JPS60238133A - Vacuum treatment apparatus - Google Patents
Vacuum treatment apparatusInfo
- Publication number
- JPS60238133A JPS60238133A JP7627084A JP7627084A JPS60238133A JP S60238133 A JPS60238133 A JP S60238133A JP 7627084 A JP7627084 A JP 7627084A JP 7627084 A JP7627084 A JP 7627084A JP S60238133 A JPS60238133 A JP S60238133A
- Authority
- JP
- Japan
- Prior art keywords
- support plate
- lock chamber
- vacuum
- load lock
- vacuum container
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
- B01J3/00—Processes of utilising sub-atmospheric or super-atmospheric pressure to effect chemical or physical change of matter; Apparatus therefor
- B01J3/006—Processes utilising sub-atmospheric pressure; Apparatus therefor
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Drying Of Semiconductors (AREA)
- Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
- Physical Vapour Deposition (AREA)
- Electrodes Of Semiconductors (AREA)
Abstract
Description
【発明の詳細な説明】
（発明の技術分野）
本発明は真空処理装置に係り、特に大気から真空容器へ
出し入れするためのロードロック室を短時間で減圧する
ことを可能とした真空処理装置に薗 １” ＾
（発明の技術的背景とその問題点〕
従来、真空処理装置には、被処理物を真空処理室に入れ
るときに、大気から真空にあらかじめ排気して真空処理
室と接続しな後に被処理物を入れるようになされるロー
ドロック室が設けられており、このロードロック室によ
り真空処理室の真空状態を維持するようになされている
。DETAILED DESCRIPTION OF THE INVENTION (Technical Field of the Invention) The present invention relates to a vacuum processing apparatus, and particularly to a vacuum processing apparatus that is capable of reducing the pressure in a load lock chamber for loading and unloading from the atmosphere into a vacuum container in a short period of time. Sono 1" ^ (Technical background of the invention and its problems) Conventionally, in vacuum processing equipment, when putting the workpiece into the vacuum processing chamber, it is necessary to evacuate the object from the atmosphere to a vacuum before connecting it to the vacuum processing chamber. A load-lock chamber is provided into which a workpiece is later placed, and this load-lock chamber maintains the vacuum state of the vacuum processing chamber.
上記ロードロック室は被処理物を収容した後極めて短時
間に減圧することが、生産効率を高める上で重要となっ
ている。In order to increase production efficiency, it is important to reduce the pressure in the load lock chamber in an extremely short time after storing the object to be processed.
しかし、通常ロードロック室には、被処理物を真空処理
室に移動させるための搬送装置や、０−ドロック室と真
空処理室とを仕切るためのゲートバルブあるいは高真空
に排気するための高真空排気ポンプの接続用ゲートバル
ブ等を配設する必要があるため、ロードロック室の容積
が真空処理物の容積に比べて数１０〜数１００倍になっ
てしまうことが多い。However, the load lock chamber usually includes a transfer device to move the workpiece to the vacuum processing chamber, a gate valve to separate the 0-lock chamber and the vacuum processing chamber, or a high vacuum device to evacuate the workpiece to a high vacuum. Since it is necessary to provide a gate valve for connecting the exhaust pump, etc., the volume of the load lock chamber is often several tens to hundreds of times larger than the volume of the vacuum-processed material.
そのため、ロードロック室の真空排気を短時間で行なう
ことができず、生産効率を低下させていた。また、短時
間で排気するためには、大型の真空ポンプを使用する必
要があり、経済的でないという欠点をも有している。Therefore, the load lock chamber could not be evacuated in a short time, reducing production efficiency. Furthermore, in order to evacuate the air in a short time, it is necessary to use a large-sized vacuum pump, which also has the disadvantage of being uneconomical.
本発明は上記した点に鑑みてなされたもので、ロードロ
ック室の真空排気を短時間で行なうことのできる真空処
理装置を提供することを目的とするものである。The present invention has been made in view of the above points, and an object of the present invention is to provide a vacuum processing apparatus that can evacuate a load lock chamber in a short time.
上記目的達成のため本発明に係る真空処理装置は、正面
形状円形状を有する真空容器の内部に、被処理物を固定
支持する支持板を、上記真空容器の内部を回転移動自在
であって前後方向に平行移動自在に複数設け、上記真空
容器の前面側に、上記前方に移動した支持板と開閉自在
な蓋体とにより上記真空容器の容積のおよそ ／ｉｏｏ
以下の容積を有するロードロック室を形成するようにし
て構成されており、上記ロードロック室の内部に搬送装
置やゲートバルブを設けず、容積の小型化を図るように
なされている。In order to achieve the above object, a vacuum processing apparatus according to the present invention includes a support plate for fixedly supporting a workpiece inside a vacuum container having a circular front shape, which is rotatably movable back and forth inside the vacuum container. A plurality of support plates are provided on the front side of the vacuum container so as to be able to move in parallel in the direction, and the support plate that moves forward and the lid body that can be opened and closed provide approximately the volume of the vacuum container /ioo
The load lock chamber is configured to form a load lock chamber having the following volume, and no transfer device or gate valve is provided inside the load lock chamber to reduce the volume.
〔発明の実施例〕
以下、本発明の実施例を第１図および第２図を参照して
説明する。[Embodiments of the Invention] Hereinafter, embodiments of the present invention will be described with reference to FIGS. 1 and 2.
第１図および第２図は本発明の一実施例を示したもので
、正面形状円形状の真空容器１の前面側には、円形状の
ロードロック室２が形成され、このロードロック室２の
容積は上記真空容器１の容積の約 ／１ｏｏ以下とされ
ている。上記ロードロック室２の外部側には、アーム３
の回動により開閉自在とされる蓋体４が設けられ、内部
側には円板状の支持板５が設けられており、上記蓋体４
と支持板５とにより上記ロードロック室２が密閉される
ようになされている。上記支持板５の中央部には、ベア
リング６を介して回転自在に取付けられるとともに上記
支持板５の前面側に被処理物Ａを固定する支持回転軸７
が設けられており、この支持板５は本実施例においては
４枚配置されている。上記各支持板５は、真空容器１の
後面中央部を貫通し外部に設けられたモータ８により回
転自在とされる搬送回転軸９にリンク機構１０を介して
連結されており、上記各支持板５は上記搬送回転軸９の
回転により真空容器１の内部を移動するようになされる
とともに、上記リンク機構１０により前後方向に平行移
動できるようになされている。上記ロードロック室２に
対応する真空容器１の後面には、上記支持板５の支持回
転軸７の後端に当接するように伸縮動作する支持板移動
軸１１が貫通して設けられている。さらに、上記ロード
ロック室２には真空ポンプ１２が開閉弁１３を介して接
続され、かつ、大気に開放される管路が開閉弁１４を介
して接続されており、真空容器１には開閉弁１５を介し
て真空ポンプ１６が接続されている。1 and 2 show an embodiment of the present invention, in which a circular load-lock chamber 2 is formed on the front side of a vacuum container 1 having a circular front face. The volume of the vacuum container 1 is about 1/1 oo or less of the volume of the vacuum container 1. An arm 3 is provided on the outside of the load lock chamber 2.
A lid body 4 is provided which can be opened and closed by rotation of the lid body 4. A disk-shaped support plate 5 is provided on the inside.
The load lock chamber 2 is hermetically sealed by the support plate 5 and the support plate 5. A support rotating shaft 7 is rotatably attached to the center of the support plate 5 via a bearing 6 and fixes the object A to the front side of the support plate 5.
are provided, and four supporting plates 5 are arranged in this embodiment. Each of the support plates 5 is connected via a link mechanism 10 to a conveyance rotation shaft 9 that passes through the center of the rear surface of the vacuum container 1 and is freely rotatable by a motor 8 provided outside. 5 is adapted to move inside the vacuum container 1 by the rotation of the conveyance rotation shaft 9, and is also adapted to be able to move in parallel in the front and back direction by the link mechanism 10. A support plate moving shaft 11 that extends and contracts so as to come into contact with the rear end of the support rotation shaft 7 of the support plate 5 is provided through the rear surface of the vacuum vessel 1 corresponding to the load lock chamber 2 . Further, a vacuum pump 12 is connected to the load lock chamber 2 via an on-off valve 13, a pipe line opened to the atmosphere is connected via an on-off valve 14, and the vacuum vessel 1 is connected to an on-off valve. A vacuum pump 16 is connected via 15.
上記装置の場合、真空容器１の内部でスパッタリング等
の真空処理を行なうこともできるが、搬送回転軸９等の
汚染を防止するため、本実施例においては真空処理室１
７を独立して設けている。In the case of the above apparatus, vacuum processing such as sputtering can be performed inside the vacuum chamber 1, but in order to prevent contamination of the transport rotation shaft 9, etc., in this embodiment, the vacuum processing chamber 1
7 are set up independently.
すなわち、支持板５に対応する位置にロードロック室２
と同様に真空処理室１７を設けるものであは、１〜３個
設けることができる。上記真空処理室１７に対応する真
空容器１の後面には、エアシリンダ１８により伸縮動作
するとともに図示しないモータにより回転駆動される支
持板回転軸１９が貫通して設けられている。また、本実
施例においてはスパッタリング装置を示しているため、
真空処理室１７には１つのスパッタ源２０が取付けられ
ているが、他の真空処理に適用できることはもちろんで
ある。That is, the load lock chamber 2 is located at a position corresponding to the support plate 5.
If a vacuum processing chamber 17 is provided in the same manner as in the above, one to three vacuum processing chambers can be provided. A support plate rotating shaft 19 is provided through the rear surface of the vacuum container 1 corresponding to the vacuum processing chamber 17, and is extended and contracted by an air cylinder 18 and rotationally driven by a motor (not shown). In addition, since this example shows a sputtering device,
Although one sputtering source 20 is attached to the vacuum processing chamber 17, it is of course applicable to other vacuum processing.
本実施例においては、支持板移動軸１１を前進させて、
支持板５をロードロック室２の後端部に押し付け、ロー
ドロック室２と真空容器１とを仕切った後に蓋体４を開
いて、被処理物Ａを支持回転軸７に取付ける。そして、
蓋体４を閉じて真空ポンプ１２によりロードロック室２
を真空排気した後、支持板移動軸１１を後退させて被処
理物Ａを支持板５とともに真空容器１内に移動させる。In this embodiment, the support plate moving shaft 11 is advanced,
After the support plate 5 is pressed against the rear end of the load-lock chamber 2 to partition the load-lock chamber 2 and the vacuum container 1, the lid 4 is opened and the object to be processed A is attached to the support rotation shaft 7. and,
Close the lid 4 and use the vacuum pump 12 to open the load lock chamber 2.
After evacuating, the support plate moving shaft 11 is moved backward to move the workpiece A together with the support plate 5 into the vacuum container 1.
次にモータ８により搬送回転軸９を９０°ずつ回転させ
支持板５を搬送させて、真空処理室１７に８震甘スＮＩ
謂赤Ｔ顧謀青ｈト焔 大檎拓日１赫１９を前進させて支
持板５を押し付けることにより真空処理室１７を形成す
るとともに、支持板回転軸１９を回転させて支持板５の
支持回転軸７を回転させることにより被処理物Ａを回転
させる。Next, the conveyance rotation shaft 9 is rotated by 90 degrees by the motor 8 to convey the support plate 5 into the vacuum processing chamber 17.
The vacuum processing chamber 17 is formed by moving the so-called red T advisor blue h toen 19 forward and pressing the support plate 5, and at the same time, by rotating the support plate rotation shaft 19, the support rotation shaft of the support plate 5 is formed. By rotating 7, the object to be processed A is rotated.
この状態で被処理物へのスパッタリングを行なうもので
あり、真空処理室１７の内部は開閉弁２１が介設された
真空ポンプ２２により真空排気されている。スパッタリ
ングが終了したら、支持板回転軸１９を後退させＣ支持
板５を移動させ、搬送回転軸９の駆動により支持板５を
回転させる。そして、０−ドロック室２の位置に移動し
た支持台５は支持板移動軸１１′ニより前進移動し、ロ
ードロック室２内を開閉弁１４を開いて大気圧にした後
、蓋体４を開いて真空処理後の被処理物Ａを取出すよう
になされる。In this state, sputtering is performed on the object to be processed, and the inside of the vacuum processing chamber 17 is evacuated by a vacuum pump 22 in which an on-off valve 21 is interposed. When sputtering is completed, the support plate rotation shaft 19 is moved backward to move the C support plate 5, and the support plate 5 is rotated by driving the conveyance rotation shaft 9. Then, the support stand 5 that has been moved to the position of the 0-lock chamber 2 is moved forward from the support plate moving shaft 11', and after opening the on-off valve 14 in the load lock chamber 2 to bring it to atmospheric pressure, the lid body 4 is closed. It is opened to take out the workpiece A after vacuum processing.
本実施例においてロードロック室２の排気時間ｔは、１
０−２ｔｏｒｒ程度までは次式により算出できる。In this embodiment, the exhaust time t of the load lock chamber 2 is 1
It can be calculated by the following formula up to about 0-2 torr.
ｂ ビ２
ここに、■ ；ロードロック室の内容積（１）Ｓ ：排
気速度（ρ／１ｎ）
Ｐｌ ：最初の圧力（Ｔｏｒｒ）
Ｐ２−目的圧力（Ｔｏｒｒ） Ｔアル。b B2 Here, ■ ; Internal volume of the load lock chamber (1) S : Pumping speed (ρ/1n) Pl : Initial pressure (Torr) P2-Target pressure (Torr) T al.
上式によれば、■を０．５．ｌｌ、Ｓを３０磨／２
ｗｌｎ 、 Ｐ を大気圧、Ｐ２を１Ｘ １Ｑ ＴＯｒ
ｒとしま
たとき、ｔは０．１９分となり、きわめて短時間に排気
できることになる。According to the above formula, ■ is 0.5. ll, S 30 polish/2 wln, P atmospheric pressure, P2 1X 1Q Tor
When r, t becomes 0.19 minutes, which means that exhaust can be accomplished in an extremely short time.
そして、ロードロック室２は支持板５を移動さぜること
により真空容器１と接続されるが、真空容器１の容積が
ロードロック室２の２００倍で、かつ、内部がＩ Ｘ
１０ ’Ｔｏｒｒに保持されているとすれば、上記接続
された状態の真空容器１の圧力Ｐは次式で算出すること
ができる。The load-lock chamber 2 is connected to the vacuum container 1 by moving the support plate 5, but the volume of the vacuum container 1 is 200 times that of the load-lock chamber 2, and the inside is IX.
Assuming that the pressure is maintained at 10' Torr, the pressure P of the vacuum vessel 1 in the connected state can be calculated using the following equation.
ＰＶ＝ＲＴ ここに、Ｐ：圧力（Ｔｏｒｒ） ■；容積（ｊり Ｒ；気体定数 Ｔ；温度（Ｋ） である。PV=RT Here, P: pressure (Torr) ■；Volume R; gas constant T: temperature (K).
また、ＲＴは一般に一定であるのでＰｌＶｌをロードロ
ック室の圧力と容積、Ｐ２■２を真空容器の圧力と容積
とすれば、
Ｐ Ｖ ＋ｐ Ｖ ＝Ｐ （Ｖ ＋Ｖ２ ）となり、１
１ ２２ １
Ｐ＝６ｘ １０−５（Ｔｏｒｒ）となる。Also, since RT is generally constant, if PlVl is the pressure and volume of the load lock chamber, and P2■2 is the pressure and volume of the vacuum container, then P V + p V = P (V + V2 ), and 1
1 22 1 P=6x 10-5 (Torr).
すなわち、ロードロック室は１ ｘ １０ ’Ｔｏｒｒ
から６ ｘ １０ ’Ｔｏｒｒまで、急速に減圧される
。That is, the load lock chamber is 1 x 10'Torr
The pressure is rapidly reduced from to 6 x 10'Torr.
したがって、本実施例においては、ロードロック室の排
気時間を大きな真空ポンプを使用することなく、大幅に
短縮することができる。Therefore, in this embodiment, the evacuation time of the load lock chamber can be significantly shortened without using a large vacuum pump.
以上述べたように本発明に係る真空処理装置は、被処理
物を固定支持する支持板を真空容器の内部に複数設け、
上記真空容器の前面側に、上記支持板と蓋体とにより上
記真空容器の容積のおよそ１／１ｏｏ以下の容積を有す
るロードロック室を形成するようにして構成されており
、上記支持板が被処理物の搬送装置およびゲートバルブ
の機能を果たすようになされているので、ロードロック
室を極めて小さい容積とすることができ、したがって、
大幅な排気時間の短縮を図ることができる。As described above, the vacuum processing apparatus according to the present invention provides a plurality of support plates for fixedly supporting the workpiece inside the vacuum container,
The support plate and the lid form a load-lock chamber on the front side of the vacuum container, and the support plate is covered with Since it is designed to perform the functions of a processing material transport device and a gate valve, the volume of the load lock chamber can be made extremely small, and therefore,
It is possible to significantly shorten the exhaust time.
その結果、真空処理作業効率の大幅な向上を図ることが
できる等の効果を奏する。As a result, effects such as the ability to significantly improve vacuum processing efficiency are achieved.
第１図および第２図は本発明の一実施例を示したもので
、第１図は側面断面図、第２図は一部を断面とした正面
図である。
１・・・真空容器、２・・・ロードロック室、３・・・
アーム、４・・・蓋体、５・・・支持板、６・・・ベア
リング、７・・・支持回転軸、８・・・モータ、９・・
・搬送回転軸、１０・・・リンク機構、１１・・・支持
板移動軸、１２゜１６．２２・・・真空ポンプ、１３．
１４．１５゜２１、・・・開閉弁、１７・・・真空処理
室、１８・・・エアシリンダ、１９・・・支持板回転軸
、２０・・・スパッタ源。
出願人代理人 猪 股 清FIGS. 1 and 2 show an embodiment of the present invention, with FIG. 1 being a side sectional view and FIG. 2 being a partially sectional front view. 1... Vacuum container, 2... Load lock chamber, 3...
Arm, 4... Lid, 5... Support plate, 6... Bearing, 7... Support rotating shaft, 8... Motor, 9...
・Transportation rotation axis, 10...Link mechanism, 11...Support plate moving axis, 12°16.22...Vacuum pump, 13.
14.15°21,...Opening/closing valve, 17...Vacuum processing chamber, 18...Air cylinder, 19...Support plate rotating shaft, 20...Sputter source. Applicant's agent Kiyoshi Inomata
Claims (1)
固定支持する支持板を、上記真空容器の内部を回転移動
自在であって前後方向に平行移動自在に複数設け、上記
真空容器の前面側に、上記前方に移動した支持板と開閉
自在な蓋体とにより上記真空容器の容積のおよそ ／１
ｏｏ以下の容積を有するロードロック室を形成するよう
にしたことを特徴とする真空処理装置。A plurality of support plates for fixing and supporting objects to be processed are provided inside a vacuum container having a circular front surface, and are rotatably movable inside the vacuum container and movable in parallel in the front and rear directions. On the side, approximately 1/1 of the volume of the vacuum container is formed by the support plate that has moved forward and the lid that can be opened and closed.
A vacuum processing apparatus characterized in that a load lock chamber having a volume of oo or less is formed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7627084A JPS60238133A (en) | 1984-04-16 | 1984-04-16 | Vacuum treatment apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7627084A JPS60238133A (en) | 1984-04-16 | 1984-04-16 | Vacuum treatment apparatus |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60238133A true JPS60238133A (en) | 1985-11-27 |
| JPS6257377B2 JPS6257377B2 (en) | 1987-12-01 |
Family
ID=13600541
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7627084A Granted JPS60238133A (en) | 1984-04-16 | 1984-04-16 | Vacuum treatment apparatus |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60238133A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04124274A (en) * | 1990-09-13 | 1992-04-24 | Hitachi Electron Eng Co Ltd | Vapor phase reaction device |
| WO2001053561A1 (en) * | 2000-01-18 | 2001-07-26 | Unaxis Balzers Ag | Sputter chamber and vacuum transport chamber and vacuum treatment installations with chambers of this type |
| JP2002198413A (en) * | 2000-10-04 | 2002-07-12 | Boc Group Inc:The | Vacuum chamber load lock structure and article transport mechanism |
| JP2002285332A (en) * | 2001-03-27 | 2002-10-03 | Shibaura Mechatronics Corp | Vacuum treatment apparatus |
| US6899795B1 (en) | 2000-01-18 | 2005-05-31 | Unaxis Balzers Aktiengesellschaft | Sputter chamber as well as vacuum transport chamber and vacuum handling apparatus with such chambers |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6570016B1 (en) * | 2018-04-05 | 2019-09-04 | 株式会社クラフト | Sputtering equipment |
-
1984
- 1984-04-16 JP JP7627084A patent/JPS60238133A/en active Granted
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04124274A (en) * | 1990-09-13 | 1992-04-24 | Hitachi Electron Eng Co Ltd | Vapor phase reaction device |
| WO2001053561A1 (en) * | 2000-01-18 | 2001-07-26 | Unaxis Balzers Ag | Sputter chamber and vacuum transport chamber and vacuum treatment installations with chambers of this type |
| US6899795B1 (en) | 2000-01-18 | 2005-05-31 | Unaxis Balzers Aktiengesellschaft | Sputter chamber as well as vacuum transport chamber and vacuum handling apparatus with such chambers |
| US7033471B2 (en) * | 2000-01-18 | 2006-04-25 | Unaxis Balzers Aktiengesellschaft | Sputter chamber as well as vacuum transport chamber and vacuum handling apparatus with such chambers |
| JP2002198413A (en) * | 2000-10-04 | 2002-07-12 | Boc Group Inc:The | Vacuum chamber load lock structure and article transport mechanism |
| JP2002285332A (en) * | 2001-03-27 | 2002-10-03 | Shibaura Mechatronics Corp | Vacuum treatment apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6257377B2 (en) | 1987-12-01 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US5096364A (en) | Wafer arm handler mechanism | |
| JPH03177572A (en) | Device for heat treatment of wafer | |
| JPS6342142A (en) | Wafer handling arm | |
| JPH0684864A (en) | Treatment device | |
| JPS60244711A (en) | Turning gear for transfer plate | |
| JPH0831909A (en) | Semiconductor manufacturing device and its method for transferring wafer | |
| JPS6379969A (en) | Wafer storing and transferring method and apparatus | |
| JPS60238133A (en) | Vacuum treatment apparatus | |
| JPH11163075A (en) | Method and device for manufacturing semiconductor device | |
| JPS62207866A (en) | Continuous sputtering device | |
| JPH07227777A (en) | Carrier and processing device for article to be processed | |
| JPH02140948A (en) | Vacuum processor | |
| JPS609103B2 (en) | Continuous sputtering equipment | |
| JPH0377274B2 (en) | ||
| JPS6350433B2 (en) | ||
| JPH0242901B2 (en) | ||
| JP2884753B2 (en) | Ion processing equipment | |
| JP2582578Y2 (en) | Multi-chamber semiconductor processing equipment | |
| JP3121022B2 (en) | Decompression processing equipment | |
| JPH0479347A (en) | Wafer carrier | |
| JPH04322444A (en) | Composite type wafer processor | |
| JPH0485813A (en) | Vacuum treatment equipment | |
| JPH0159354B2 (en) | ||
| JPS60160139A (en) | Shifting process | |
| JP4014059B2 (en) | Single wafer vacuum processing equipment |