TW200614370A - Vacuum processing equipment - Google Patents

Vacuum processing equipment

Info

Publication number
TW200614370A
TW200614370A TW094127686A TW94127686A TW200614370A TW 200614370 A TW200614370 A TW 200614370A TW 094127686 A TW094127686 A TW 094127686A TW 94127686 A TW94127686 A TW 94127686A TW 200614370 A TW200614370 A TW 200614370A
Authority
TW
Taiwan
Prior art keywords
vacuum processing
vacuum
upper cap
processing machine
processing equipment
Prior art date
Application number
TW094127686A
Other languages
English (en)
Other versions
TWI298910B (en
Inventor
Tatsuhiro Taguchi
Original Assignee
Shimadzu Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shimadzu Corp filed Critical Shimadzu Corp
Publication of TW200614370A publication Critical patent/TW200614370A/zh
Application granted granted Critical
Publication of TWI298910B publication Critical patent/TWI298910B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32082—Radio frequency generated discharge
    • H01J37/32174—Circuits specially adapted for controlling the RF discharge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Analytical Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Plasma & Fusion (AREA)
  • Robotics (AREA)
  • Drying Of Semiconductors (AREA)
  • Physical Vapour Deposition (AREA)
  • Chemical Vapour Deposition (AREA)
  • Drying Of Solid Materials (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
TW094127686A 2004-10-29 2005-08-15 Vacuum processing equipment TWI298910B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004315095A JP4432728B2 (ja) 2004-10-29 2004-10-29 真空処理装置

Publications (2)

Publication Number Publication Date
TW200614370A true TW200614370A (en) 2006-05-01
TWI298910B TWI298910B (en) 2008-07-11

Family

ID=36718062

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094127686A TWI298910B (en) 2004-10-29 2005-08-15 Vacuum processing equipment

Country Status (4)

Country Link
JP (1) JP4432728B2 (zh)
KR (1) KR100629805B1 (zh)
CN (1) CN100382237C (zh)
TW (1) TWI298910B (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI596692B (zh) * 2016-06-08 2017-08-21 漢民科技股份有限公司 應用於半導體設備之組裝裝置

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100790797B1 (ko) * 2006-06-08 2008-01-02 주식회사 아이피에스 진공처리장치
JP5196474B2 (ja) * 2008-01-29 2013-05-15 サムコ株式会社 薄膜製造装置
KR101066033B1 (ko) * 2009-07-28 2011-09-20 엘아이지에이디피 주식회사 화학기상 증착장치 및 기판 처리장치
JP5595202B2 (ja) * 2010-09-28 2014-09-24 東京エレクトロン株式会社 処理装置およびそのメンテナンス方法
JP6293499B2 (ja) * 2014-01-27 2018-03-14 株式会社日立ハイテクノロジーズ 真空処理装置
CN103818861A (zh) * 2014-03-12 2014-05-28 合肥彩虹蓝光科技有限公司 一种反应室腔体上盖起降系统
JP5941943B2 (ja) * 2014-05-08 2016-06-29 ワイエイシイ株式会社 蓋体開閉装置およびマルチチャンバー処理システム

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1050798A (ja) * 1996-08-02 1998-02-20 Kokusai Electric Co Ltd 真空処理装置のロードロック室
JPH10237653A (ja) * 1997-02-26 1998-09-08 Ulvac Japan Ltd 真空処理装置
JP3076775B2 (ja) * 1997-07-31 2000-08-14 芝浦メカトロニクス株式会社 真空処理装置
JP3527450B2 (ja) * 1999-12-22 2004-05-17 東京エレクトロン株式会社 処理装置
JP2002164685A (ja) * 2000-11-29 2002-06-07 Matsushita Electric Ind Co Ltd 真空処理装置と電磁シールド装置及び傾斜コイルばね

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI596692B (zh) * 2016-06-08 2017-08-21 漢民科技股份有限公司 應用於半導體設備之組裝裝置

Also Published As

Publication number Publication date
KR20060050432A (ko) 2006-05-19
TWI298910B (en) 2008-07-11
KR100629805B1 (ko) 2006-09-28
JP2006122825A (ja) 2006-05-18
CN100382237C (zh) 2008-04-16
CN1767145A (zh) 2006-05-03
JP4432728B2 (ja) 2010-03-17

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees