right 2, 4, 5_ If the amount of triphenylimidazole dimer used is increased, then the resist film is safe. Please read the back note and fill in this page. The line width of the etched pattern is thicker, if the hydrogen atom is supplied. When the amount of the compound used is increased, there is a problem that the adhesion to the steel & and the preservation stability is inferior. X, if you consider the use of 2,4,5_triptyl imidazole dimers and highly reactive ethylene-saturated people (for example, polyethylene glycol dimethyl acrylate series, etc.) It is foreseen that its resistance is significantly degraded. [Disclosure of the Invention] The object of the present invention is to provide a photosensitive m-product having low contamination of an electric ore bath, such as excellent resolution, adhesion, sensitivity, and peeling characteristics. Further, the objective is to provide an excellent photosensitive element such as resolution, adhesion, sensitivity, peeling characteristics, low electric bell pollution, operational efficiency, and production efficiency. Still another object is to provide a method of producing resolution, adhesion, and sensitivity: peeling characteristics, low t-bell contamination, operational efficiency, and production efficiency = superior anti-surname pattern. In addition, the purpose is to provide a printed circuit board manufacturing method that provides excellent resolution, print adhesion, sensitivity, peeling characteristics, low plating bath contamination, operational efficiency, and production efficiency of the Intellectual Property Office of the Ministry of Economic Affairs. . According to a first aspect of the present invention, there is provided a photopolymerizable compound comprising: (A) a binder polymer, (B1) having at least one polymerizable cyclic ether group in the molecule, and (C1) photoacid generation A photosensitive resin composition prepared by the agent. According to a second aspect of the present invention, there is provided a Chinese National Standard (CNS) A4 specification (A) comprising: (A) a binder polymer, (B2) having at least one polymerizable ethylenic unsaturated paper in the molecule ( 21〇X 297 公公) 2 311830 1251123 Employees' Sales Agency A7 5. Invention Description (Photosensitive polymer composition based on photopolymerizable compound and (C1) photoacid generator. According to the present invention In three aspects, there is provided a photopolymerizable compound containing: (A) a binder polymer, (B1) having at least one polymerizable cyclic ether group in the molecule, and (B2) having at least one polymerizable group in the molecule. A photosensitive resin composition produced by a photopolymerizable compound of an ethylenically unsaturated group and a (C2) radical polymerization initiator. According to another aspect of the present invention, there is provided a resin composition of the present invention. A photosensitive element formed on a support by a resist layer. According to still another aspect of the present invention, there is provided a method of producing an anti-surname film pattern comprising the following steps: ^ 0 by the photosensitive method of the present invention a resist layer made of a resin composition forms a photosensitive element on a support, and a step of laminating the resist layer on the surface of the circuit formation substrate on the circuit formation substrate; a step of irradiating the cover pattern with active light, or direct scanning exposure by laser to harden the exposed portion of the resist layer; and forming a resist pattern by removing the unexposed portion of the resist layer by development According to still another aspect of the present invention, there is provided a method of producing a printed circuit board comprising the steps of: ???) forming an anti-money agent layer made of the green-sensitive resin composition of the present invention on a support The photosensitive element is laminated on the circuit board having the processing layer on the surface to make the above-mentioned resist layer adhere to the above-mentioned circuit. The paper scale is suitable for use. 3 3Π330- Ministry of Economic Affairs Intellectual Property Bureau employee consumption cooperative 1251123 A7

V. INSTRUCTION DESCRIPTION (4) a step of laminating the surface of the layer to be processed for forming the substrate; Π) irradiating with the active light by the mask pattern, or directly scanning and exposing with a laser to photoharden the exposed portion of the anti-surname film layer a step of forming a resist pattern by removing the unexposed portion of the resist layer by development; 1V) using the resist pattern as a mask, and processing the substrate for forming the circuit The layer is etched or subjected to selective electroplating on the layer being processed. [Brief Description of the Drawing] Fig. 1 is a schematic view showing an embodiment of a photosensitive element. Figs. 2A to 2C are schematic views showing the steps of a method of manufacturing a resist pattern. Figs. 3A to 3C and Figs. 4A to 4D are diagrams showing the steps of a method of manufacturing a printed circuit board. BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, embodiments of the present invention will be described in detail. In the following description, (meth)acrylic means acrylic acid and its corresponding methacrylic acid, and (mercapto) acrylate means acrylate and its corresponding methyl acrylate acid, and The propylene fluorenyl group means an acryl fluorenyl group and its corresponding mercapto acryl fluorenyl group. The photosensitive resin of the present invention has three separate features. That is, the first feature is that it contains (A) a binder polymer, (B1) a photopolymerizable compound having at least one polymerizable cyclic ether group in the molecule, and (C1) a photoacid generator. Producer. The second feature is that it contains: (eight (please read the notes on the back and fill out this page)

This paper scale is applicable to China National Standard (CNS) A4 specification (210 X 297 mm). 4 311830 1251123 A7 --------- V. Description of invention (5) (Please read the notes on the back and fill in the form. (B2) A binder polymer (B2) produced by having at least one polymerizable ethylenic acid: a saturated photopolymerizable compound and (C1) a photoacid generator. The third feature is characterized by comprising: (A) a binder polymer, (B1) a photopolymerizable compound having at least one polymerizable cyclic ether group in the molecule, and (B2) having at least one polymerizable ethyl group in the molecule. A photopolymerizable compound having an unsaturated group and a (C2) radical polymerization initiator are produced. According to the above feature, it is possible to provide a photosensitive resin composition which is excellent in resolution, adhesion, sensitivity, and peeling property and which is less polluting to the plating bath. According to the second feature described above, it is possible to provide a photosensitive resin composition having excellent adhesion, sensitivity, chemical resistance, and flexibility, and having low contamination of the plating bath. According to the third feature described above, it is possible to provide a photosensitive resin composition having excellent resolution, sensitivity, pattern shape, and peeling characteristics. The Ministry of Economic Affairs, the Intellectual Property Office, and the Employees' Cooperatives Co., Ltd. printed a free radical polymerization system with a binder molecule, a radical polymerizable compound, and a radical polymerization initiator, which is caused by the use of (B1) in the molecule. A photopolymerizable compound having at least one polymerizable cyclic ether group, the (B1) component can be used as a radical polymerizable plasticizer, and has a function of softening the entire system, which can be a resin composition which is particularly excellent in pattern shape, and Since the radical polymerization can be promoted without causing an increase in the crosslinking density, the effect of shortening the peeling time of the cured product can be obtained. On the other hand, with respect to the conventional radical polymerization system, since the photoacid generator of the (C1) component is used, since the radical generated from the (C1) component contributes to radical polymerization, sensitivity can be obtained. And a resin composition excellent in resolution. Furthermore, compared with the conventional radical polymerization system, since the (B1) component and the (C1) component are used, cationic polymerization occurs with radical polymerization, and the sensitivity of the tree can be obtained. The paper size is applicable to the Chinese national standard ( CNS) A4 specification (2_1g x 297 public) 5 311830 A7

Fat composition. 1251123 (Please read the precautions on the back and fill out this page.) As for the binder polymer of the above (A) component, for example, an acrylic resin, a stupid vinyl resin, an epoxy resin, or a amide amine tree can be mentioned. An amine epoxy resin, an alkyd resin, a phenol resin, or the like. From the viewpoint of being able to develop with an aqueous solution of an aqueous solution, an acrylic resin is preferred. These may be used singly or in combination of two or more. Further, these binder polymers may have a photosensitive group if necessary. The binder polymer can be produced, for example, by polymerizing a polymerizable monomer in a free radical. Examples of the polymerizable monomer include a polymerizable styrene derivative substituted with an α-position or an aromatic ring such as styrene, vinyl methyl or α-methylstyrene, and diacetone acrylamide. Ethyl alcohol esters such as acrylamide, acrylonitrile, ethylene n-butyl ether, alkyl (meth)acrylate, tetrahydrofurfuryl (meth)acrylate, dimethylamine ethyl (meth)acrylate , (meth) diethylaminoethyl acrylate, glycidyl (meth) acrylate, 2, 2, 2 _ Ministry of Economic Affairs Intellectual Property Bureau employee consumption cooperative printed difluoroethyl (meth) acrylate, 2, 2,3,3·tetrafluoropropyl (meth)acrylic acid vinegar, (meth)acrylic acid, α-bromine (meth)acrylic acid, α·gasification (meth)acrylic acid, β-furylyl (fluorenyl) a maleic acid monoester of acrylic acid, β-styryl (meth)acrylic acid, maleic acid, maleic anhydride, monomethyl maleate, monoethyl maleate, monoisopropyl maleate, etc. Fumaric acid, cinnamic acid, α-cyanocinnamic acid, itaconic acid, crotonic acid, propionic acid, and the like. These may be used singly or in combination of two or more. The above (meth)acrylic acid ketone vinegar can be exemplified, for example, the general formula (3): The paper size is applicable to the Chinese National Standard (CNS) A4 specification (210 X 297 mm) 6 311830

R6 CH2=C—COOR7 (3) 1251123 V. Description of the invention (wherein R6 represents a hydrogen atom or a methyl group, R7 represents a carbon number of 1 to an alkyl group), and the alkyl group of these compounds is via a hydroxyl group. Examples of the alkyl group having 1 to 12 carbon atoms represented by R7 in the above general formula (3), such as a methyl group, an ethyl group, a propyl group and a butyl group, may be mentioned. , pentyl, hexyl, octyl, decyl, decyl, undecyl, dodecyl, and the structure thereof. ^ The monomer represented by the above general formula (3), for example, (Sub) decyl acrylate, ethyl (meth) acrylate, propyl (meth) acrylate, butyl (meth) acrylate, amyl (meth) acrylate, hexyl (meth) acrylate, (A) Base)heptyl acrylate, octyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, decyl (meth) acrylate, decyl (meth) acrylate, (methyl) propyl hydride Undecyl ester, (decyl) decyl acrylate, etc. The binder of the (Α) component of the present invention may be alkaline The aqueous solution development, that is, from the viewpoint of lye development, is preferably yttrium-containing, and for example, a polymerizable monomer having a carboxyl group and another polymerizable monomer can be produced by radical polymerization. It is preferable to use a styrene and/or a styrene derivative as a polymerizable monomer, from the viewpoint of resolution and flexibility. When the styrene and/or stupid ethylene derivative is contained as a copolymerization component, in order to obtain good adhesion and peeling properties, the paper size is in the middle of the paper] (210 χ 297 gong·!) Pack---- ----tf· L----- (Please read the notes on the back and fill out this page) Printed by the Intellectual Property Office of the Intellectual Property Office of the Ministry of Economic Affairs 311830 1251123 A7 V. Inventions (8) The monomer (M to 30% by weight is preferably contained, and contains m by weight. / 〇 is preferable) and more preferably contains 5 to 27% by weight. When the content is less than 0.1% by weight, the adhesion is inferior. If it exceeds 3% by weight, the release sheet becomes large, and the peeling time tends to be long. The binder polymer of the component is preferably an alkali liquid developer. From this viewpoint, the acid value is preferably 30 to 5 〇〇 mg K 〇 H / g, and 1 to 500 mg KOH / g. Preferably, it is preferably 1 to 4 〇〇 mg K 〇 H / g and more preferably 100 to 2 〇〇 mg KOH / g. When the acid value is less than 3 〇 mg K 〇 H / g, the development time is longer. The tendency, if more than 5 〇〇 mgK 〇 H / g, there is a tendency for the anti-image liquid resistance of the anti-image film to be inferior after photohardening. The weight average molecular weight of the binder of the (A) component is Gel permeation chromatography (GPC), obtained by conversion of the calibration curve of standard polystyrene, is 20, 〇〇〇 to 3 〇〇, preferably ,, 3 〇〇〇〇 to 150, 〇〇〇 is better, preferably 40, 0 〇〇 to 1 〇〇〇 (10). When the weight average knife is less than 20,000, the liquid imaging resistance tends to be inferior, and when it exceeds 300,000, the development time tends to be long. When these binder polymers are used in combination of two or more kinds, for example, two or more kinds of binder polymers having different weight average molecular weights and two or more kinds of binder polymers having different degrees of dispersion may be mentioned. . Further, it is also possible to use a polymer having a multi-spike molecular weight distribution carried out by the Japanese Patent Publication No. JP-A-327137. Next, the above (B1) component will be explained. This (B1) component is used for the photosensitive resin composition of the present invention having the first feature and the third feature. Due to the inclusion of this component, it is possible to produce IIIIIIIIIII 11 with good sensitivity and pattern shape (please read the notes on the back and fill out this page) ----- ij------- Ministry of Economic Affairs Intellectual Property Bureau The employee consumption cooperative printed this paper scale applies the Chinese National Standard (CNS) A4 specification (210 297 297 mm) 8 311830 1251123 A7

§ A7 1251123 V. Description of the invention (l〇) aryl group of 6 to 18, (meth) propylene, styrene, amine, alkyl 1 to 10, ally The base group, the hydroxyl group, the number of carbon atoms, the base group of the base group, the base group, the carbon atom of the base group, the slow-chain alkyl group of the alkyl group, and the alkyl group having 1 to 1 carbon atom , the number of carbon atoms] to 20 alkoxy groups, alkoxy groups having 1 to 20 carbon atoms, alkyl groups having 2 to 1 carbon atoms, alkenyl groups having 2 to 10 carbon atoms, carbon A compound represented by an atomic number of 2 to 1 Å, an alkylamino group, or a heterocyclic group or an aryl group substituted with one or more substituents. Further, the hydrogen atom of the heterocyclic butadiene ring may be substituted by a gas atom or the like. These can be used alone in combination. X. The substituents in the above general formula (1) may be substituted by the above substituents such as a halogen atom, and the general formula (1) R 1 is a hydrogen atom and a carbon atom number of 1 to 2 Å. The base, the dilute propyl group, the anti-protocol number 6 to the cardinyl group or the group containing the hetero ring are preferred, and the group of (4) subunits 1 to 5 is preferred. In the general formula (1), R2 is a hydrogen atom, a carbon atom number to a base, a carbon atom number of 2 to 10, a carbon number of 2 to a heart: a base, a carbon number! The oxyoxy group to 20 or the number of carbon atoms is preferably an N-alkylamino group, and a hydrogen atom is preferred. - In the general formula (1), the south atom of the atom can be exemplified by fluorine, gas, and desert... Astatine 〇 八 (1) The atomic number of the atom is 〖2. The basics of the appearance can be enumerated, ._ί __ethyl, n-propyl i-isopropyl, n-butyl I0 (amendment page) 3Π830 1251123 A7 B7 V. Description of invention (11 Ministry of Economic Affairs Intellectual Property Bureau employee consumption cooperative Printing of primary butyl, secondary butyl, pentyl, isopentyl, neopentyl, hexyl, heptyl, octyl, decyl, fluorenyl, undecyl H group, thirteen alkyl, fourteen An alkyl group, a fifteen alkyl group, a hexadecyl group, a seventeenth base group, an octadecyl group, a nonadecyl group, an eicosyl group, and the isomers thereof, etc. The carbon atom in the general formula (1) The number of 3 to 1Q cycloalkyl groups may be, for example, lactic acid propyl, cyclobutyl, cyclopentyl, zebyl hexyl, cycloheptyl octyl, etc. The carbon number in the general formula (1) is 6 to The aryl group of 18, for example, JJ such as ★ phenyl, tolyl,: phenyl, biphenyl, naphthyl, anthracenyl, phenanthryl, etc., some of which may also have a halogen atom, an amine group, a nitro group a substituent such as a cyano group, a hydrogen 1 allyl group, and an alkyl group having 1 to 20 carbon atoms. The alkyl group having a carbon number of from 1 to 20 in the general formula (1) can be listed, for example, A. Alkylamino group, ethylamino group, propylamino group, isopropylamino group, etc. The dialkylamino group having 1 to 20 carbon atoms in the general formula (1) may, for example, be dimethylamine. a group, a diethylamino group, a dipropylamino group, a diisopropylamino group, etc., an alkylaminocarbyl group having 1 to 10 carbon atoms in the genus G), For example, methylaminomethyl hydrazino, ethylaminomethyl decyl, propylaminomethyl decyl, and the like. The hydroxyalkyl group having a carbon number of i to 2 () in the general formula (1) may, for example, be a hydroxymethyl 'hydroxyethyl group, a hydroxypropyl group, a hydroxyisopropyl group or a hydroxybutyl group. As the alkyl group in the general formula (1), the number of carbon atoms is from 1 to 1 hydroxy. The paper size is suitable for i?iiii^NS) A4 specification (2) 〇x 297 ^------- 311830 (please read first Precautions on the back of this page) 装--- tri^------- 1251123 Ministry of Economic Affairs Intellectual Property Bureau employee consumption cooperative printed 12 A7

5. Description of the Invention (U-alkyl group) may, for example, be a carboxymethyl group, a carboxyethyl group, a hydroxypropyl group, a carboxybutyl group or the like. The alkyl group in the general formula (1) has 1 to 10 carbon atoms. The alumina 1 is exemplified by, for example, a methyl group, an ethyl group, a propyl group, a butyl group, an isobutyric acid group, a pentamidine group, an isovaleryl group, a trimethylethenyl group, etc. In the general formula (1) The alkoxy group having 1 to 20 carbon atoms may, for example, be a methoxy group, an ethoxy group, a propoxy group, a butoxy group or the like. The alkoxy group having a carbon number of from 丨 to 20 in the general formula (1) The carbonyl group may, for example, be a methoxycarbonyl group, an ethoxycarbonyl group, a propoxycarbonyl group or a butoxycarbonyl group. The alkylcarbonyl group having 2 to 1 ring carbon atoms in the general formula (1) may be listed. The bovine is, for example, an 'ethyl group, a propyl group, a butylcarbonyl group or the like. The alkenyl group having 2 to 10 carbon atoms in the general formula (1) may, for example, be a 1-propenyl group or a 2-propylene group. 2, methacryl group, 2-methyl-2 propylene Lbutenyl group, 2-butenyl group, 3-butenyl group, etc. N-alkane having 2 to 1 Q carbon atoms in the general formula U) Aminomethylmercapto For example, an ethylaminomethyl fluorenyl group, a propylamino fluorenyl group, a butylaminomethyl fluorenyl group, a pentylaminomethyl fluorenyl group, etc. are mentioned. The group containing a heterogeneous group in the formula (1), that is, a derivative group derived from a heterocyclic compound, may be exemplified, for example, a miso, a sulphate, a pyrrolyl group, a thiazolyl group, a noisy group. , quinolyl and the like. More specifically, in the general formula (1), a compound of 'R1=ethyl group and R2=nitrogen atom (manufactured by East-West Synthetic Co., Ltd., product name OXT-101) 311830 < Note on this page)

1251123 A7 B7 Η3

V. Description of invention (13)

H3cr ><: ^OH Ο RL thiol, R2 = phenyl compound (Manufactured by East Asia Synthetic Co., Ltd., product name OXT > 211):

0, RL methyl, R2 = 2-ethylhexyl compound (manufactured by East Asia Synthetic Co., Ltd., product name OXT-212):

RL ethyl, R2 = methacryl fluorenyl compound (made by East Asia Synthetic Co., Ltd., product name 0XT-MA): (Please read the notes on the back and fill in this page) -丨装------ --订------- Ministry of Economic Affairs Intellectual Property Bureau employee consumption cooperative printed h3

ο 0 0

Ch2 ch3 Further, the above compound having two oxetane rings can be exemplified, for example, general formula (2): The paper size is applicable to the Chinese National Standard (CNS) A4 specification (210 X 297 mm) 13 311830 ( 2) 1251123 A7 V. Inventive Note (14) R> .R5 0 0 (wherein R3 represents a divalent organic group, R4 and R5 are respectively the same as R1 in the general formula (1)), and A compound represented by the formula (2 〇 0 (2a), (the type of R is the same as the inverse 3 in the above general formula (7), and V 乂 and R are the same as those of r4 and r5 in the above general formula (7)) In the general formula (2), the divalent organic group may, for example, be a linear or branched alkyl group having a carbon atom = 20, and (4) a linear or branched poly(carbon) group. (extended alkyloxy) group, linear or branched, and the number of carbon atoms of the hydrocarbon group, the base group, and the alkyl group having several groups of carbon atoms The m-based group: the alkyl group and the carbon atom of the stretching group are the alkyl group having an amine group of (9). The paper scale is applicable to the Chinese National Standard (CNS) A4. Grid (21〇χ 297 茇 茇 茇 中 中 中 中 中 中 中 中 中 中 中 中 中 中 中 中 中 中 中 中 中 中 中 中 中 中 中 中 中 中 中 中 中 中 中 中 中 中 中 中 中 中 中 297 The straight-chain or branched poly(extension-based oxy) group having a number of 1 to 6 may, for example, be 'poly(ethyleneoxy), poly(propyloxy), etc. linear or Examples of the branched unsaturated hydrocarbon group include, for example, _Ethyl group, extension 311830 1251123. 5. Description of the invention (15) Propenyl group, Field #T-based propylene group, Streptylene group, and then 'General formula (2) The base of the divalent organic group) to (16). A7

Can list the following

-CB

Ch2- (4) (wherein R8 is the same as R1 in the above general formula (1)) • CH2.

Ch2- o-ch2·

CH〇 (in the formula, m is a natural number of 1 to 1 ,, m (5) C, please read the back of the precautions and then fill out this page) Compounds can also be) —ch2

Furthermore, the numerical value of m is CHr-(6) different (wherein R9 represents an oxygen atom, a sulfur atom, a burning group, or a stretching-------------- Ministry of Economic Affairs, Intellectual Property Bureau, employee consumption cooperative, printing

This paper scale applies to China National Standard (CNS) A4 specification (210 X 297 mm) 15 311830 1251123

(In the formula, R1 is the same as r in the above general formula (1). 5. Inventive Note (6) (8) (wherein R11 is the same as R9 in the general formula (6))

R \2 (9) (wherein R12 is the same as R1 in the general formula (1) to 4 substituents), and may have 2 in the naphthalene ring.

R· (10) (wherein R13 is the same as four substituents in the general formula (1)) R1, and may have 2 nnnnnnnnn ϋ n I · ϋ n ϋ n I ϋ n in the naphthalene ring--- r----- (Please read the notes on the back and fill out this page) Printed by the Intellectual Property Office of the Ministry of Economic Affairs

This paper scale applies to the Chinese National Standard (CNS) A4 specification (210 X 297 mm Γ ~ 2

16 311830 1251123 A7 B7 V. Description of invention (17

(15)

-0CH2CHCH20-

(16) (In the formula, a natural compound of η is a natural number of 1 to 10, and a mixture of compounds having different values of η may be used.) Preferred compounds among the compounds having two oxetanyl rings are exemplified. For example, a compound represented by the following formulas (17) to (21) and the like. R.14

(17) ^--------^--------- (Please read the note on the back and then fill out this page) Ministry of Economic Affairs Intellectual Property Bureau employee cooperation cooperation printing, 14

(R14 is methyl or ethyl)

:〇

:〇 This paper size applies to the Chinese National Standard (CNS) A4 specification (210 X 297 public) (18) (19) 17 311830 milk 1123

(20) (21) Can be enumerated, 'Example: Take; = Compound with two oxetanyl rings

Compounds not listed (made by East Asian Synthetic Co., Ltd., the following formula: Product Name 221-221) 0

Ch3 (Please read the note on the back of the M and then fill out this page) --------Book ·------- The Ministry of Economic Affairs, Intellectual Property Bureau, employee consumption cooperatives, the compound expressed by Yu Binxing Production (stock) manufacturing, product name 〇xt_BT〇E), the following formula:

The compound represented (manufactured by Ube Industries, Ltd., product name OXT-BDOE), the following formula: This paper scale applies to the Chinese National Standard (CNS) A4 specification (210 X 297 mm) 18 311830 1251123 A7 B7 V. Description of invention (19)

H3C

〇 .α

...ch3 CT

The compound represented (manufactured by Ube Industries, Ltd., product name οχτ· DD0E), the following formula: h3c.

0H, 0, 〇"

Compound represented by OH j° and ch3 (manufactured by Hitachi Chemical Co., Ltd., sample name HM-20)

-0 ch3 Compound (Hitachi Chemical Industry Co., Ltd., sample name HM-23) The following formula: (Please read the back note and then fill out this page) -------- Printed by the Ministry of Economic Affairs Intellectual Property Bureau employee consumption cooperative

H3CN

CM cr "〇

, Compound represented by CHU (manufactured by Hitachi Chemical Co., Ltd., sample name HM-24). The above compound having 3 or 4 oxetane rings may, for example, be of the general formula (22): The paper size is applicable to the Chinese National Standard (CNS) A4 specification (210 X 297 mm) 19 311830 1251123

V. Description of the invention (2〇

R

15 (22) (In the formula, Ri is the same as r1 in the above general formula (1), and is shown to be 1 to "12-chain branched alkyl group, branched poly(alkylene) group" The compound represented by the formula 3 or 4), general formula (22a):

Or 〇15 (22a) (wherein R1 is the same as R1 of the above general formula (1), R3 is the same as R3 in the above general formula (2), and Rl5 is the same as in the above general formula (22) And j is the same as the compound in the above general formula, the general formula (22b): (Please read the back note and then fill out this page) · IIIIIII ill· — —! — —

J J2 Ministry of Economic Affairs Intellectual Property Bureau employee consumption cooperative printing clothing (where R1 is the same as R1 in the above general formula (1), R3 is the same as R3 in the above general formula (2), and the above general formula In (22), Ris is the same, and j 1 and j2 are individually 1, 2 or 3, and are selected from compounds which can be represented by j]+j 2 = 3 or 4. The above-mentioned general formula (22) has a carbon-chain number of 1 to 12, and the scale of the paper is applicable to the Chinese National Standard (CNS) A4 specification (210 X 297 mm). 20 311830 1251123 A7 B7 5. Invention Description (21 The base may, for example, be a group represented by the general formula (2 3): , 16 9η 2 · R-C-CH 2 -CH 2 - (23) (wherein R 10 is an alkyl group having 1 to 6 carbon atoms) , the following formula (24) and the following formula (25):

CHg~~~ ch2-c-ch2— CH (24) 2· CH2-CH2-CH-CH2~CH-CH2 -ch2- (25) (Please read the notes on the back and fill out this page) The base of the employee's consumption cooperative printing. The branched poly(alkyleneoxy) group in the above general formula (22) may, for example, be a general formula (26): CH2^OCH2CH2-^-^CH2CH20^~CH2-C-*CH2*~ CH3 (26) ^ocHgCHg·^~ (wherein 'p is independently an integer from 1 to 10). Preferred compounds among the compounds having 3 or 4 oxetane rings include, for example, the following formula (27): The paper scale is applicable to the Chinese national standard 21 311830 1251123 A7

The compound represented, the following formula:

The compound represented (manufactured by Hitachi Chemical Co., Ltd., HM-16). Further, the oxetane compound and the 10,000-tube tube may have a substituent, and examples of the substituents include those exemplified by R1 in the above formula (!). Wait. When these substituents are a plurality of substituents, most of the substituents may be the same or different. Further, in addition to the above oxetane compound, for example, a compound having a molecular weight of from 1,000 to 5,000 and having a molecular weight of from i to 4 or less. Further, the oxetane-containing polymer may also be used in the same manner as the cited iC.S at 〇, human iC a in eyamaand T. N ishikub 〇, Macr 〇in ο 1 ecu 1 es, 2 5 , 1 198 (1992), the polymerization of the oxetane ring in the side chain (please read the back of this page and fill out this page) · III — III ^ « — 111 — —-- Ministry of Economics The property bureau employee consumption cooperative printed this paper scale applicable to China National Standard (CNS) A4 specification (210 X 297 mm) 22 311830 1251123 A7

- Armored ------- - Order Stupid ί Please read the notes on the back and fill out this page}

Ministry of Economic Affairs, Intellectual Property Bureau, employee consumption cooperative, printing

This paper scale applies to the Chinese National Standard (CNS) A4 specification (210 x 297 mm). 311830 1251123 A7 Β7 V. Description of invention (24) Compound (manufactured by Kyoeisha Chemical Co., Ltd., product name Eporite 3002) . Second, explain the (B2) component. The (B2) component is used for the photosensitive resin composition of the present invention having the second and third features. Further, it can also be applied to the photosensitive resin composition of the present invention having the first feature. The sensitivity of the photosensitive resin composition of the present invention is further improved by the inclusion of the component. The Ministry of Economic Affairs, the Intellectual Property Office, the employee who consumes the photopolymerizable compound (B2) having at least one polymerizable ethylenic unsaturated group in the molecule, may be applied, for example, to a radical polymerizable person. A compound obtained by reacting an α,β-unsaturated carboxylic acid with a polyhydric alcohol, 2,2-bis(4-((meth)propenyloxypolyethoxy)phenyl)propene, 2,2-bis(4-((meth)propenyloxypolypropoxy)phenyl)propanol 2,2-bis(4-((methyl)propenyloxypolyethoxypolypropoxy) a compound of a fluorene-bonded (meth)acrylic acid compound, a compound obtained by reacting a, p-f saturated carboxylic acid with a glycidyl group-containing compound, having a urethane-bonded (meth)acrylic acid a urethane monomer such as an ester compound, a nonylphenyl-oxo-propane ring (fluorenyl) acrylate, 7-oxy-0-hydroxypropyl hydrazine, _(mercapto) propylene methoxyethyl phthalate Acid ester, hydroxyethyl hydrazine, methyl) propylene hydrazide ethyl phthalate, hydroxypropyl *_β, _(methyl) propylene methoxy Ethyl o-dicarboxylate, alkyl (meth)acrylate, and the like. Among them, from the viewpoint of sensitivity, resolution, and fine line adhesion of the photosensitive resin composition, a bisphenol fluorene (meth) acrylate compound or a (meth) acrylate having a urethane mouthwash is included. Compounds are preferred as essential components. These may be used singly or in combination of two or more. 311830 (Please read the note on the back and then fill out this page) This paper scale applies to China National Standard (CNS) A4 Regulations_21(21() χ公公爱) 1251123 A7 Ministry of Economic Affairs Intellectual Property Bureau Staff Consumer Cooperative Printed - ---------- B7 _ V. Inventive Note (25) "—" A compound obtained by reacting an unsaturated carboxylic acid with the above polyol can be enumerated, for example, Polyethylene glycol mono(meth)acrylates of 2 to 14 and polypropylene glycol di(meth)acrylic acid vinegar of 2 to 14 and trimethyl ketone Acrylate, trimethyl methacrylate tri(meth) acrylate, trimethylolpropane ethoxy tris(meth) acrylate vinegar, trimethylolpropane triethoxy tris (meth) acrylate vinegar毯三毯 methyl propane triethoxy tri(meth) acrylate, trimethylolpropane tetraethoxy (meth) acrylate, trimethylolpropane pentaethoxy tri(meth) acrylate , tetramethylolmethyltri(indenyl) acrylate, tetramethylolmethyltetra(meth)acrylate, dipentaerythritol (Meth) acrylate, dipentaerythritol hexa (meth) acrylate. The α,β-unsaturated carboxylic acid may, for example, be (meth)acrylic acid or the like. The above 2,2-bis(4-((meth)propenyloxypolyethoxy)phenyl)propane may, for example, be 2,2-bis(4-((meth)propenyloxy) Diethoxy)phenyl)propane, 2,2.bis(4-((meth)propenyloxytriethoxy)phenyl)propane' 2,2-bis(heart ((meth)propene) Decyloxytetraethoxy)phenyl)propane, 2,2-bis(4-((meth)propenyloxypentaethoxy)phenyl)propane, 2,2•bis (4 ((A) Acryloxy hexaethoxy)phenyl)propane, 2,2_bis(heart ((methyl) acryloxy)heptaethoxy)phenyl)propane, 2,2-bis ( ((Methylene) propylene methoxy octaethoxy) phenyl) propane, 2,2-bis(4-((methyl) propylene oxy) pentoxide) phenyl) propane, 2, 2- Bis(4-((meth)propenyloxy-l-ethoxy)phenyl)propane, etc., of which 2,2-bis(4-(f-propenylhydrazine|oxyheptaethoxy) can be obtained Phenylpropanone-500 (Xinzhongcun Chemical Industry Co., Ltd.)|

(Please read the notes on the back and fill out this page) ·*Install -----Book i — n n n

Nn I This paper scale applies to China National Standard (CNS) A4 specification (210 X 297 mm) 25 311830 1251123 A7 V. Invention description (26 ) — a manufacturing, product name) and FA-321M (Hitachi Chemical Industry Co., Ltd.) Manufacturing commercial products such as trade names). ° (Please read the precautions on the back and fill out this page.) The above 2,2-bis(4-((meth)acryloxypolyethoxypolypropoxy) phenyl) propyl group can be enumerated, Example *, 2, 2_ bis (4_((methyl)) adenine-oxydiethoxy octyloxy)phenyl)propane '2,2·bis(4_((methyl)propene oxime) Tetraethoxytetrapropoxy)phenyl)propane, 2,2-bis(4-((meth)propenyloxyhexaethoxyhexapropyloxy)phenyl)propane, etc. These can be used alone. Or a combination of two or more. The glycidyl group-containing compound may, for example, be monomethylolpropane triglycidyl ether tris(mercapto)acrylate, 2,2-bis(4-(methyl)propene.醯 -2- 羟基 羟基 -2- 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 a diisocyanate compound such as a base monomer and isophorol diisocyanate, 26 6 toluene monoisocyanate, 2,4-toluene diisocyanate, 1 ί 6-hexamethyl diisocyanate Addition reaction, ginseng ((meth) propylene oxime tetraethylene glycol isocyanate) hexamethylene methyl isocyanurate, ruthenium urethane di(meth) propylene oxime ester, Ρ0 modified Urethane di(meth)acrylate, hydrazine, hydrazine modified urethane di(meth) acrylate, etc. Further, the oxime 0 modified compound has an oxyethylene group structure. Further, Ρ0 indicates propylene oxide, and the ruthenium-modified compound has a block structure of an oxypropylene group. As the above-mentioned Ε0-modified urethane di(meth)acrylate, ρ〇-modified urethane (dimethyl) )Acrylate, and Ε0, Ρ〇 Ρ〇 尿 二 ( ( ( ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' 21G X 297 public) 26 311830 1251123 V. Description of invention (η J7 CH2===6lH Mine NH-Z—ΝΗ_” Section 9 C=CH2 〇(28) Ministry of Economic Affairs Intellectual Property Bureau employee consumption cooperative printing In the case, R17 and Ri8 add 丨y Ά ν. — individually show hydrogen atoms or methyl groups, X] individually Self-induced oxidized ethyl group: 2 to 16 _ followed by propylene oxide group, Ζ shows the number of carbon atoms ... and t individually shows the integer ... 0) jin represents the compound, etc. And, S and t 夂 Λ Λ and t When it is 2 or more, the t of 2 or more may be the same or different; when χ1 乂 is % ^ ^ U ^ , and the right is composed of an oxyalkylene group (oxidized B group and emulsified propyl group), the two kinds of X 】 and the two kinds of X, may exist randomly, or (four) paragraphs exist. t The general formula (28) of the modified urinary (methyl) bismuth acrylate can be listed, for example, Xinzhongcun Chemical Industrial (stock) manufacturing, product name UA_11 and so on. Further, EO and P〇 modified urethane di(meth)acrylate may, for example, be manufactured by Shin-Nakamura Chemical Industry Co., Ltd., product name ua_i3, or the like. Examples of the (meth)acrylic acid vinegar include methyl (meth)acrylate, ethyl (meth)acrylate, butylated (meth)acrylate, and 2-ethylhexyl (meth)acrylate. Next, explain the (C1) component. The (C1) component is used for the photosensitive resin composition of the present invention having the first feature and the second feature. By containing this component, the sensitivity and resolution of the photosensitive resin composition of the present invention can be further improved. As a (C 1) wounded photoacid generator, as long as it is light-produced --------tr (please read the back note before filling out this page) • IH ϋ IP I ϋ · This paper scale is applicable to China National Standard (CNS) A4 specification (210 X 297 male cage) 27 311830 1251123 A7 5. Invention description (28) Acidic 'electron pair receptors' can be used without special restrictions, such as Light or heat can produce carbocations. Can be used, for example, the initiator. Specifically, it can be exemplified that U can be used as a cationic polymerization sulfonium salt compound, an ammonium salt compound, for example, an iodine salt compound, a J3BL compound, an a sulfonium salt compound, an oxonium salt compound, a stimulating human salt compound. , 锑, etc., and among them, iodine salt compound, 毓:::: kicking salt compound is preferred. These can be used alone, Ge- or money salt compounds

I. The above-mentioned broken salt compound; I: upper:: used. Tetrafluoroborate, diphenyl iodine hexafluorophosphinic acid, _ + - cumyl iodine arsenate, diphenyl iodine hexafluoroantimonate, double (^4', - stupid iodine gun Hexafluoroiodo hexafluoroborate, bis(4,4,_third,4_t-butylphenyl), salt, bis(44丨·n= soil base) iodine hexafluorophosphinic acid Further (, 4 butyl-butyl butyl phenyl) iodonium hexafluoroarsenate II (〆 - second (4 4, -: m, "Bafeng iodine bismuth difluoroformate, double (4,4 di-butyl-butyl) iodonium trifluoride may be used, or two or more may be used in combination. 4. These may be salt alone, and may, for example, be a tribasic fluorinated tetrafluoro(tetra) salt or a fluorodecanoic acid. Salt, three stupid hexahydro citrate, triphenyl acetyl hexahydrate " oligos, triphenyl mirror trifluoro phthalate, etc. These may be used alone or in combination of two or more. The component (C2) is used for the photosensitive resin composition of the present invention having the third feature, and is also applicable to the photosensitivity of the present invention having the first feature and the second feature. Tree wax composition. Also 'The photosensitive resin composition of the present invention having the first feature and the second feature is a photo-acid generator having a component (C1) as an essential component, and the paper size is a national standard (C_NS) A4 specification (10) x 297发311830 !251123 Α7

The Ministry of Economic Affairs' Intellectual Property Office employee consumption cooperative prints a radical polymerization initiator containing (C2) component. If there is a cation and free radical initiator by light or heat, use this only. The agent can be. The sensitivity of the photosensitive resin composition of the present invention is further improved by the inclusion of the component. As the (C2) radical polymerization initiator, for example, dimercaptoketone, N,N,-tetramethyl-4,4,-diaminobenzophenone (Micylene), n , n, _ tetraethyl-4,4'-diaminobenzophenone, 4-methoxy-4, dimethylamino dibenzoyl, 2-benzyl-2-pyrene Amino group + (4 morpholinophenyl)_1: anthracene; 1,2-methyl-1-[4-(methylthio)phenyl-2-ylmorpholinyl-acetone, etc., 2-ethyl hydrazine, phenanthrenequinone, 2_t-butyl hydrazine, octamethyl hydrazine, 12-benzofluorene, 2,3-benzopyrene, 2-phenyl fluorene, 2, 3_Diphenyl hydrazine, 1-gas hydrazine, 2-methyl hydrazine, 1, n-naphthoquinone, 9,1 〇 phenanthrenequinone, 2-methylnaphthoquinone, 2,3-dimethylhydrazine Anthraquinones such as benzoin methyl ether and benzophenone: benzoin ethyl group test, benzoin test compound, etc., benzyl group derivatives such as benzylmethyl monomethyl alcohol, 2,4,5-triaryl tm η sit dimer, phenyl nitidine, 1,7-bis (9,9'-azidinyl) heptane, etc. - phenylglycine, Ν-phenylglycine derivative, coumarin compound, and the like. Further, the two 2,4,5-triarylimidazoles constituting the dimer may have the same aryl substituent, and different asymmetric compounds may also be used. Further, from the viewpoint of adhesion and sensitivity, it is more preferable to use 2,4,5-triarylmethine dimer. These may be used singly or in combination of two or more. As the above 2,4,5-triarylimidazole dimer, for example, 2,2-bis(2-phenylphenyl)-4,4',5,5,-tetraphenylbis-11 can be mentioned. Sit, 2, 2, - double (2,4_ --------------^---I----^--:------- (please read first Note on the back side of this page. This paper size applies to the Chinese National Standard (CNS) A4 specification (21〇x 297 mm茇) 29 311830 1251123

V. Description of the invention (3〇) t gas stupid tetraphenyl bis-i, 2, 2, _ bis (2,3 • di-benzene = (o-methoxy) phenyl double spider saliva, 2, 2' _Bis(2,3-diphenyl)·4,4,,5,5,_(o-methoxy)phenyl dimethine, 2,2,_bis (2,4_diphenyl) )_4,4,,5,5,_ = (o-decyloxy)phenyl dimethine, 2,2, bis(2,6_diphenyl)_4,4,,5,5,_ 肆(o-methoxy) stupid bis-pyrene, 2,2,-bis(2- phenyl)-4,4,5,5,·tetraphenylbis-salt, 2,2'-double ( 2,4-difluorophenyl)_4,4,,5,5,_tetraphenyl diamido 2,2-bis(2,3-difluorophenylhydrazine, 4,5,5'-four Phenylbiimidazole, 2,2,_bis(7)fluorophenyl)_4,41,5,5'-肆(o-methoxy)phenyl dimethine, π·bis(2,3-fluorophenyl) )_4,4',5,5'-肆(o-methoxy)phenylbisimidazole, 2,2,_bis(2,4-fluorophenyl)·4,4',5,5'-肆(o-methoxy) phenyldiimidazole, 2,2,-bis(2,6-difluorophenyl)-4,4',5,5'-fluorene (o-methoxy)phenylbisimidazole, 2,2,_ bis(2-bromophenyl)_4,4',5,5'-tetraphenyl bis-pyrene, 2,2,_bis(2,4-dibromophenyl) -4,4',5,5'-tetraphenylbisimidazole, 2,2,_bis(2,3-dibromophenyl)-4,4',5,5,·tetraphenylbisimidazole, etc. These may be used singly or in combination of two or more. As the sensitizer of the above (C2) radical polymerization initiator, there may be, for example, 7-amino-4·methylcoumarin '7-Dimethylamino _4_methylcoumarin, 7-diethylamino-mer methyl coumarin, 7-dimethylaminomethyl coumarin, 7-ethylamino group- 4-methylcoumarin, 7-didecylaminocyclopentyl [C]coumarin, 7-aminocyclopentyl[C]coumarin '7-diethylaminocyclopentyl[ C] coumarin, 4,6· dimethyl-7-ethylamino coumarin, 4,6-diethyl-7-ethylamino coumarin, 4,6-dimethyl- 7-Diethylamino coumarin, 4,6· dimethyl-7-dimethylamino coumarin, 4,6·diethyl-7·diethylamine {Please read the back Note: Please fill in this page) --------^---------. Ministry of Economic Affairs, Intellectual Property Office, Staff and Consumer Cooperatives, Printed Paper Scale Applicable to China National Standard (CNS) A4 Specification (210 X 297 mm) 30 311830 1251123 A7 V. Description of invention (3) ruthenium, 4,6-diethyl-7-dimethylamino coumarin, 4,6-dimethyl-7-ethylamine coumarin, etc. These may be used alone or in combination of two or more. (Please read the precautions on the back and fill out this page) and 'The above (C 1) photoacid generator can be used together as a sensitizer for 'for example, diethyl thiazolone, isopropyl thiazolone The thiazolone derivatives such as 蒽, 芘, phenoxyterazine and the like. These may be used alone or in combination of two or more. The amount of the above component (A) is 1 part by weight relative to the total amount of the component (A) and the component (B) ((β1) component + (B2) component), and the hardness of the photocured material is used as a photosensitive material. The coating property in the case of a sexual element is more than 4 parts by weight. From the viewpoint of sensitivity, it is preferably 80 parts by weight or less, and more preferably 45 to 60 parts by weight. The compounding amount of the above (B) component ((B1) component + (B2) component) is based on the same reason as described above, with respect to the total amount of (A) component and (B) component 1 〇〇 weight in the case of 20 It is preferably 60 parts by weight, more preferably 4 to 55 parts by weight. The Ministry of Economic Affairs Intellectual Property Office employee consumption cooperative printed the above (B) component in the component (B), from the point of view of the stripping time, at 5% by weight or more, from the viewpoint of sensitivity at 95% by weight. The following is preferred, preferably from 5 to 80% by weight, more preferably from 1 () to 5% by weight. The above-mentioned (B2) is in the form of the component (B). From the viewpoint of sensitivity, it is preferably at least 5% by weight in terms of 5 times or less from the viewpoint of peeling time, and preferably 20 to 5% by weight. 95% by weight is more preferred, and more preferably 5 () to 9% by weight. 311830 A7 1251123 V. INSTRUCTIONS (32) The compounding amount of (C) component ((C1) component + (C2) component) is 1 part by weight relative to the total amount of (a) component and (B) component. From the viewpoint of sensitivity, it is preferably 1 part by weight or less, more preferably 2 to 6 parts by weight, from the viewpoint of resolution. The component (C1) is contained in the component (C) in an amount of 10% by weight or more from the viewpoint of resolution and peeling characteristics, and preferably from 8 to 50% by weight from the viewpoint of sensitivity. The weight % is preferably more preferably from iq to 40% by weight. The component (C2) is contained in the component (C) in an amount of 20% by weight or more from the viewpoint of fine line adhesion, and preferably 90% by weight or less from the viewpoint of resolution and sensitivity. It is preferably from 9% to 90% by weight, more preferably from 6% to 90% by weight. In the photosensitive resin composition containing the above components, if necessary, it may be contained in an amount of from 0.01 to 20 parts by weight, such as malachite green, in an amount of 1 part by weight based on the total of the (Α) component and the (Β) component. Dye, tribromide phenyl colorless crystal violet, etc., hair coloring agent, thermal coloring preventive agent, plasticizer, pigment, filler, defoaming agent, flame retardant, stabilizer, etc. Adhesive imparting agent, flattening agent, peeling accelerator, antioxidant, perfume, image forming agent, thermal crosslinking agent, and the like. These may be used singly or in combination of two or more. The photosensitive resin composition according to the present invention may, if necessary, be methanol, ethanol, propanol, methyl ethyl alcohol, methyl cellosolve, ethyl cellosolve, toluene, hydrazine, hydrazine-dimethyl A solvent such as methotrexate or propylene glycol monomethyl ether or a mixed solvent thereof is dissolved in a solid content of 3 to 6 重量% by weight. The applicable standard is (CNS) A4 specification ( | 51 311830 (please Read the notes on the back and fill out this page} ----I---^---·------. Ministry of Economic Affairs Intellectual Property Bureau employee consumption cooperative printed 1251123 B7 V. Invention description (33) X It is used for coating. The use thereof is not particularly limited, and it can be coated with a liquid resist on a metal surface of copper, copper alloy, iron iron, gold or the like and dried, and if necessary, coated with a protective film. It is preferably used in the form of a photosensitive element. The thickness of the 7C resin composition layer after application is different depending on the application, and the thickness after drying is preferably from ～1 μ〇〇η. When it is coated with a liquid resist and coated with a protective film, it can be exemplified by polyethylene, polypropylene, etc. Polymer film. 0. Next, the photosensitive element of the present invention, that is, the photosensitive resin composition having the characteristics of the above-mentioned first, second, and third, is an anti-surname layer. The photosensitive element formed on the support body body is described with reference to the drawings. The schematic diagram of one embodiment of the photosensitive element: the type includes the support body U, and is formed thereon. Anti-fat silk layer) 12. Material support body η, can be used more than t: Yes, for example, polyethylene terephthalate vinegar, Ministry of Economic Affairs, Intellectual Property Bureau, employee consumption cooperation, printing of polyester, etc. Polymer film. The anti-deletion 12 is formed on the support: no special restrictions, as long as the photosensitive resin composition is applied to the cloth machine, CONMA is coated with the same type of machine, the CONMA (four) machine, the gravure coating machine, the air knife type coating Cloth machine, bar coater, etc. Drying can be used in 7〇 to 1 , the amount of solvent, in order to prevent the organic residue in the subsequent step, the amount of organic residue is preferably below. The diffusion of the organic refrigerant in the bomb is based on 2

This paper scale is based on the A4 specification (2$ x 297 public 1) for 311830 to 30 minutes. Further, in the anti-(tetra) antimony layer 12, ^ 5 33 1251123 A7 5. The invention (34) The thickness of the polymer film of the support n is preferably from 1 to ι 〇〇 μη. It is also possible to use one of these polymer films as a support for the anti-study layer, and another as a protective film for the resist layer to be laminated on both sides of the anti-surname layer. As the protective film, the adhesion between the anti-surname layer and the protective film is selected to be smaller than the adhesion between the resist layer and the support, and it is preferable that the film is less swollen. Further, although not shown, the photosensitive element may include an intermediate layer or a protective layer of a buffer layer, an adhesive layer, a light absorbing layer, a gas barrier layer or the like in addition to the resist layer, the support, and the protective film. The photosensitive element may be deposited, for example, directly or re-coated on the surface of the anti-agent layer with a protective film, and wound around a cylindrical reel for storage. Further, in this case, it is preferable that the support system is wound to the outside. The above-mentioned tubular end face of the prior-shaped 7G piece is preferably made of a moisture-proof end face separator from the viewpoint of end face protection. The method of packing is preferably carried out by using a black wrapper having a small moisture permeability. The above reel can be listed as a magical lift, for example, polyethylene resin, polypropylene resin, polystyrene resin, gilded ^ & polyethylene resin, ABS resin (acrylonitrile - Ministry of Economic Affairs The consumer cooperative prints materials such as butadiene-styrene copolymer. Next, a method of manufacturing a resist pattern according to the present invention will be described with reference to a second diagram of a schematic view of an embodiment. First, as shown in Fig. 2A, in the step (1), the element 1 is laminated on the circuit and the earth plate for circuit formation so that the resist layer 12 can be adhered to the surface of the circuit formation substrate 2. Before the layer of the coating area is formed, when the anti-surname layer 12 of the photosensitive element 1 has a film in the presence of a film, the protective film is first removed. The standard of the paper is applicable to the Chinese National Standard (C^) A4 specification (21 ^ 34 311830 1251123 A7 V. Inventive Note (35). The method can be enumerated, for example, the surface of the anti-small agent layer 2 from 7 〇 to (9) The method of laminating the right heating layer on the circuit-forming substrate 2 by a pressure of 0.1 to IMpa (1 to 10 Kgf/cm 2 ) may be laminated under reduced pressure. The surface of the substrate 2 on which the photosensitive 7G member 1 is laminated may be a metal surface, and is not particularly limited as long as it is provided with a metal layer (10) which is generally provided on the surface of the workpiece. After the photosensitive element is laminated, step (ii), as shown in FIG. 2B, is transmitted through the mask pattern 3 on the resist layer 12 by irradiation with active light to form an exposure portion of the resist layer 12. Light hardening. The reticle pattern 3 can be of a negative or positive type, and can be used generally. As the light source of the active light, a known light source such as a carbon arc lamp, a mercury vapor arc lamp, a high-pressure mercury lamp, a xenon lamp or the like which can effectively emit ultraviolet light or visible light can be used. In addition, it is also possible to perform direct exposure by laser without using a mask pattern. After the exposure, the step (ill) forms a resist pattern as shown in Fig. 2C by selective removal after development of the unexposed portion of the resist layer. Further, the exposure of the step (?) may be carried out in a state where the support U is present without hindering the irradiation of the light to the resist layer 12; in this case, the support 1 1 is removed before the development. The development is carried out by wet imaging or dry development using an aqueous solution, an aqueous imaging solution, an organic solvent or the like, and the development of the unexposed portion. It can be preferably used as the above-mentioned aqueous solution, for example, 1. 1 to 5% by weight of a dilute solution of sodium carbonate, 〇j to 5% by weight of a dilute solution of potassium carbonate, and 01 to 5% by weight of sodium hydroxide Solution, etc. The pH of the alkaline aqueous solution is preferably in the range of 9 to 11. Therefore, please read the following notes on the back side and then fill in this page} « --------^--------- Ministry of Economic Affairs, Intellectual Property Bureau, Staff and Consumer Cooperatives, Printed Paper Scale Applicable to China National Standard (CNS) A4 Specification (210 X 297 Public) 35 311830 1251123 B7 V. Invention Description (36) ^, / Farming depends on the sensitivity tree And 'inspective aqueous solution like the addition of "adjustment. And other agents. The above-mentioned development methods include a defoaming agent, an organic solvent method, and a brushing method: for example, a soaking method, a spray coating method, a tapping method, and the like. Or, if necessary, heating the pattern at a level of 6° to 250t to further degenerate the “exposure”, so that the formed anti-(4) step is not fragrant; the manufacturing method of the printed circuit board related to the reference is as follows.

Figure 3 of the schematic diagram of the implementation of I / is based on fenfen. Sigma 3 and Figure 4 show that the steps up to the formation of the anti-money film pattern include: the step of layering the circuit forming substrate 2 (1), the exposure step (11), two; two two... In the manufacturing method of the film pattern of the last name, in the manufacturing method of the circuit board, as shown in the third drawing and the fourth circuit, the substrate 2 for circuit formation has a surface which is not thin. The layer 21 is processed. Fig. 3 shows the steps of forming a circuit using etching, and Fig. 4 shows the step of forming a circuit by electroplating. After forming the resist pattern 121 by the +addition method, the step (iv), as shown, the mask pattern 121 formed as a mask, or the processed layer of the substrate 2 of the electric 3B pattern 21 etching, or as shown in Fig. 4B, the y-forming layer 21 is selectively plated to form a steel (such as steel) to be added (22). The etching of the layer to be processed 21 composed of a metal surface may be, for example, a vaporized copper solution, a ferric chloride solution, an alkaline etching solution or the like. Use, for example, |_____ electric law, ^ paper size national standard (CNS) A4 specifications (21G X 297 public) ~ — 6 3Π83〇1251123 A7 V, invention description (37 have, for example, 'copper mine Finally, the Huidian electricity money, the recording electric clock, the gold electricity money, etc., as shown in the 3C and 4th drawings, the residual resist pattern 121 can be used as the base used for the development of the right image. A strong aqueous solution of a strong aqueous solution is peeled off, and a circuit board (1) is formed to form a circuit board 4. Further, in the case of a semi-additive method, for example, after the anti-surname film pattern is peeled off by the third layer, for example, a rapid surname method is used. For the strong alkaline aqueous solution, for example, 曰. The weight % of the aqueous sodium hydroxide solution '! to 1% by weight of the aqueous solution of the aqueous hydroxide, etc. For example, a immersion method, a spray method, etc., and a printed circuit board on which a resist pattern is formed may be a multilayer printed circuit board or a small diameter through hole. Further, the present embodiment will be described in further detail with reference to the embodiments. Invention. Example 1 _ to 20 And more than the example; [5 3 (please read the note on the back and fill out this page) 1--------^---------\ Ministry of Economic Affairs Intellectual Property Bureau employee consumption cooperative The components shown in Table 1 were prepared to prepare a binder polymer solution.

125 (solid content 56%) photochromic colorless crystal violet 0.4 ~~ dye malachite green 0.04 solvent c _ 10 toluene 7 N,N-methylmethyl decylamine 3 methanol 3 This paper scale applies to China National Standard (CNS) A4 specification (210 X 297 mm 311830 A7 1251123 B7 V. Invention description (38) Ministry of Economic Affairs Intellectual Property Bureau employee consumption cooperative printed second, in the obtained solution dissolved in Table 2, Table 3, Table 4 and Table 5 A photosensitive resin composition was prepared. Table 2 Compounding amount / g Example Comparative Example 1 1 2 3 4 5 (B1) ΟΧΤ-10Γ1 17 0 0 0 0 0 ΟΧΤ-12Γ2 0 17 0 0 0 0 XDO*3 0 0 17 0 0 0 (B2) UA-11·4 0 0 0 0 0 17 FA-321M*5 27 27 27 44 44 27 (C1) BBM05·6 0.5 0.5 0.5 0.5 0 0 SP-170*7 0 0 0 0 0.5 0 (C2) CI-ΗΑΒΓ8 3.2 3.2 3.2 3.2 3.2 3.2 ΕΑΒ*9 0.1 0.1 0.1 0.1 0.1 0.1 Table 3 Compounding amount / g Example 6 7 8 9 10 11 12 (Β1) ΟΧΤ-101 10 0 0 0 0 0 0 ΟΧΤ-121 0 10 0 0 0 0 0 ΟΧΤ-211 0 0 10 0 0 0 0 ΟΧΤ-212 0 0 0 10 0 0 0 ΟΧΤ-221 0 0 0 0 10 0 0 ΟΧΤ-ΒΤΟΕ 0 0 0 0 0 10 0 OXT-BDOE 0 0 0 0 0 0 10 (Β2) FA-321M 35 35 35 35 35 35 35 (C1) ΒΒΙ-105 0.5 0.5 0.5 0.5 0.5 0.5 0.5 (C2) CI-HABI 3.0 3.0 3.0 3.0 3.0 3.0 3.0 ΕΑΒ 0.3 0.3 0.3 0.3 0.3 0.3 0.3 Applicable to China National Standard (CNS) A4 specification (210 X 297 mm) 38 311830 ------------^--------Book--------- &lt Please read the notes on the back and fill out this page.) 1251123 A7 B7 V. INSTRUCTIONS (39) TABLE 4 Mixing amount / g Example 13 14 15— » Ml 1 OXT-DDOE 10 0 0 ～ _丨— ( OXT - MA 0 10 0 \ Guang TR 1, HM-16 0 0 10 ( HM-20 0 0 0 1 HM-23 0 0 0 ( HM_24 0 0 0 (B2) FA-321M 35 35 35 3 (Cl) BBI -105 0.5 0.5 0.5 0· (C2) CI-HABI 3.0 3.0 I—3.0 3. EAB 0.3 0.3 0.3 I· ' 0. • 5 η 18 0 0 0 0 0 0 ~ 0 0 10 0 0 10 A 35 35 0.5 0.5 3.0 3.0 0.3 0.3 (Please read the notes on the back and fill out this page) Table 5 Quantity/g Example ~' Comparative Example 19 -.. 20 2 ^------ 3 (B1) Eporite 4000 10 0 0 —1 --- 0 Eporite 3002 0 10 0 (B2) FA-321M 35 —--— 35 ^^25 25 UA-11 0 0 ^10 0 ~ NP-08EA110 0 ～ 0 ^^10 20 (C1) BBM05 0.5 -- 0.5 0 (C2) CI-HABI 3.0 3·〇 〆! 〇 3.0 EAB 0.3 0.3 ^0.3 ^- 0.3 The compounds used in Tables 2 to 5 are as follows. The compounds in the tables other than these are the same as those previously mentioned in the product name. Printed by the Intellectual Property Office of the Ministry of Economic Affairs, the Consumer Cooperatives. This paper scale applies to the Chinese National Standard (CNS) A4 specification (210 X 297 mm). 39 311830 1 1 OX1M01 : 3 -ethyl branched methyl oxetane (general Formula 1251123 A7 B7 V. Description of the invention (4〇) (υ ri=ethyl, r2=hydrogen atom compound, East Asian synthesis (share), product name) -------------- Packing - (Please read the note on the back and fill out this page) *2 0X Ding-121: xylene dioxetane (1,4_bis(((3_ethyl-3-oxocyclo)) Butyl)methoxy)methyl)benzene (compound of the above formula (2)) (80 to 85% by weight) and RQR5=ethyl in the general formula (2) and having R3 = - (5) a mixture of compounds of m=l (1〇 to 15重量%), East Asian synthesis (shares), product name) *3 XD0 : bis(((3-ethyl-3. oxetanyl)) Oxy)methyl)benzene (compound of the above formula (20), East Asian synthesis (share), product name) *4 UA-ll : EO modified urethane dimercapto acrylate (in the above general formula (2 8) R17 = R] 8 = sulfhydryl, χΐ = χ 2 = ethylene oxide ,z = (CH2)6 and s = t=5 compound, Xinshencun Industrial Co., Ltd., product name) *5 FA ·3 2〗 Μ (2,2-bis(4-(mercapto propylene oxime) Pentyloxy) stupyl) propane, 曰立化成工业(股), product name) Ministry of Economic Affairs Intellectual Property Bureau employee consumption cooperative printed *6 ΒΒ1-1 05 : 4-bis(1-butylphenyl) iodine鐡Trifluoromethanesulfonate *7 SP-〗 70: bis[4-(bis(4-(2-hydroxyethoxy)phenyl)indolyl)phenyl]sulfide bis(hexafluoroantimonate, 60% propylene carbonate solution (Asahi Chemical Industry Co., Ltd., product name):

This paper scale applies to China National Standard (CNS) A4 specification (210 X 297 public) 40 (correction page) 311830 A7 1251123 — —___B7 __ V. Invention description (41 ) *8 CI-HABI : 2,2,-double (o-chloro-phenyl)-4,4,5555,_four stupid double microphone. Sit *9 EAB : diethylamino benzophenone Γ% first read the back, note the matter and fill out this page) *10 NP-8EA : mercaptophenoxy octaethyleneoxy acrylate (Kongrongsha Chemical (Production), product name) Next, the photosensitive resin composition solution was uniformly applied to a polyethylene terephthalate film having a thickness of 16 μm, and dried by a hot air convection dryer of i〇〇cc. In 1 minute, a photosensitive element was produced. The film thickness of the photosensitive tree wax composition layer (anti-# agent layer) was 20 μm. On the other hand, 'the copper surface of a glass fiber epoxy resin material (manufactured by Hitachi Chemical Co., Ltd., trade name: MCL_E-61) having a copper-coated epoxy resin (thickness of 35 μm) in two layers is held by a solid surface. Grinding machine (manufactured by Sanqi), which is equivalent to #600, is ground, washed with air, and dried, and the obtained copper area laminate is heated at 8 (TC), and the above photosensitive resin is applied to the copper surface. The composition layer is laminated on one side at 110 ° C. The Ministry of Economic Affairs' Intellectual Property Office employee consumption cooperative prints the second, using an exposure machine with high-pressure mercury lamps (0aK (manufactured)) 590, and STOFA 41-level STEP TABLET as a negative film. Placed on the test piece and exposed at 60 mJ/cm2. After exposure, the polyethylene terephthalate film was peeled off, and the unexposed portion was removed by spraying with a j% by weight aqueous sodium carbonate solution at 30 ° C for 20 seconds. As for the light sensitivity of the photosensitive resin composition, the number of STEP TABLETs of the obtained resist film pattern (that is, the photohardenable film formed on the copper area layer) is measured. The light sensitivity is determined by grpEp paper ruler Applicable to China National Standard (CNS) A4 specification (210 X 297 public) 41 311830 1251123 A7 B7 V. The number of stages of the invention (42) indicates that the higher the number of STEP TABLET, the higher the light sensitivity. After the image was developed, the resolution (μιη) was obtained from the width (μιη) of LINE remaining after LINE-AND-SPACE, and the anti-# film was cured by impregnation with an exposure amount of 60 mJ/cm2 in a 3% NaOH aqueous solution. The time required for stripping. The results of the above evaluation are shown in Tables 6 to 9. (Please read the notes on the back and fill out this page) I — — — 111 — — t — — ----I-- Ministry of Economic Affairs Intellectual Property Office Staff Consumer Cooperatives Printed Table 8 Example 13 14 15 16 17 18 Sensitivity (ST/41) 25 24 22 28 31 26 Resolution (μιη) 20 20 18 25 25 22 Stripping Time (sec) 40 45 43 45 33 49 Table 6 Example Comparative Example 1 1 2 3 4 5 Sensitivity (ST/41) 34 32 32 26 26 20 Resolution (μιη) 22 22 22 22 22 22 Peeling time (sec) 33 35 35 60 60 70 Table 7 Example 6 7 8 9 10 11 12 Sensitivity (ST/41) 27 26 26 26 26 25 25 Resolution (μιη) 25 20 20 20 18 20 2 2 Peeling time (sec) 37 18 32 26 36 40 47 This paper scale applies to China National Standard (CNS) A4 specification (210 X 297 mm) 42 311830 A7 B7 1251123 V. Description of invention (43) Table 9 Comparative example of embodiment 19 20 2 3 Sensitivity (ST/41) 24 24 19 19 Resolution (μιη) 1 22 22 25 30 Peeling time (sec) 38 35 50 40 - Example 2 1 to 24 housing and comparison example 4 Preparation table 10 The composition shown was used to prepare a photosensitive resin composition solution. Next, the photosensitive resin composition solution was prepared by dissolving the components shown in Table 11 in the obtained photosensitive resin composition solution. Table 10 (Please read the note on the back and fill out this page) - 丨 经济 经济 智慧 智慧 员工 员工 员工 员工 员工 员工 员工 员工 员工 员工 员工 ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( A ( (25/50/25 by weight, weight average molecular weight = 54,000), methyl cellosolve / toluene = 6 / 4 (by weight) solution 'solid content = 40% by weight, acid value = 75 mgKOH / g 150 (solid Content 60%) (B) Ingredients FA-321 Μ 40 cc) Component Cl-ΗΑΒΓ7 3.2 ΕΑΒη 0.1 Photochromic colorless crystal violet 0.4 Dye peacock green 0,08 Solvent propylene sulfonate 10 Toluene 7 ν, ν-dimethyl Formamide 3 Methanol 3 Order ---------, This paper scale applies to China National Standard (CNS) A4 specification (210 X 297 metric tons) 43 311830 1251123 V. Invention Description (# Table 11 Mixing amount / g. (D) Next, a photosensitive element was obtained by using the photosensitive resin composition solution as in the above examples. The film thickness of the photosensitive resin composition layer (anti-residue layer) obtained was 30 Å. The photosensitive element, like the domain embodiment, is laminated on a copper area laminate (same as above) Using the same exposure machine as above, a negative film of st〇fa41 grade STEP TABLET was placed on the test piece and exposed at an exposure of 3 〇, 120 mJ/cm 2 . Then, as described above, the unexposed part was removed. The employee's consumer cooperative printed the resist pattern obtained by measuring the sensitivity of the photosensitive resin composition by measuring the number of STEP TABLET of the photohardenable film formed on the copper area layer. The exposure (mj/cm2) necessary for hardening the 21st step of STEP 41 TABLETABLET (〇·D.-0·05) is sensitivity. The lower the value is, the higher the sensitivity is. The anti-surname film pattern was obtained, and the resolution (μιη) was obtained from the width (μπι) of LINE remaining after LINE-AND-SPACE. Further, the pattern of the LINE having a width of 30 μm was observed by SEM, and the shape of the pattern was evaluated. The etching pattern is preferably a rectangle. The peeling time is determined as follows, and the sample is irradiated with an exposure amount corresponding to the individual sensitivity (21/41), and the paper size is 1% by weight of sodium carbonate solution. National Standard (CNS) A4 Specification (210 X 297) PCT) 443,118,301,251,123

V. Description of the invention (45) Image. After a day and night, the sodium hydroxide solution of °/〇 is preferred. The above evaluation results of Examples 2! to 24 and Comparative Example 4 were maintained at 45 while being immersed in the stirring. The weight of 3 测定 is measured (4), and the distance between the temples (seconds). Separation time

(Please read the note on the back and then fill out this page.) The Ministry of Economic Affairs, Intellectual Property Office, Staff and Consumers Cooperative, printed the disclosure of this application, and the special wish U-263863, which was filed in Japan on September 17, 1999. And the theme of the application of the special wish 1-3 131 No. 80 No. 80 on the 4th of May, 999 is related, so the contents of the disclosure are cited. It is to be noted that the above-described embodiments may be modified and changed in various ways without departing from the spirit and scope of the invention. Therefore, all such modifications and variations are intended to be included in the scope of the patent application. [Description of component symbols] 11 21 121 Photosensitive element 2 Substrate mask pattern for circuit formation 4 Printed circuit board support 12 Anti-surname layer processed layer 22 Electromoney layer resist pattern 2 H Circuit paper scale applies to China Standard (CNS) A4 specification (210 X 297 mm) 45 (correction page) 3Π830 ----tr----------line

Claims (1)

1251123 番正ΙϊΓ H3 No. 8911 8940 iTf ¥rt IFF Patent Application Revision (March 12, 1993) L Ministry of Economic Affairs Central Bureau of Standards Staff Welfare Committee prints a photosensitive resin composition containing (A) acrylic acid And/or mercapto-acrylic acid as a copolymerization component having a weight average molecular weight of 20,000 to 30, an acrylic resin, (B1) an oxygen represented by the following general formula (丨) or general formula (2) a heterocyclic butane compound and/or an epoxy compound, (B2) a photopolymerizable compound having at least one polymerizable ethylenically unsaturated group in the molecule, and (C1) comprising a compound selected from the group consisting of an iodine salt compound and a phosphonium salt compound And a photoacid generator of one or more compounds of the ammonium salt compound, and the amount of the component (A) is the total amount of the component (A), the component (B1), and the component (B2) 4 to 80 parts by weight of the above-mentioned (B1) component is 1 to 57 parts by weight, the amount of the above (B 2) component is 1 to 57 parts by weight, and the compounding amount of the above (ci) component is 0. 1 to 10 parts by weight; general formula (1): a calcination group of 1 to 20, a cycloalkyl group having 3 to 1 carbon atom, an aryl group having 6 to 18 carbon atoms, a (meth) acrylonitrile group, a phenethyl group, an amine group, and a carbon number of 1 To a hydrazine amine group, a carbon atom number of 2 to 20, a terminal amino group, a terminal group, a cyano group, a thiol group, a thiol group, and a carbon number of 1 to 1. The paper size is applicable to the Chinese national standard. (CNS) Α4 袼 (210 X 297 public) 1 (Revised) 311830 1251123 H3 alkylthio, propyl, hydroxy, carbon atomic number i to 20, thiol, ruthenium, 6 base The number of carbon atoms is from 1 to the center, the base of the alkyl group is from 1 to 10, the alkoxy group having from 1 to 20 carbon atoms, and the decyloxy group having from 1 to 2 carbon atoms. a divalent group having 2 to 1 Å of a carbon atom, a dilute group having 2 to 2 carbon atoms, a Nh group of an aminomethyl group having 2 to 10 carbon atoms, or a heterocyclic group, or more than one or more a substituent-substituted aryl group) General formula (2): W(7) (wherein R3 represents a divalent organic group, and R4 and RS are respectively the same as R1 in the general formula (1)) 2. Photosensitive resin composition, Further, the (C2) radical polymerization initiator is contained. The photosensitive resin composition according to claim 2, wherein the (C2) component comprises a 2,4,5-triaryl η-methane dimer Printed by the Employees' Welfare Committee of the Central Bureau of Standards of the Ministry of Economic Affairs. 4. The photosensitive resin composition of the above-mentioned patent application, wherein the above (Β2) component comprises a bisphenol a-based (meth) acrylate compound. The photosensitive resin composition of claim 1, wherein the (A) wounding further comprises a styrene and/or a stupid ethylene derivative as a copolymerization component. 6. A photosensitive resin composition as claimed in claim 1 The acid value of the above component (A) is 30 to 500 mgKOH/g. The paper size is applicable to the Chinese National Standard (CNS) A4 specification (210 x 297 mm) 2 (Revised) 311830 8. If the patent application scope 〗 〖I, / 八 a 贝 戍 戍 树脂 树脂 树脂 树脂 树脂 树脂 树脂 树脂 树脂 树脂 树脂 树脂 树脂 树脂 树脂 树脂 树脂 树脂 树脂 树脂 树脂 树脂 树脂 树脂 树脂 树脂 树脂 树脂 树脂 树脂 树脂 树脂 树脂 树脂 树脂 树脂 树脂 树脂 树脂 树脂 树脂 树脂 树脂 树脂 树脂 树脂The anti-small agent layer is applied by the patented photosensitive resin. The product of the composition of the product. The method of manufacturing the anti-button film pattern includes the following steps: 'υ The anti-# agent formed by the third part of the patent scope is formed on the cut body. a layered photosensitive element is laminated on a circuit-forming substrate, and a laminate step of adhering the resist layer to the surface of the circuit-forming substrate; ii) passing through the mask, r Sweeping # ,, , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , The anti-I insect film patterning step of the unexposed portion. The manufacturing method of the 10-type printed circuit board comprises the following steps: I) a photosensitive element product formed by forming a resist layer composed of a photosensitive resin of the invention (4) item i on the support body. - The Department of Economics, the Central Bureau of Standards, the Staff Welfare Committee, the printed layer on the circuit-forming substrate having the processed layer on the surface, and the step of laminating the resist layer to the surface of the processed layer I of the circuit-forming I-plate ; II) a step of hardening the exposure portion of the resist layer by irradiation with active light by a reticle pattern, or direct scanning exposure by laser; iii) selectively removing the exposed layer of the resist layer by development 297 mm) 3 (Revised) 311830 1251123 anti-name film pattern forming step; and iv) etching the processed layer of the circuit forming substrate by using the anti-surge film pattern as a mask, or The step of selective electroplating on the processed layer. 11 . A photosensitive resin composition comprising (A) an acrylic resin having a weight average molecular weight of from 2 Å to 30,000,000 containing acrylic acid and/or mercapto acrylic acid as a copolymerization component, a photopolymerizable compound having at least one conjugated ethylenically unsaturated group in the molecule, and (C1) a photoacid generator containing at least one compound selected from the group consisting of a shotgun salt compound, a phosphonium salt compound, and an ammonium salt compound The amount of the component (B) is 40 to 80 parts by weight, and the amount of the component (b2) is 1 to 100 parts by weight based on 100 parts by weight of the total of the components (A) and (B2). The compounding amount of the above (C1) component is 〇1 to parts by weight based on 60 parts by weight. 1 2. The photosensitive resin composition of claim 11, which further contains (C2) a radical polymerization initiator. 13. The photosensitive resin composition of claim 12, wherein the (C2) component comprises a 2,4,5-triarylimidazole dimer. Printed by the Employees' Welfare Committee of the Central Bureau of Standards of the Ministry of Economic Affairs. 14. The photosensitive resin composition of claim 11, wherein the component (B2) includes a bisphenol a (meth) acrylate compound. The photosensitive resin composition of the invention of claim 3, wherein the component (A) further comprises a copolymerization component of a styrene and/or a styrene derivative. 16. The photosensitive resin composition of claim 11 of the patent application scope, wherein the paper size applies to China~National Standards (cns)-^4 rules (210 x 297 public love ^------ 4 ( Amendment 311830 1251123 H3 The acid value of the (A) system is 3 〇 to $ (8) mg K 〇 H / g. 17 The photosensitive resin composition of claim 11 wherein the above (A) lanthanide can be The image is formed by an alkaline aqueous solution. The "reactive photosensitive member" contains a support and an anti-U layer formed on the support, and the anti-surplus layer is composed of a photosensitive resin of the first application of the patent scope. The method for producing a resist pattern, comprising the steps of: forming a rhyme-resistant layer formed on a support by forming a photosensitive resin composition according to the scope of the patent application. a step of laminating the photosensitive layer formed on the circuit-forming substrate and adhering the resist layer to the surface of the circuit-forming substrate; * irradiating with active light by the mask pattern, or using a ray Directly sweeping ^exposure' to expose the above-mentioned anti-rice layer a step of photohardening; a resist pattern forming step of selectively removing an unexposed portion of the resist layer by development. 2) A method of manufacturing a printed circuit board, comprising the steps of: ^ A photosensitive element laminated body formed by forming a resist layer made of a photosensitive resin of claim 11 on the support. The Central Bureau of Standards and Staff Welfare Committee printed on a circuit having a processed layer on the surface is formed. a step of laminating the surface of the substrate on which the anti-insulin layer is adhered to the surface of the substrate to be processed; II) passing through the mask pattern, irradiating with active light, or directly scanning "exposure" with a laser The step of hardening the exposed portion of the resist layer; III) selectively removing the unexposed portion of the resist layer by development is applicable to the Chinese national standard ^-- A 5 (amendment) 311830 1251123 ----- a resist pattern forming step of H3; iv) etching the processed layer of the circuit forming substrate by using the resist pattern as a mask, or selecting the processed layer Step of the electroplating. 2 1 · A photosensitive resin composition containing (A) containing acrylic acid and/or methyl acrylic acid as a copolymerization component, having a weight average molecular weight of 2 〇, 〇〇〇 to 300, 〇 a bismuth acrylate resin, (B1) an oxetane compound and/or an epoxy compound represented by the following general formula (1) or general formula (2), (B2) having at least one molecule in the molecule a polymerizable ethylenically unsaturated group photopolymerizable compound and (C2) a radical polymerization initiator, and the total amount of the above (A) component, (B1) component, and (B2) component is 1 weight. The blending amount of the component (A) is 40 to 80 parts by weight, the amount of the component (B1) is 1 to 57 parts by weight, and the amount of the component (B2) is 1 to 57 parts by weight, The compounding amount of the component (C2) is 〇·2 to 1 〇 by weight, and the general formula (1): Printed by the Staff and Welfare Committee of the Central Bureau of Standards of the Ministry of Economic Affairs (in the formula, R1 and R2 are each independently represented by a hydrogen atom, a halogen atom, a pyridyl group having a number of anti-atoms of 1 to 20, and a ring-burning group having a carbon number of 3 to 1 Å. An aryl group having 6 to 18 carbon atoms, a (fluorenyl) acrylonitrile group, an acetophenone group, a sulfhydryl group, an alkyl group having a %I atom number of 1 to 10, and a dialkyl group having 2 to 20 carbon atoms Amino, nitro, cyano, carbonyl, thiol, carbon number This paper scale is applicable to China National Standard (CNS) A4 specification (210 X 297 mm) 6 (Revised) 311830 1251123 _________ Η3 to 1 0 a thiol group, a propyl group, a thiol group, a carboxyl group, an alkyl group, a carbyl group having 1 to 1 carbon atom, and a carbon atom of 1 to 1 in an alkyl group. Acid group, alkoxy group having 1 to 20 carbon atoms, alkoxycarbonyl group having 1 to 20 carbon atoms, alkylcarbonyl group having 2 to 10 carbon atoms, 2 to 1 nonenyl group having carbon number, carbon An N-alkylaminomethyl fluorenyl group having 2 to 10 atoms or a heterocyclic group-containing group or an aryl group substituted with one or more such substituents) General formula (2): (2) (wherein R3 represents a divalent organic group, and R4 and R5 are the same as R1 of the general formula (1), respectively). The photosensitive resin composition of claim 21, wherein the component (B2) comprises a bisphenol a (meth) acrylate compound. The photosensitive resin composition of claim 21, wherein the (C2) component comprises a 2,4,5-triarylimidazole dimer. Printed by the Staff Standards Committee of the Central Bureau of Standards of the Ministry of Economic Affairs 24· The photosensitive resin composition of claim 21, wherein the above component (a) further comprises a styrene and/or a styrene derivative as a copolymerization component. The photosensitive resin composition of claim 21, wherein the acid value of the above component (A) is 30 to 5 mgK〇H/g. The photosensitive resin composition of claim 21, wherein the above component (A) can be developed by an aqueous solution. 27·- kinds of photosensitive elements, which contain a cut body and an anti-297 mm formed on the support body) 7 (Revised) 311830 1251123: 1 layer: The above resist layer is in the scope of claim 21 A photosensitive resin composition. And a method for producing a resist pattern, comprising the steps of: forming a photosensitive layer formed by forming an anti-reagent layer formed on the support by the composition of the second resin of claim 2; a step of laminating the surface of the substrate and the surface of the substrate for forming a pen for forming a circuit on a circuit board; the 11) is irradiated with active light by a mask image, or The step of directly curing the exposed portion of the resist layer by directing Xingtian/·L; 1H) selectively removing the unexposed resist pattern forming step of the anti-surname layer by developing. The manufacturing method of the printed circuit board includes the following steps: · The photosensitive element formed by forming the anti-surplus agent layer formed of the photosensitive resin composition of claim 21 on the support body is laminated on the surface a step of laminating the surface of the layer to be processed on the circuit-forming substrate having the layer to be processed, and the surface of the layer to be processed of the circuit-forming substrate; a pattern, which is irradiated with active light, or directly irradiated with a laser to expose the exposed portion of the resist layer; and the image of the anti-money film is selectively removed by a coincident image; a forming step; iv) etching the layer to be processed on the circuit-forming substrate by using the resist pattern as a mask, or performing the step of selectively charging the substrate in the processed layer. ^T^NS) A4 gauge (21 297 mm) 8 (Revised) 311830