SG10201800716YA - Suction apparatus for an end effector, end effector for holding substratesand method of producing an end effector - Google Patents

Suction apparatus for an end effector, end effector for holding substratesand method of producing an end effector

Info

Publication number
SG10201800716YA
SG10201800716YA SG10201800716YA SG10201800716YA SG10201800716YA SG 10201800716Y A SG10201800716Y A SG 10201800716YA SG 10201800716Y A SG10201800716Y A SG 10201800716YA SG 10201800716Y A SG10201800716Y A SG 10201800716YA SG 10201800716Y A SG10201800716Y A SG 10201800716YA
Authority
SG
Singapore
Prior art keywords
end effector
producing
suction apparatus
holding
substratesand
Prior art date
Application number
SG10201800716YA
Inventor
Bernhard Bogner
Original Assignee
Suss Microtec Lithography Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Suss Microtec Lithography Gmbh filed Critical Suss Microtec Lithography Gmbh
Publication of SG10201800716YA publication Critical patent/SG10201800716YA/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00—Gripping heads and other end effectors
    • B25J15/06—Gripping heads and other end effectors with vacuum or magnetic holding means
    • B25J15/0616—Gripping heads and other end effectors with vacuum or magnetic holding means with vacuum
    • B25J15/0683—Details of suction cup structure, e.g. grooves or ridges
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00—Gripping heads and other end effectors
    • B25J15/06—Gripping heads and other end effectors with vacuum or magnetic holding means
    • B25J15/0616—Gripping heads and other end effectors with vacuum or magnetic holding means with vacuum
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J19/00—Accessories fitted to manipulators, e.g. for monitoring, for viewing; Safety devices combined with or specially adapted for use in connection with manipulators
    • B25J19/007—Means or methods for designing or fabricating manipulators
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S901/00—Robots
    • Y10S901/30—End effector
    • Y10S901/40—Vacuum or mangetic

Abstract

Suction apparatus for an end effector, end effector for holding substrates and method of producing an end effector A suction apparatus (14) for an end effector (10) comprises a main body (28), which has a through-channel (36) and a contact surface (38), and a sealing lip 5 (30). The contact surface has an edge (39) and recesses (40), wherein the through-channel (36) issues into the recesses (40) and the recesses (40) terminate in front of the edge (39). The main body (28) has a base portion (32) and a fastening portion (34), which adjoins the base portion (32). In the fastening portion (34) connection channels (44) are provided which are in fluid 10 communication with the through-channel (36) and extend from the edge of the fastening portion (34). An end effector (10) and a method of producing an end effector (10) are also shown. [Figure 2] 15
SG10201800716YA 2017-01-27 2018-01-26 Suction apparatus for an end effector, end effector for holding substratesand method of producing an end effector SG10201800716YA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL2018243A NL2018243B1 (en) 2017-01-27 2017-01-27 Suction apparatus for an end effector, end effector for holding substrates and method of producing an end effector

Publications (1)

Publication Number Publication Date
SG10201800716YA true SG10201800716YA (en) 2018-08-30

Family

ID=62843388

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201800716YA SG10201800716YA (en) 2017-01-27 2018-01-26 Suction apparatus for an end effector, end effector for holding substratesand method of producing an end effector

Country Status (9)

Country Link
US (1) US10259124B2 (en)
JP (1) JP2018157194A (en)
KR (1) KR102344555B1 (en)
CN (1) CN108364903A (en)
AT (1) AT519587B1 (en)
DE (1) DE102018100856A1 (en)
NL (1) NL2018243B1 (en)
SG (1) SG10201800716YA (en)
TW (1) TWI710438B (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3657537A1 (en) * 2018-11-23 2020-05-27 ATOTECH Deutschland GmbH End effector for slab formed substrates
US11276593B2 (en) 2019-07-22 2022-03-15 Rorze Automation, Inc. Systems and methods for horizontal wafer packaging
EP3772089B1 (en) * 2019-07-30 2021-05-26 Semsysco GmbH Substrate handling device for a wafer
US20230321758A1 (en) 2022-03-25 2023-10-12 Ii-Vi Delaware, Inc. Laser-roughened reaction-bonded silicon carbide for wafer contact surface
EP4273911A1 (en) * 2022-05-03 2023-11-08 Werner Lieb GmbH Holding device and method for holding and/or transporting workpieces and/or components, optionally with tool-free replaceable suction elements
US20230387657A1 (en) 2022-05-31 2023-11-30 Ii-Vi Delaware, Inc. Current load-controlled laser driver

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4131267A (en) * 1978-06-02 1978-12-26 Disco Kabushiki Kaisha Apparatus for holding workpiece by suction
JPH05267433A (en) * 1992-03-19 1993-10-15 Nec Kyushu Ltd Suction pad
US5226636A (en) * 1992-06-10 1993-07-13 International Business Machines Corporation Holding fixture for substrates
JPH07273499A (en) * 1994-03-30 1995-10-20 Matsushita Electric Ind Co Ltd Panel holding device
JP3200285B2 (en) * 1994-06-29 2001-08-20 キヤノン株式会社 Substrate transfer device
JP2002184835A (en) 2000-12-13 2002-06-28 Ando Electric Co Ltd Suction pad
US6942265B1 (en) * 2002-10-23 2005-09-13 Kla-Tencor Technologies Corporation Apparatus comprising a flexible vacuum seal pad structure capable of retaining non-planar substrates thereto
US20050110292A1 (en) * 2002-11-26 2005-05-26 Axcelis Technologies, Inc. Ceramic end effector for micro circuit manufacturing
US7641247B2 (en) * 2002-12-17 2010-01-05 Applied Materials, Inc. End effector assembly for supporting a substrate
US7726715B2 (en) 2003-01-29 2010-06-01 Mitsuboshi Diamond Industrial Co., Ltd. Vacuum suction head
US7055875B2 (en) * 2003-07-11 2006-06-06 Asyst Technologies, Inc. Ultra low contact area end effector
CA2756836C (en) * 2009-03-31 2017-02-28 Ats Automation Tooling Systems Inc. Vacuum gripper assembly stabilized by springs
US8801069B2 (en) * 2010-02-26 2014-08-12 Brooks Automation, Inc. Robot edge contact gripper
JP5345167B2 (en) * 2011-03-18 2013-11-20 東京エレクトロン株式会社 Substrate holding device
JP2014176914A (en) 2013-03-14 2014-09-25 Nippon Electric Glass Co Ltd Suction pad and suction device
JP5861677B2 (en) * 2013-07-08 2016-02-16 株式会社安川電機 Adsorption structure, robot hand and robot
US9991152B2 (en) * 2014-03-06 2018-06-05 Cascade Microtech, Inc. Wafer-handling end effectors with wafer-contacting surfaces and sealing structures
NL2014625B1 (en) * 2015-04-13 2017-01-06 Suss Microtec Lithography Gmbh Wafer treating device and sealing ring for a wafer treating device.

Also Published As

Publication number Publication date
AT519587A2 (en) 2018-08-15
CN108364903A (en) 2018-08-03
KR102344555B1 (en) 2021-12-28
US10259124B2 (en) 2019-04-16
AT519587B1 (en) 2021-10-15
NL2018243B1 (en) 2018-08-07
TW201831290A (en) 2018-09-01
JP2018157194A (en) 2018-10-04
AT519587A3 (en) 2020-02-15
KR20180088598A (en) 2018-08-06
TWI710438B (en) 2020-11-21
DE102018100856A1 (en) 2018-08-02
US20180215049A1 (en) 2018-08-02

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