TW200626653A - Styrene resin composition, molded body thereof, and diffusion plate - Google Patents
Styrene resin composition, molded body thereof, and diffusion plateInfo
- Publication number
- TW200626653A TW200626653A TW094145923A TW94145923A TW200626653A TW 200626653 A TW200626653 A TW 200626653A TW 094145923 A TW094145923 A TW 094145923A TW 94145923 A TW94145923 A TW 94145923A TW 200626653 A TW200626653 A TW 200626653A
- Authority
- TW
- Taiwan
- Prior art keywords
- resin composition
- molded body
- mass
- parts
- styrene resin
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L25/00—Compositions of, homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring; Compositions of derivatives of such polymers
- C08L25/02—Homopolymers or copolymers of hydrocarbons
- C08L25/04—Homopolymers or copolymers of styrene
- C08L25/08—Copolymers of styrene
- C08L25/14—Copolymers of styrene with unsaturated esters
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/20—Carboxylic acid amides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/34—Heterocyclic compounds having nitrogen in the ring
- C08K5/3442—Heterocyclic compounds having nitrogen in the ring having two nitrogen atoms in the ring
- C08K5/3462—Six-membered rings
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/34—Heterocyclic compounds having nitrogen in the ring
- C08K5/3467—Heterocyclic compounds having nitrogen in the ring having more than two nitrogen atoms in the ring
- C08K5/3477—Six-membered rings
- C08K5/3495—Six-membered rings condensed with carbocyclic rings
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
- C08L33/04—Homopolymers or copolymers of esters
- C08L33/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, which oxygen atoms are present only as part of the carboxyl radical
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
- C08L77/12—Polyester-amides
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Optical Elements Other Than Lenses (AREA)
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004371647A JP2008056706A (ja) | 2004-12-22 | 2004-12-22 | 成形体およびそれからなる拡散板 |
JP2005085547A JP2008056708A (ja) | 2005-03-24 | 2005-03-24 | スチレン系樹脂組成物および成形体 |
JP2005085553A JP2008056709A (ja) | 2005-03-24 | 2005-03-24 | スチレン系樹脂組成物および成形体 |
JP2005085554A JP2008056710A (ja) | 2005-03-24 | 2005-03-24 | スチレン系樹脂組成物および成形体 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW200626653A true TW200626653A (en) | 2006-08-01 |
Family
ID=36601795
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW094145923A TW200626653A (en) | 2004-12-22 | 2005-12-22 | Styrene resin composition, molded body thereof, and diffusion plate |
Country Status (2)
Country | Link |
---|---|
TW (1) | TW200626653A (ja) |
WO (1) | WO2006068198A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI481651B (zh) * | 2013-05-23 | 2015-04-21 | Chi Mei Corp | (甲基)丙烯酸酯系-苯乙烯系共聚物組成物及其成型品 |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101374416B1 (ko) * | 2006-07-06 | 2014-03-17 | 덴키 가가쿠 고교 가부시기가이샤 | 광 확산 시트 |
TWI458774B (zh) * | 2006-07-19 | 2014-11-01 | Denki Kagaku Kogyo Kk | Styrene-based resin composition and molded body |
JP4913629B2 (ja) * | 2007-02-27 | 2012-04-11 | 電気化学工業株式会社 | 光拡散シート |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2667878B2 (ja) * | 1988-06-24 | 1997-10-27 | 株式会社クラレ | 光拡散性プラスチック |
JP2565846B2 (ja) * | 1993-04-16 | 1996-12-18 | 三洋化成工業株式会社 | ポリエーテルエステルアミドおよび樹脂組成物 |
JPH06345925A (ja) * | 1993-06-10 | 1994-12-20 | Daicel Chem Ind Ltd | 難燃性スチレン系樹脂組成物及びそのシート成形物 |
JPH0997510A (ja) * | 1995-07-25 | 1997-04-08 | Asahi Chem Ind Co Ltd | 光源保護カバー用シート |
JP3734304B2 (ja) * | 1996-04-22 | 2006-01-11 | 旭化成ケミカルズ株式会社 | 樹脂組成物及び樹脂フィルム |
JPH1017705A (ja) * | 1996-07-05 | 1998-01-20 | Asahi Chem Ind Co Ltd | 制電性樹脂組成物及びその成形体 |
JP4357105B2 (ja) * | 1999-10-14 | 2009-11-04 | 旭化成ケミカルズ株式会社 | 導光板およびその製造方法 |
JP4925506B2 (ja) * | 1999-12-13 | 2012-04-25 | 株式会社日本触媒 | 透明性耐熱樹脂の製造方法 |
JP4649693B2 (ja) * | 1999-12-20 | 2011-03-16 | コニカミノルタホールディングス株式会社 | 光拡散フィルム及びその製造方法 |
JP4955168B2 (ja) * | 2000-10-19 | 2012-06-20 | 電気化学工業株式会社 | 帯電防止性樹脂組成物 |
JP5051950B2 (ja) * | 2001-06-19 | 2012-10-17 | Psジャパン株式会社 | 光透過特性に優れた光透過用成型品 |
JP4514388B2 (ja) * | 2002-01-18 | 2010-07-28 | 電気化学工業株式会社 | 樹脂組成物及びその成形体 |
JP4683813B2 (ja) * | 2002-03-13 | 2011-05-18 | 電気化学工業株式会社 | 電子部品包装用成形体 |
JP3781110B2 (ja) * | 2002-03-20 | 2006-05-31 | 日本ゼオン株式会社 | ビニル脂環式炭化水素重合体組成物の成形方法及び成形体 |
JP2004050607A (ja) * | 2002-07-19 | 2004-02-19 | Sumitomo Chem Co Ltd | 光拡散性樹脂積層板 |
JP2004115609A (ja) * | 2002-09-25 | 2004-04-15 | Mitsubishi Engineering Plastics Corp | ポリカーボネート樹脂組成物およびその成形品 |
JP2004115610A (ja) * | 2002-09-25 | 2004-04-15 | Mitsubishi Engineering Plastics Corp | ポリカーボネート樹脂組成物およびその成形品 |
-
2005
- 2005-12-21 WO PCT/JP2005/023525 patent/WO2006068198A1/ja active Application Filing
- 2005-12-22 TW TW094145923A patent/TW200626653A/zh unknown
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI481651B (zh) * | 2013-05-23 | 2015-04-21 | Chi Mei Corp | (甲基)丙烯酸酯系-苯乙烯系共聚物組成物及其成型品 |
Also Published As
Publication number | Publication date |
---|---|
WO2006068198A1 (ja) | 2006-06-29 |
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