TW200624001A - Printed wiring board and manufacturing method therefor - Google Patents
Printed wiring board and manufacturing method thereforInfo
- Publication number
- TW200624001A TW200624001A TW094140419A TW94140419A TW200624001A TW 200624001 A TW200624001 A TW 200624001A TW 094140419 A TW094140419 A TW 094140419A TW 94140419 A TW94140419 A TW 94140419A TW 200624001 A TW200624001 A TW 200624001A
- Authority
- TW
- Taiwan
- Prior art keywords
- printed wiring
- wiring board
- circuit
- layer
- manufacturing
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
- H05K3/427—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in metal-clad substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0263—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board
- H05K1/0265—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board characterized by the lay-out of or details of the printed conductors, e.g. reinforced conductors, redundant conductors, conductors having different cross-sections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
- H05K1/116—Lands, clearance holes or other lay-out details concerning the surrounding of a via
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/061—Etching masks
- H05K3/062—Etching masks consisting of metals or alloys or metallic inorganic compounds
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
- H05K3/4658—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern characterized by laminating a prefabricated metal foil pattern, e.g. by transfer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0352—Differences between the conductors of different layers of a multilayer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0355—Metal foils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0361—Etched tri-metal structure, i.e. metal layers or metal patterns on both sides of a different central metal layer which is later at least partly etched
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0364—Conductor shape
- H05K2201/0376—Flush conductors, i.e. flush with the surface of the printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09509—Blind vias, i.e. vias having one side closed
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09736—Varying thickness of a single conductor; Conductors in the same plane having different thicknesses
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0361—Stripping a part of an upper metal layer to expose a lower metal layer, e.g. by etching or using a laser
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0384—Etch stop layer, i.e. a buried barrier layer for preventing etching of layers under the etch stop layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/14—Related to the order of processing steps
- H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004336480A JP4713131B2 (ja) | 2004-11-19 | 2004-11-19 | プリント配線板及びそのプリント配線板の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200624001A true TW200624001A (en) | 2006-07-01 |
TWI314430B TWI314430B (zh) | 2009-09-01 |
Family
ID=36407220
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW094140419A TW200624001A (en) | 2004-11-19 | 2005-11-17 | Printed wiring board and manufacturing method therefor |
Country Status (5)
Country | Link |
---|---|
US (1) | US8138423B2 (zh) |
EP (1) | EP1830611A4 (zh) |
JP (1) | JP4713131B2 (zh) |
TW (1) | TW200624001A (zh) |
WO (1) | WO2006054684A1 (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI420990B (zh) * | 2010-03-18 | 2013-12-21 | Zhen Ding Technology Co Ltd | 電路板製作方法 |
Families Citing this family (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4799349B2 (ja) * | 2006-09-29 | 2011-10-26 | 株式会社フジクラ | 電源分配装置およびその製造方法 |
KR100836653B1 (ko) * | 2006-10-25 | 2008-06-10 | 삼성전기주식회사 | 회로기판 및 그 제조방법 |
JP2009117600A (ja) * | 2007-11-06 | 2009-05-28 | Nippon Mektron Ltd | バンプ付き回路配線板の製造方法 |
JP2009123971A (ja) * | 2007-11-15 | 2009-06-04 | Nippon Mektron Ltd | バンプ付き回路配線板の製造方法 |
TW200948238A (en) * | 2008-05-13 | 2009-11-16 | Unimicron Technology Corp | Structure and manufacturing process for circuit board |
KR101019150B1 (ko) * | 2008-06-30 | 2011-03-04 | 삼성전기주식회사 | 비아-온-패드 구조를 갖는 인쇄회로기판 제조방법 |
KR20130097481A (ko) * | 2012-02-24 | 2013-09-03 | 삼성전자주식회사 | 인쇄회로기판(pcb) 및 그 pcb를 포함한 메모리 모듈 |
DE102012224284A1 (de) * | 2012-12-21 | 2014-06-26 | Heraeus Precious Metals Gmbh & Co. Kg | Dünne Metallmembran mit Träger |
US9087777B2 (en) | 2013-03-14 | 2015-07-21 | United Test And Assembly Center Ltd. | Semiconductor packages and methods of packaging semiconductor devices |
US9165878B2 (en) | 2013-03-14 | 2015-10-20 | United Test And Assembly Center Ltd. | Semiconductor packages and methods of packaging semiconductor devices |
CN104349609A (zh) * | 2013-08-08 | 2015-02-11 | 北大方正集团有限公司 | 印刷线路板及其制作方法 |
KR101509747B1 (ko) * | 2013-12-20 | 2015-04-07 | 현대자동차 주식회사 | 방열 인쇄 회로 기판 및 그 제조 방법 |
CN104684264A (zh) * | 2015-02-14 | 2015-06-03 | 深圳市五株科技股份有限公司 | 印刷电路板内层芯板的蚀刻方法 |
US10410939B2 (en) | 2015-12-16 | 2019-09-10 | Intel Corporation | Package power delivery using plane and shaped vias |
CN108702847B (zh) * | 2016-02-18 | 2021-03-09 | 三井金属矿业株式会社 | 印刷电路板制造用铜箔、带载体的铜箔和覆铜层叠板、以及使用它们的印刷电路板的制造方法 |
CN107920415B (zh) * | 2016-10-06 | 2020-11-03 | 鹏鼎控股(深圳)股份有限公司 | 具厚铜线路的电路板及其制作方法 |
CN106604524A (zh) * | 2016-11-21 | 2017-04-26 | 努比亚技术有限公司 | 柔性电路板 |
CN108135078A (zh) * | 2017-12-31 | 2018-06-08 | 长沙牧泰莱电路技术有限公司 | 一种复合母排pcb板及其加工方法 |
DE102018212272A1 (de) * | 2018-07-24 | 2020-01-30 | Robert Bosch Gmbh | Keramischer Schaltungsträger und Elektronikeinheit |
US10888002B2 (en) * | 2019-03-28 | 2021-01-05 | At&S Austria Technologie & Systemtechnik Aktiengesellschaft | Component carrier with embedded tracks protruding up to different heights |
CN112333926B (zh) * | 2020-10-20 | 2022-05-31 | 盐城维信电子有限公司 | 一种具有不同厚度金属层的线路板制作方法 |
CN115529719B (zh) * | 2022-11-01 | 2023-08-29 | 深圳市丰达兴线路板制造有限公司 | 一种具有表面金属线防护结构的线路板 |
Family Cites Families (20)
Publication number | Priority date | Publication date | Assignee | Title |
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JPS58119340A (ja) | 1982-01-06 | 1983-07-15 | Teikoku Kako Kk | 変色吸着剤 |
JPS6027466U (ja) * | 1983-07-30 | 1985-02-25 | 日本メクトロン株式会社 | フレキシブル回路基板用基材 |
JPS62185396A (ja) * | 1986-02-10 | 1987-08-13 | 電気化学工業株式会社 | 金属ベ−ス混成集積微細回路基板の製法 |
JP2664408B2 (ja) * | 1988-04-18 | 1997-10-15 | 三洋電機株式会社 | 混成集積回路の製造方法 |
JP3402372B2 (ja) * | 1992-04-23 | 2003-05-06 | 日立化成工業株式会社 | 配線板の製造法 |
DE69218344T2 (de) * | 1991-11-29 | 1997-10-23 | Hitachi Chemical Co Ltd | Herstellungsverfahren für eine gedruckte Schaltung |
JPH077272A (ja) | 1993-06-15 | 1995-01-10 | Cmk Corp | 多層プリント配線板 |
JPH07111386A (ja) | 1993-10-12 | 1995-04-25 | Hitachi Ltd | 多層配線基板およびその製造方法 |
JPH07221411A (ja) * | 1994-02-08 | 1995-08-18 | Toyota Autom Loom Works Ltd | プリント配線基板及びその製造方法 |
JPH09199816A (ja) * | 1996-01-16 | 1997-07-31 | Sumitomo Wiring Syst Ltd | フレキシブルプリント基板およびその製造方法 |
JPH1032371A (ja) * | 1996-05-17 | 1998-02-03 | Furukawa Electric Co Ltd:The | 複合回路基板およびその製造方法 |
JPH10313152A (ja) * | 1997-05-09 | 1998-11-24 | Furukawa Electric Co Ltd:The | 回路基板 |
JP3606763B2 (ja) | 1999-03-30 | 2005-01-05 | 日本メクトロン株式会社 | 可撓性回路基板の製造法 |
TWI243008B (en) * | 1999-12-22 | 2005-11-01 | Toyo Kohan Co Ltd | Multi-layer printed circuit board and its manufacturing method |
JP4411720B2 (ja) * | 2000-02-02 | 2010-02-10 | パナソニック株式会社 | 熱伝導基板とその製造方法 |
US6660406B2 (en) * | 2000-07-07 | 2003-12-09 | Mitsui Mining & Smelting Co., Ltd. | Method for manufacturing printed wiring board comprising electrodeposited copper foil with carrier and resistor circuit; and printed wiring board comprising resistor circuit |
JP4459406B2 (ja) * | 2000-07-27 | 2010-04-28 | ソニーケミカル&インフォメーションデバイス株式会社 | フレキシブル配線板製造方法 |
JP3520039B2 (ja) * | 2000-10-05 | 2004-04-19 | 三洋電機株式会社 | 半導体装置および半導体モジュール |
JP2003046247A (ja) * | 2001-08-02 | 2003-02-14 | Mitsui Chemicals Inc | 多層プリント配線板およびその製造方法 |
JP4133560B2 (ja) * | 2003-05-07 | 2008-08-13 | インターナショナル・ビジネス・マシーンズ・コーポレーション | プリント配線基板の製造方法およびプリント配線基板 |
-
2004
- 2004-11-19 JP JP2004336480A patent/JP4713131B2/ja not_active Expired - Fee Related
-
2005
- 2005-11-17 TW TW094140419A patent/TW200624001A/zh not_active IP Right Cessation
- 2005-11-18 EP EP05807092A patent/EP1830611A4/en not_active Withdrawn
- 2005-11-18 US US11/719,803 patent/US8138423B2/en not_active Expired - Fee Related
- 2005-11-18 WO PCT/JP2005/021218 patent/WO2006054684A1/ja active Application Filing
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI420990B (zh) * | 2010-03-18 | 2013-12-21 | Zhen Ding Technology Co Ltd | 電路板製作方法 |
Also Published As
Publication number | Publication date |
---|---|
JP2006147881A (ja) | 2006-06-08 |
TWI314430B (zh) | 2009-09-01 |
US20090145630A1 (en) | 2009-06-11 |
JP4713131B2 (ja) | 2011-06-29 |
EP1830611A1 (en) | 2007-09-05 |
US8138423B2 (en) | 2012-03-20 |
WO2006054684A1 (ja) | 2006-05-26 |
EP1830611A4 (en) | 2009-06-24 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |