TW200617624A - Composition for removing a photoresist - Google Patents

Composition for removing a photoresist

Info

Publication number
TW200617624A
TW200617624A TW094131378A TW94131378A TW200617624A TW 200617624 A TW200617624 A TW 200617624A TW 094131378 A TW094131378 A TW 094131378A TW 94131378 A TW94131378 A TW 94131378A TW 200617624 A TW200617624 A TW 200617624A
Authority
TW
Taiwan
Prior art keywords
liquid composition
stripping
photoresist
composition
solvent
Prior art date
Application number
TW094131378A
Other languages
English (en)
Other versions
TWI402636B (zh
Inventor
Suk-Il Yoon
Seong-Bae Kim
Wy-Yong Kim
Jong-Hyun Jeong
Soon-Beom Huh
Byung-Uk Kim
Original Assignee
Dongjin Semichem Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dongjin Semichem Co Ltd filed Critical Dongjin Semichem Co Ltd
Publication of TW200617624A publication Critical patent/TW200617624A/zh
Application granted granted Critical
Publication of TWI402636B publication Critical patent/TWI402636B/zh

Links

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Wood Science & Technology (AREA)
  • Organic Chemistry (AREA)
  • Liquid Crystal (AREA)
TW094131378A 2004-09-13 2005-09-12 光阻劑剝離液組成物 TWI402636B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020040072921A KR20060024478A (ko) 2004-09-13 2004-09-13 포토레지스트 박리액 조성물

Publications (2)

Publication Number Publication Date
TW200617624A true TW200617624A (en) 2006-06-01
TWI402636B TWI402636B (zh) 2013-07-21

Family

ID=36158552

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094131378A TWI402636B (zh) 2004-09-13 2005-09-12 光阻劑剝離液組成物

Country Status (4)

Country Link
JP (1) JP2006079093A (zh)
KR (1) KR20060024478A (zh)
CN (1) CN100578368C (zh)
TW (1) TWI402636B (zh)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101136026B1 (ko) 2004-09-24 2012-04-18 주식회사 동진쎄미켐 포토레지스트용 박리제 및 상기 박리제를 이용한 박막트랜지스터 표시판의 제조 방법
JP4902299B2 (ja) * 2006-09-11 2012-03-21 三星電子株式会社 表示装置の製造方法
KR20100003526A (ko) * 2008-07-01 2010-01-11 삼성전자주식회사 박리제 및 상기 박리제를 사용한 표시판의 제조 방법
WO2011019189A2 (ko) 2009-08-11 2011-02-17 동우 화인켐 주식회사 레지스트 박리액 조성물 및 이를 이용한 레지스트의 박리방법
JP5279921B2 (ja) * 2009-11-26 2013-09-04 エルジー・ケム・リミテッド フォトレジストストリッパー組成物及びこれを利用したフォトレジストの剥離方法
KR101008373B1 (ko) * 2009-11-26 2011-01-13 주식회사 엘지화학 포토레지스트 스트리퍼 조성물 및 이를 이용한 포토레지스트 박리방법
TWI405053B (zh) * 2009-11-27 2013-08-11 Lg Chemical Ltd 光阻剝離組成物及剝離光阻之方法
WO2014098487A1 (ko) 2012-12-18 2014-06-26 포항공과대학교 산학협력단 건식 박리 장치, 건식 박리를 위한 고속 입자 빔을 생성하는 노즐 및 고속 입자 빔을 이용한 건식 박리 방법.
WO2014181992A1 (ko) * 2013-05-07 2014-11-13 주식회사 엘지화학 포토레지스트 제거용 스트리퍼 조성물 및 이를 사용한 포토레지스트의 박리방법
KR101668063B1 (ko) * 2013-05-07 2016-10-20 주식회사 엘지화학 포토레지스트 제거용 스트리퍼 조성물 및 이를 사용한 포토레지스트의 박리방법
CN103425001A (zh) * 2013-07-19 2013-12-04 杨桂望 抗蚀剂膜清洗组合物
JP5575318B1 (ja) * 2013-09-02 2014-08-20 パナソニック株式会社 レジスト剥離液
KR102119438B1 (ko) * 2013-10-30 2020-06-08 삼성디스플레이 주식회사 박리액 및 이를 이용한 표시 장치의 제조방법
KR101586453B1 (ko) * 2014-08-20 2016-01-21 주식회사 엘지화학 포토레지스트 제거용 스트리퍼 조성물 및 이를 이용한 포토레지스트의 박리방법
US10190222B2 (en) 2015-05-28 2019-01-29 Ecolab Usa Inc. Corrosion inhibitors
MX2017015289A (es) 2015-05-28 2018-02-19 Ecolab Usa Inc Inhibidores de corrosion de imidazol y bencimidazol 2-sustituidos.
AU2016267611B2 (en) * 2015-05-28 2021-12-09 Ecolab Usa Inc. Water-soluble pyrazole derivatives as corrosion inhibitors
CA2987055C (en) 2015-05-28 2023-10-17 Ecolab Usa Inc. Purine-based corrosion inhibitors
US11402759B2 (en) 2015-06-13 2022-08-02 Npics Inc. Dry separation apparatus, nozzle for generating high-speed particle beam for dry separation
KR20180087624A (ko) * 2017-01-25 2018-08-02 동우 화인켐 주식회사 레지스트 박리액 조성물
CN108828910A (zh) * 2018-06-21 2018-11-16 深圳达诚清洗剂有限公司 一种正性光刻胶清洗组合物及其制备方法
CN113614647A (zh) * 2019-03-25 2021-11-05 松下知识产权经营株式会社 抗蚀剂剥离液
TWI812342B (zh) * 2021-11-22 2023-08-11 南韓商Ｌｇ化學股份有限公司 移除光阻之剝離劑組成物以及使用其之剝離光阻方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000162788A (ja) * 1998-11-27 2000-06-16 Tokyo Ohka Kogyo Co Ltd 銅配線形成基板に用いるホトレジスト用剥離液組成物およびこれを用いたレジスト剥離方法
JP4229552B2 (ja) * 1998-12-25 2009-02-25 東京応化工業株式会社 ホトレジスト用剥離液組成物およびこれを用いたホトレジスト剥離方法
JP2001183849A (ja) * 1999-12-27 2001-07-06 Tokyo Ohka Kogyo Co Ltd ホトレジスト用剥離液およびこれを用いたホトレジスト剥離方法
DE60108286T2 (de) * 2000-03-27 2005-12-29 Shipley Co., L.L.C., Marlborough Entfernungsmittel für Polymer
JP4470328B2 (ja) * 2001-02-09 2010-06-02 東ソー株式会社 レジスト剥離剤
JP2002244310A (ja) * 2001-02-21 2002-08-30 Tosoh Corp レジスト剥離剤
JP4483114B2 (ja) * 2001-03-30 2010-06-16 東ソー株式会社 レジスト剥離剤
JP4165208B2 (ja) * 2002-12-24 2008-10-15 東ソー株式会社 レジスト剥離方法

Also Published As

Publication number Publication date
TWI402636B (zh) 2013-07-21
KR20060024478A (ko) 2006-03-17
JP2006079093A (ja) 2006-03-23
CN1758144A (zh) 2006-04-12
CN100578368C (zh) 2010-01-06

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