TWI298910B - Vacuum processing equipment - Google Patents

Vacuum processing equipment Download PDF

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Publication number
TWI298910B
TWI298910B TW094127686A TW94127686A TWI298910B TW I298910 B TWI298910 B TW I298910B TW 094127686 A TW094127686 A TW 094127686A TW 94127686 A TW94127686 A TW 94127686A TW I298910 B TWI298910 B TW I298910B
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Taiwan
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vacuum
substrate
vacuum processing
cover
upper cover
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TW094127686A
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Chinese (zh)
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TW200614370A (en
Inventor
Tatsuhiro Taguchi
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Shimadzu Corp
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32082—Radio frequency generated discharge
    • H01J37/32174—Circuits specially adapted for controlling the RF discharge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Robotics (AREA)
  • Drying Of Semiconductors (AREA)
  • Physical Vapour Deposition (AREA)
  • Chemical Vapour Deposition (AREA)
  • Drying Of Solid Materials (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Description

I29897liiif.doc 九、發明說明： 【發明所屬之技術領域】 本發明為關於-種真空 可在真空狀態中進行薄膜 衣置，特別疋有關於一種 處理裝置。 ^成，飿刻及熱處理等之真空 【先前技術】 真空處理裝置設有真空 物之處理，以及蓋部件 Z ’可在真S巾進行被處理 的靠真空容器側之表面，配自在裝卸。在蓋部件 :頭)。該蓋部件在真空處理如 容器脫離。將蓋部件===之維護時’可自真空 部件在水平㈣滑動的滑卸絲卸機構，有將蓋 為中rr嶋構水平軸 第2頁【專=獻π日本專利特開跡， =2獻丨中所述的真空處縣置，在配置於該 侧的表面之零件維修期中，該蓋部件ΐ能 …能進行真空處理，有裝置停止時間 【發明内容】 有鑑㈣，本發明的目的在於提出一種真 置，用以解決裝置停止時間過長之問題。 衣 ⑴本發明第1項所述的真空處理裝置包括：真空容 7 ^9894^ifdoc 器、蓋部件、升降機構與旋 的真空處理。蓋部件二以 :轉蓋部件對真空容器裝卸自在地:：^ 蓋部件連結的旋轉軸，使蓋部件:表 置η絲轉’其特欲為在該蓋部件的表㈣面，對稱讯 置冋-種的真空處理用機器。 田對％叹 的直=本發明第㈣之真空處理裝置，為如^項所述 部件;心==為= 平板狀’該旋轉軸與蓋 為較佳。 致，以及盍部件的旋軸角為180。 1項H本發明第3項之真空處理裝置，其特徵為在如第 放所述的真空處理裝置中加設-可切換大氣開 器，同時：产 =2’其職纽基板投入真空容 乍為已處理兀的基板從真空容器回收被處理基板。 m發明的真空處理裝置，因在蓋部件的表裡兩面對稱 種的真空處理用機器，故在—面的真空處理用機 :、W，仍可使用他面的真空處理用機器進行真空處 ’故能夠縮短裝置停止時間。 為讓本發明之上述和其他目的、特徵和優點能更明顯 明如下了謂舉雛實棚，魏合所額式，作詳細說 【實施方式】 ^下參考圖1至圖3說明本發明實施例的真空處理 h置。 8 i29_ifdoc 模式發:之實施例的真空處理裝置之構造的I29897liiif.doc IX. Description of the Invention: [Technical Field of the Invention] The present invention relates to a vacuum coating in a vacuum state, and more particularly to a processing apparatus. Vacuum of forming, engraving, heat treatment, etc. [Prior Art] The vacuum processing apparatus is provided with a vacuum treatment, and the cover member Z' can be attached and detached on the surface of the vacuum container side where the genuine S towel is processed. In the cover part: head). The cover member is detached in a vacuum process such as a container. When the cover part === maintenance, the sliding unloading mechanism that can slide from the vacuum part in the horizontal (four), there will be the cover as the middle rr嶋 horizontal axis page 2 [special = offer π Japanese patent special opening, = (2) The vacuum chamber described in the 丨 , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , The purpose is to propose a real solution to solve the problem that the device stops for too long. (1) The vacuum processing apparatus according to item 1 of the present invention comprises: a vacuum chamber, a lid member, a lifting mechanism, and a vacuum treatment of the screw. The cover member 2 is: the cover member is detachably attached to the vacuum container:: ^ The rotating shaft to which the cover member is coupled, so that the cover member: the surface is turned into a η wire, which is intended to be symmetrically placed on the surface (four) of the cover member冋-type vacuum processing machine. Straight to the sigh of the sigh = the vacuum processing apparatus of the fourth aspect of the present invention is the member as described in the item; the heart == is = flat shape, and the rotating shaft and the cover are preferable. The resulting and the 盍 part has a rotation angle of 180. The invention relates to a vacuum processing device according to the third aspect of the invention, characterized in that in the vacuum processing device as described in the first embodiment, a - switchable atmosphere opener is added, and at the same time: the production = 2' The substrate to be processed is recovered from the vacuum container for the processed substrate. In the vacuum processing apparatus of the invention, since the vacuum processing apparatus is symmetrically formed on both sides of the cover member, the vacuum processing machine of the surface can be vacuumed by the vacuum processing machine of the surface. Therefore, the device stop time can be shortened. The above and other objects, features and advantages of the present invention will become more apparent from the following description. The vacuum treatment of the example is set. 8 i29_ifdoc mode transmission: the construction of the vacuum processing device of the embodiment

直交座標表示方向°。、件用同付麵示’用XYZ 圖1中，真空處理裝置1〇〇 A由奘 _理室20的兩個 ^二载/卸載室10及電 對裝置外部的門二!:=。*載/卸栽室10設有面 的交界處理室 出搬入時開放魏/卸載11G 土向裝置外部搬 門⑺是密閉著的。門G2在从入以外之時間’ 内，在基板W搬出搬入時開;兩個室處内理之際密閉兩個室 卜二内二置自動搬送裝置11 ’可將基板 田衣直外口|5搬入达到電漿處理 =電漿處理室2。搬入再搬出到裝置夕;部 10有配管連接排氣系統12與泄 裝载/卸載至 大氣開放與真空密閉之構造^〜、、’’ /、為可切換成 電漿處理室20包含：真空容哭 ^，狀的上蓋30用_"二用有二口:: 内，設有二1 成密閉之室。在真空容二 又啕加熱基扳w用的加熱器21。The orthogonal coordinates indicate the direction °. In the case of the XYZ in Fig. 1, the vacuum processing apparatus 1A is composed of two ^ two loading/unloading chambers 10 of the chamber 20 and a door two outside the pairing device!:=. * The loading/unloading chamber 10 is provided with a surface junction processing chamber. When the loading/unloading chamber is opened, the opening/unloading 11G earth moving device external moving door (7) is sealed. The door G2 is opened when the substrate W is carried out and carried in at a time other than the entrance; the two chambers are sealed at the time of internal processing, and the two chambers are internally placed in the second automatic transfer device 11'. 5 Move into the plasma treatment = plasma processing chamber 2. The loading and re-moving to the device eve; the portion 10 has a pipe connecting the exhaust system 12 and the venting/unloading to the atmosphere opening and vacuum sealing structure ^~,, '' /, can be switched into the plasma processing chamber 20 including: vacuum Rong Chou ^, the shape of the upper cover 30 with _" two with two:: inside, with two 1 into a closed room. In the vacuum capacity, the heater 21 for heating the base is used.

= 各樓咖㈣H ^及31b對稱配置。即將上蓋3〇上下反轉時 129897祕胸。c 處理至20内真空處理用機器31&及31b配置在同/位置。 在上盍30的一方之側面之中央，有旋轉軸32&突出設置； 在另一方的侧面之中央，有旋轉轴，其與旋轉軸32b 成同一軸線突出設置。 真空處理用機态31a及31b，具體地說，包含形成電 裝的RF電極、將氣體材料導入裝置内的氣體導入口，及 ，止蒸著物附著的防著板等。真空處理用機器31a及31b 疋屬於同一機器，但為說明方便，用不同符號表开。電漿 瞻處理室20有配管連接排氣系統22及氣體導入系統23，在 所定的氣體壓力下，對基板W進行電漿處理，例如成膜、 蝕刻（etching)、濺鍍（sputtering)等。 如圖1及圖2所示，上蓋3〇由設在升降架6〇上的旋 轉機構50而能表面裡面反轉地被支持。升降架6〇在其四 角有四個升降機構40可在Z方向升降地支持。升降^ 4〇各備配馬達41、將馬達41的旋轉力變換成直線運 之力的等徑傘齒輪箱42，以及由等徑傘齒輪箱42驅動做 • 升降運動的螺旋起重機43。旋轉機構50配置有，附蝸 減速枝馬達51、由馬達51的輸出軸之旋轉力驅動旋轉的 旋轉軸52、支持上蓋30的旋轉軸32a之軸承部53，以及 支持上蓋30之旋轉軸32b的軸承部54。 旋轉軸52有與X方向平行的軸線，經未圖示的聯軸 器（coupling)連結旋轉軸32a。當旋轉軸52轉動時如^工 的旋轉動作R所示，上蓋30亦繞著旋轉軸52轉動。 螺旋起重器43向Z方向移動時，如圖中的升降動作μ所 12989她 if.doc 示，上盍30亦向Z方向移動。亦即，將上蓋30並行移動， <脱離真空容器2〇a。又在圖丨中，為方便說明升降動作 M，圖中一併顯示上蓋30與真空容器2〇a密接之狀態，及 上蓋=脫離真空容器20a的狀態（以虛線圖示）。 付號XI X4’表示真空處理裝置1〇〇運轉之時基板％ 的移送動作。動作X1為基板w通過門G1的動作 動搬达機器11將未處理的基板w，由裝置外部搬入大氣 開放的裝載，载室10之動作。動作X2為基板w通過門 G2的動作’即自動搬送機器u將未處理的基板w， 二，1電漿處理室20之動作。此時裝載/卸 動作、\3^其1室2〇兩方為同程度的真空或減壓狀態。 切Τ入3為基板W通過門G2夕日Γ7 A工， 器11將處理好的基板w，由電 ^自動搬送機 卸載"之動作。此時二 π兩方亦成_度的真空或降壓狀^動作 通過門G1之動作，即由自動 好二 w’自大氣開放的_載室二== 里好的基板 由如上述的—遠自至Ml出裝置外部的動作。 的基板W收回。、’5亥未處理的基板W作為處理畢 的動:參：二f乍說:2°維修時上蓋3。 上蓋30的真空處理=H盗20a内部的維修，及 各圖為圖！的真空處理褒置：。圖侧 降機構4。或旋轉機構5〇等圖4:x方向所見之圖，升 I2989il20pif.doc 3(a) ’所示基板w的電漿處理完成後要搬出 的已城大氣壓力狀態。此時，在該電漿處理所用 上侧器…位在上蓋3〇的下側，位在上蓋30 、為、准I完畢的真空處理用機器31b。 圖剛’所示原冑著於真空容器20a的上蓋30，其 離直d:的上升動作M卜向+Z方向並進移動而脫 并^ 以使開口部A對大氣開放。上蓋30的上 之設定’需滿足以下的兩個條件。第―，滿足真空 二二著 21的維護作業，或在真空容器施 在圖二Ϊ” 清理作業所必要的距離，第二條件 θ ^月，是將上蓋30表裡反轉所必要的距離。 的旋蓋3G上升後停止，再由旋轉機構50 择 對與X方向平行的旋轉軸52旋轉90。之角 ‘ Ρ5Γ=狀態的上蓋3G轉成垂直狀態。如前所述，旋 ί = 在=n3G _面中央突出設置的旋轉㈣ 的上升距離為上蓋3㈣γ方向邊長 雲30的側面ψ止'30可做旋轉動作。因旋轉軸52與上 二匕的側面中央之旋轉軸32a連結，故重 好，可 使上盍30平穩轉動。又，虛線 — 、 旋轉之途中的狀態。 、、^、上蓋30為進行90。 在圖3(d)，所示上蓋30旋轉 的水平狀態旋轉18〇。角度，在上 R再繼續，由初期 成之後，將上蓋30依下降動作^ 白勺表裡反轉動作完 此時位在上蓋3〇的下儀是方向並進移動。 野維修作業的真空處理 12 I298_ifdoc 用機器31b，位在上蓋30的上面為電漿處理使用過的真空 處理用機器31a。真空容器20a的内藏零件（加熱器2/等=) 的維護作業，或真空容器20a的内壁附著的蒸著物之清理 作業等，可在開口部A開放的圖3(b)〜(d)的任一時間進$于。 在圖3(e)，所示真空容器20a内的維護作業或清理作 業完成後，將上蓋30在真空容器20a上密著，而使真空容 器20a與上蓋30構成的密閉室内，進行由大氣壓排氣至= 定的真空氣壓。在此狀態如上所述，在上蓋3〇的下側有維 修择林真空處理用機器31b，故在基板冒搬入時，立即可 開始進行電漿處理。又與電漿處理之同時，可進行位在上 蓋30之上侧的真空處理用機器3丨a的維修作業。該維修 業包括清洗、零件交換、零件調整等。 、本案實施例的真空處理裝置，在平板狀的上蓋3〇之表 裡兩面對稱的配置同一種的真空處理用機器31&、， 上盍30對真空容器20a著脫自在地平行移動，再將上芸 30依與其表面平行之軸的旋轉轴32a、32b旋 | 可得下述的效果。 第一、因用真空處理用機器训的電漿處理鱼直 理用機器31a的維修作業可同時並行，該部份時卩柯 =于真空上處，;因此，能夠縮短處理時間及農置停止 二 的移動方向為上下向，在真空處理裝 内，可作上蓋3G的著脫及旋轉， 可在最小空間完成。 ^ 本發明可適用於各種構造的真空處理襄置。本實施例 I29897MWd〇c 的真空處理裝置100，為裝載/卸載室1〇及電漿處理室如 之兩個室連結之構造。但將裝載/卸載室10的功能分成兩 室，中間挾持電漿處理室20，形成配備搬入未處理之基板 W的裝載室及搬出處理後的基板w至裝置外的卸載^之 一至的真空處理裝置亦可。又，上蓋30、升降機構4〇及 方疋轉機構50，不限於設在進行電漿處理之處理室，其他進 行真空處理的密室（Camber)亦可設置。例如設在進行直= Each building (4) H ^ and 31b are symmetrically arranged. The top cover is 3 〇 up and down when the 129,897 secret chest. c The vacuum processing machines 31 & and 31b are disposed at the same/position in the processing to 20. In the center of the side of one of the upper jaws 30, there is a rotating shaft 32 & a protruding shaft; and in the center of the other side surface, there is a rotating shaft which is provided on the same axis as the rotating shaft 32b. Specifically, the vacuum processing modes 31a and 31b include an RF electrode for forming an electric device, a gas introduction port for introducing a gas material into the device, and a prevention plate for adhering the vaporized material. The vacuum processing machines 31a and 31b belong to the same machine, but are illustrated by different symbols for convenience of explanation. The plasma processing chamber 20 has a piping connection exhaust system 22 and a gas introduction system 23, and performs plasma treatment on the substrate W under a predetermined gas pressure, for example, film formation, etching, sputtering, and the like. As shown in Figs. 1 and 2, the upper cover 3 is supported by the rotary mechanism 50 provided on the lift frame 6 to be reversely supported on the surface. The lifting frame 6 has four lifting mechanisms 40 at its four corners that can be supported in the Z direction. Each of the spare motor 41, the equal-diameter bevel gear case 42 that converts the rotational force of the motor 41 into a linear force, and a screw crane 43 that is driven by the equal-diameter bevel gear case 42 to perform the lifting movement are provided. The rotation mechanism 50 is provided with a worm gear motor 51, a rotation shaft 52 that is driven to rotate by the rotational force of the output shaft of the motor 51, a bearing portion 53 that supports the rotation shaft 32a of the upper cover 30, and a rotation shaft 32b that supports the upper cover 30. Bearing portion 54. The rotating shaft 52 has an axis parallel to the X direction, and the rotating shaft 32a is coupled via a coupling (not shown). When the rotary shaft 52 rotates, as shown by the rotary motion R, the upper cover 30 also rotates about the rotary shaft 52. When the screw jack 43 moves in the Z direction, as shown by the ascending action μ in the figure 12989, if.doc, the upper jaw 30 also moves in the Z direction. That is, the upper cover 30 is moved in parallel, <the vacuum container 2〇a is detached. Further, in the drawing, in order to facilitate the explanation of the lifting operation M, the state in which the upper cover 30 is in close contact with the vacuum container 2A is shown, and the upper cover = the state in which the vacuum container 20a is detached (shown by a broken line). The payout number XI X4' indicates the transfer operation of the substrate % at the time of the operation of the vacuum processing apparatus 1 . The operation X1 is an operation in which the substrate w passes through the operation of the door G1, and the unprocessed substrate w is carried by the device 11 and is carried into the atmosphere by the outside of the device. The operation X2 is an operation of the substrate w through the door G2, that is, the automatic transfer device u operates the unprocessed substrate w, the second and the first plasma processing chamber 20. At this time, the loading/unloading action, \3^1 room 2〇 is the same degree of vacuum or decompression. The cut-in 3 is the operation of the substrate W through the gate G2, and the device 11 unloads the processed substrate w by the automatic transfer machine. At this time, the two π squares also become _ degrees of vacuum or step-down action ^ through the action of the door G1, that is, by the automatic good two w' from the atmosphere open _ carrier chamber = = good substrate from the above - far from Move to the outside of the device to M1. The substrate W is retracted. , "5 Hai unprocessed substrate W as the processing of the movement: Reference: two f乍 said: 2 ° maintenance cover 3. The vacuum treatment of the upper cover 30 = the maintenance inside the H burglary 20a, and each figure is a picture! Vacuum processing device: Figure side down mechanism 4. Or the rotating mechanism 5〇, etc. Figure 4: The view seen in the x direction, the I2989il20pif.doc 3(a) ’ shows the atmospheric pressure state of the substrate w after the plasma treatment is completed. At this time, the upper side of the plasma processing is placed on the lower side of the upper cover 3, and is placed in the upper cover 30, and the vacuum processing apparatus 31b is completed. The upper cover 30 of the vacuum container 20a is shown in the figure, and the upward movement Mb of the straight d: is moved in the +Z direction to be separated and opened so that the opening A is opened to the atmosphere. The setting of the upper portion of the upper cover 30 is required to satisfy the following two conditions. The first, the maintenance work of the vacuum 22 or 21, or the vacuum vessel is applied to the distance necessary for the cleaning operation, and the second condition θ ^ month is the distance necessary to reverse the upper cover 30. The cap 3G is raised and then stopped, and then the rotating shaft 52 parallel to the X direction is rotated by 90 by the rotating mechanism 50. The upper cover 3G of the angle 'Ρ5Γ= state is turned into a vertical state. As described above, the rotation ί = at = The rising distance of the rotation of the n3G _ plane in the center (4) is the upper cover 3 (four) γ direction side length of the cloud 30 side ' '30 can be rotated. Since the rotating shaft 52 is connected with the rotating shaft 32a of the center of the upper side of the upper side, it is heavy For example, the upper cymbal 30 can be smoothly rotated. Further, the dotted line - the state in the middle of the rotation. The upper cover 30 is 90. In Fig. 3 (d), the horizontal state in which the upper cover 30 is rotated is rotated by 18 。. The angle is continued on the upper R. After the initial stage, the upper cover 30 is reversed according to the downward movement. The lower position of the upper cover is moved in the direction of the upper cover. The vacuum treatment of the field maintenance work 12 I298_ifdoc is placed on the top of the upper cover 30 by the machine 31b. The plasma processing machine 31a is used for the plasma treatment, and the maintenance work of the built-in parts (heater 2/etc.) of the vacuum container 20a or the cleaning operation of the vaporized material adhered to the inner wall of the vacuum container 20a can be opened. At any time of FIG. 3(b) to (d) in which the portion A is opened, the value is increased. After the maintenance work or the cleaning operation in the vacuum container 20a shown in FIG. 3(e) is completed, the upper cover 30 is placed in the vacuum container 20a. In the closed chamber formed by the vacuum container 20a and the upper cover 30, the vacuum chamber 20a is evacuated to a predetermined vacuum pressure. In this state, as described above, the lower side of the upper cover 3〇 is provided for maintenance of the vacuum treatment. In the case of the machine 31b, the plasma processing can be started immediately when the substrate is loaded in. The plasma processing can be performed on the upper side of the upper cover 30 while the plasma processing is performed. Including the cleaning, the parts exchange, the parts adjustment, etc. The vacuum processing apparatus of the embodiment of the present invention is configured such that the same type of vacuum processing machine 31&, and the upper 30 pairs of vacuum containers are arranged symmetrically on both sides of the flat top cover 3〇. 20a is off the ground After the movement, the upper cymbal 30 is rotated by the rotation shafts 32a and 32b of the axis parallel to the surface thereof. The following effects can be obtained. First, the maintenance of the fish physiotherapy machine 31a by the plasma treatment using the vacuum processing machine The operation can be paralleled at the same time. In this part, the 卩 = = is on the vacuum; therefore, the processing time can be shortened and the moving direction of the agricultural stop 2 is up and down, and in the vacuum processing device, the upper cover 3G can be removed. The rotation can be completed in a minimum space. ^ The present invention can be applied to vacuum processing devices of various configurations. The vacuum processing device 100 of the present embodiment I29897MWd〇c is a loading/unloading chamber 1 and a plasma processing chamber. The structure of the room connection. However, the function of the loading/unloading chamber 10 is divided into two chambers, and the plasma processing chamber 20 is held in the middle to form a vacuum chamber in which the loading chamber loaded with the unprocessed substrate W and the substrate w after the unloading process are removed to the outside of the device. The device is also available. Further, the upper cover 30, the elevating mechanism 4A, and the side turn mechanism 50 are not limited to being disposed in a processing chamber for performing plasma processing, and other chambers (Camber) for performing vacuum processing may be provided. For example, set straight

空加熱的室内之場合，該真空處理用機器有燈管加^器 (lamp heater)或板發熱器(plate heater)。 …口口 —又，升降機構40及旋轉機構5〇亦不受本實施例的限 定，只要能對電漿處理室20的開口部A進行升降，以^ 在開口部A 之狀態旋轉上蓋3〇使表裡面反轉之 構，則各種形式皆可使用。又，上蓋3G即對應前述之 件。 意口丨 =本發明已雜佳實闕減如上，財並非用以 限疋本务明，任何熟習此技藝者，在不脫離本發明之精神 !範;内:當可作些許之更動與潤飾，因此本發日 =;申 耗圍§視後附之申請專利範圍所界定者為準。 ’、 【圖式簡單說明】 模為本魏之實施觸真空處縣置之構造的 衩式化全體構造圖。 八的=所*為本發日狀實施真空處縣置之主要部 刀的外硯之模式化斜視圖。 圖3所示為本發明之實施例的真空處理裝置之上蓋的 14 I29897l£|)if.d〇c 動作說明之模式圖。 【主要元件符號說明】 ίο:裝載/卸載器 11 :自動搬送機器 12、22 :排氣系統 13 :泄漏系統 20 :電漿處理室 20a :真空容器 21 :加熱器 23 :氣體導入系統 30 :上蓋 31a、31b :真空處理用機器 32a、32b :旋轉軸 40 :升降機構 41 :馬達 42 :等徑傘齒輪箱 43 :螺旋起重器 50 :旋轉機構 51 :附媧輪減速機馬達 52 :旋轉軸 53、54 :軸承部 60 :升降架 100 :真空處理裝置 A :開口部 15 I29897l20if.doc G1 、 G2 :严1 Μ :升降動作 R:旋轉動作 W :基板 XI〜X4 :移送動作In the case of an empty heating chamber, the vacuum processing machine has a lamp heater or a plate heater. In other words, the elevating mechanism 40 and the rotating mechanism 5 are not limited to the embodiment, and as long as the opening A of the plasma processing chamber 20 can be raised and lowered, the upper cover 3 can be rotated in the state of the opening A. Various forms can be used to reverse the structure inside the table. Further, the upper cover 3G corresponds to the aforementioned one.义口丨=The invention has been mixed and reduced as above, and the money is not limited to the basics. Anyone who is familiar with this skill can not lose the spirit of the invention! Fan: When you can make some changes and retouch Therefore, this is the date of the application; the application of the scope of application is subject to the definition of the scope of the patent application. ‘, [Simple description of the schema] The model is the overall structure of the structure of the construction of the county. The pattern of the outer part of the knives of the main part of the vacuum is the model. Fig. 3 is a schematic view showing the operation of the upper cover of the vacuum processing apparatus according to the embodiment of the present invention. [Main component symbol description] ίο: Loader/unloader 11: Automatic transfer machine 12, 22: Exhaust system 13: Leakage system 20: Plasma processing chamber 20a: Vacuum container 21: Heater 23: Gas introduction system 30: Top cover 31a, 31b: vacuum processing machines 32a, 32b: rotating shaft 40: lifting mechanism 41: motor 42: equal-diameter bevel gear box 43: screw jack 50: rotating mechanism 51: attached wheel reducer motor 52: rotating shaft 53, 54: Bearing unit 60: Lifting frame 100: Vacuum processing apparatus A: Opening part 15 I29897l20if.doc G1, G2: Strict 1 Μ : Lifting operation R: Rotation operation W: Substrate XI to X4: Transfer operation

Claims (1)

Ι2989ί〇ρ^〇〇 十、申請專利範圍·· 】·一種真空處理裝置，包括·· ^器用理基板的真空處理; :仵帛以開閉該真空容器的 . 升牛機構，使該蓋部件對該真空 ， 移動’ ·以及 、二合益表卸自在地並進 旋轉機構，其轉動與該蓋部 部件的表面與裡面反轉； 于建…的凝轉軸，使該蓋 的真空蓋部件的表趣兩面’對稱地配置同—種 徵/如申請專利範圍第】項所述的真空處理裝置，其特 該蓋部件為矩形平板狀； 與該蓋部件的側面之中心軸心-致;以及 5亥盖#件的旋轉角度為180。。 盛月專利1巳圍第1項或第2項所述的真空處理裝 置，更包括： 、可切換大氣開放和真空密閉狀態的交接室，其將所述 被處理基板投入所述真空容器，同時作為已處理完的基板 從所述真空容H时所述被處理基板。Ι2989ί〇ρ^〇〇10, the scope of application for patents····A vacuum processing device, including: vacuum processing of the substrate for use in the device; The vacuum, the moving '· and the two-in-one table are unloaded from the ground and the rotating mechanism is rotated, and the surface of the cover member is reversed from the inside; the condensation shaft of the building is made to make the vacuum cover part of the cover interesting. The vacuum processing device of the same type is symmetrically disposed on the two sides, and the cover member is a rectangular flat plate; the central axis of the side of the cover member is opposite; The cover # has a rotation angle of 180. . The vacuum processing apparatus according to Item 1 or 2, further comprising: a transfer chamber capable of switching between an open atmosphere and a vacuum sealed state, wherein the substrate to be processed is put into the vacuum container while The substrate to be processed when the processed substrate is from the vacuum capacity H.
TW094127686A 2004-10-29 2005-08-15 Vacuum processing equipment TWI298910B (en)

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KR100790797B1 (en) * 2006-06-08 2008-01-02 주식회사 아이피에스 Vacuum Processing Apparatus
JP5196474B2 (en) * 2008-01-29 2013-05-15 サムコ株式会社 Thin film manufacturing equipment
KR101066033B1 (en) * 2009-07-28 2011-09-20 엘아이지에이디피 주식회사 Apparatus for Chemical Vapor Deposition and Apparatus for processing substrate
JP5595202B2 (en) * 2010-09-28 2014-09-24 東京エレクトロン株式会社 Processing apparatus and maintenance method thereof
JP6293499B2 (en) * 2014-01-27 2018-03-14 株式会社日立ハイテクノロジーズ Vacuum processing equipment
CN103818861A (en) * 2014-03-12 2014-05-28 合肥彩虹蓝光科技有限公司 Upper cover lifting system of reaction chamber cavity body
JP5941943B2 (en) * 2014-05-08 2016-06-29 ワイエイシイ株式会社 Lid opening / closing device and multi-chamber processing system
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