TW200618098A - Apparatus and method of processing substrate - Google Patents

Apparatus and method of processing substrate

Info

Publication number
TW200618098A
TW200618098A TW094134154A TW94134154A TW200618098A TW 200618098 A TW200618098 A TW 200618098A TW 094134154 A TW094134154 A TW 094134154A TW 94134154 A TW94134154 A TW 94134154A TW 200618098 A TW200618098 A TW 200618098A
Authority
TW
Taiwan
Prior art keywords
fluid
substrate
supply means
processing substrate
around
Prior art date
Application number
TW094134154A
Other languages
English (en)
Inventor
Satomi Hamada
Michihisa Kono
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Publication of TW200618098A publication Critical patent/TW200618098A/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
TW094134154A 2004-10-06 2005-09-30 Apparatus and method of processing substrate TW200618098A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004293774 2004-10-06
JP2004336404 2004-11-19

Publications (1)

Publication Number Publication Date
TW200618098A true TW200618098A (en) 2006-06-01

Family

ID=36142550

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094134154A TW200618098A (en) 2004-10-06 2005-09-30 Apparatus and method of processing substrate

Country Status (4)

Country Link
US (1) US20090081810A1 (zh)
JP (1) JPWO2006038472A1 (zh)
TW (1) TW200618098A (zh)
WO (1) WO2006038472A1 (zh)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI396484B (zh) * 2010-11-05 2013-05-11 Zhen Ding Technology Co Ltd 蝕刻裝置及使用該蝕刻裝置蝕刻基板之方法
US8793898B2 (en) 2007-05-23 2014-08-05 Semes Co., Ltd. Apparatus and method for drying substrates
TWI567857B (zh) * 2014-10-10 2017-01-21 杰宜斯科技有限公司 基板處理用加熱裝置及含有該加熱裝置的基板液處理裝置

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WO2007129551A1 (ja) * 2006-05-01 2007-11-15 Ulvac, Inc. 印刷装置
JP2008277480A (ja) * 2007-04-27 2008-11-13 Tokyo Electron Ltd 基板搬送処理方法及び基板搬送処理装置
JP4971078B2 (ja) * 2007-08-30 2012-07-11 東京応化工業株式会社 表面処理装置
JP5413016B2 (ja) * 2008-07-31 2014-02-12 東京エレクトロン株式会社 基板の洗浄方法、基板の洗浄装置及び記憶媒体
JP5140641B2 (ja) * 2009-06-29 2013-02-06 株式会社荏原製作所 基板処理方法及び基板処理装置
JP5632860B2 (ja) * 2012-01-05 2014-11-26 東京エレクトロン株式会社 基板洗浄方法、基板洗浄装置及び基板洗浄用記憶媒体
JP5881166B2 (ja) * 2012-06-14 2016-03-09 株式会社 イアス 基板分析用ノズル
JP6378890B2 (ja) * 2013-03-01 2018-08-22 株式会社荏原製作所 基板処理方法
CN103325717B (zh) * 2013-06-08 2018-04-03 上海集成电路研发中心有限公司 单片式清洗设备及其清洗方法
CN103474380B (zh) * 2013-09-18 2015-12-30 镇江艾科半导体有限公司 晶圆电性测试墨点清除器
JP6251825B2 (ja) * 2014-06-16 2017-12-20 エーエスエムエル ネザーランズ ビー．ブイ． リソグラフィ装置、及び基板を搬送する方法
JP6450024B2 (ja) * 2015-11-13 2019-01-09 株式会社日立製作所 洗浄装置及び洗浄方法
US11158525B2 (en) * 2016-02-03 2021-10-26 Tokyo Electron Limited Substrate processing apparatus and substrate processing method
KR102219787B1 (ko) * 2016-05-02 2021-02-23 케이엘에이 코포레이션 모세관 응축을 이용한 반도체 구조의 측정
US10145674B2 (en) 2016-05-02 2018-12-04 Kla-Tencor Corporation Measurement of semiconductor structures with capillary condensation
US10281263B2 (en) * 2016-05-02 2019-05-07 Kla-Tencor Corporation Critical dimension measurements with gaseous adsorption
US10041873B2 (en) 2016-05-02 2018-08-07 Kla-Tencor Corporation Porosity measurement of semiconductor structures
KR20170134925A (ko) * 2016-05-27 2017-12-07 세메스 주식회사 기판 처리 장치 및 기판 처리 방법
JP7209503B2 (ja) * 2018-09-21 2023-01-20 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
KR102168153B1 (ko) * 2018-10-10 2020-10-22 (주)유진이엔씨 건조액 액화회수장치 및 이를 이용한 반도체 건조시스템
KR102267912B1 (ko) * 2019-05-14 2021-06-23 세메스 주식회사 기판 처리 방법 및 기판 처리 장치
US11081334B2 (en) 2019-08-07 2021-08-03 Taiwan Semiconductor Manufacturing Company, Ltd. Particle prevention in wafer edge trimming
JP7406404B2 (ja) 2020-02-28 2023-12-27 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置
JP2022068575A (ja) * 2020-10-22 2022-05-10 株式会社ディスコ 洗浄装置
TWI795817B (zh) * 2020-11-12 2023-03-11 邑流微測股份有限公司 顯微鏡觀測載台及其使用方法
CN113073325B (zh) * 2021-03-24 2023-03-14 重庆臻宝实业有限公司 一种蚀刻清洗装置
US20240050993A1 (en) * 2022-08-09 2024-02-15 Taiwan Semiconductor Manufacturing Company, Ltd. Onsite cleaning system and method

Family Cites Families (11)

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Publication number Priority date Publication date Assignee Title
JPS62122132A (ja) * 1985-11-20 1987-06-03 Sharp Corp 超音波を用いた洗浄装置
JPS62188322A (ja) * 1986-02-14 1987-08-17 Hitachi Micro Comput Eng Ltd 洗浄装置
JP3122868B2 (ja) * 1994-09-29 2001-01-09 東京エレクトロン株式会社 塗布装置
JPH1126409A (ja) * 1997-06-30 1999-01-29 Nikon Corp 洗浄装置
US6827814B2 (en) * 2000-05-08 2004-12-07 Tokyo Electron Limited Processing apparatus, processing system and processing method
JP2003133276A (ja) * 2001-10-26 2003-05-09 Nec Kansai Ltd ウエハのパーティクル除去方法および装置
JP4005879B2 (ja) * 2002-08-30 2007-11-14 株式会社東芝 現像方法、基板処理方法、及び基板処理装置
US7198055B2 (en) * 2002-09-30 2007-04-03 Lam Research Corporation Meniscus, vacuum, IPA vapor, drying manifold
TWI230396B (en) * 2002-09-30 2005-04-01 Lam Res Corp System for substrate processing with meniscus, vacuum, IPA vapor, drying manifold
JP4189196B2 (ja) * 2002-10-08 2008-12-03 芝浦メカトロニクス株式会社 スピン処理装置
JP3899319B2 (ja) * 2003-01-14 2007-03-28 東京エレクトロン株式会社 液処理装置及び液処理方法

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8793898B2 (en) 2007-05-23 2014-08-05 Semes Co., Ltd. Apparatus and method for drying substrates
TWI490930B (zh) * 2007-05-23 2015-07-01 Semes Co Ltd 乾燥基板的裝置及方法
TWI396484B (zh) * 2010-11-05 2013-05-11 Zhen Ding Technology Co Ltd 蝕刻裝置及使用該蝕刻裝置蝕刻基板之方法
TWI567857B (zh) * 2014-10-10 2017-01-21 杰宜斯科技有限公司 基板處理用加熱裝置及含有該加熱裝置的基板液處理裝置

Also Published As

Publication number Publication date
JPWO2006038472A1 (ja) 2008-05-15
WO2006038472A1 (ja) 2006-04-13
US20090081810A1 (en) 2009-03-26

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