JP2002285332A - Vacuum treatment apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a vacuum treatment apparatus capable of continuously performing vacuum treatment of even a work with infinite thickness, and having compact and simple configuration. SOLUTION: A plurality of work chambers (2A and 2B) having a first aperture (4) and a second aperture (5) are successively carried between a load lock space (3A) and a sputtering space (3B), a work (1) is taken in/taken out through the first aperture, and the vacuum destruction and exhaust are appropriately performed via the second aperture.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a vacuum processing apparatus and, more particularly, to various kinds of vacuum processing such as thin film formation and surface reforming by continuously loading objects to be processed having various shapes such as molded plastics. The present invention relates to a vacuum processing apparatus for continuously performing the following.

[0002]

2. Description of the Related Art In recent years, various processing techniques such as thin film formation, etching or surface modification in a vacuum have been rapidly developed, and various vacuum processes are being adopted in a wide range of industrial fields. However, in ordinary applications, the workpiece to be subjected to vacuum processing such as thin film formation is not limited to a workpiece having a specific shape and size. Therefore, a flexible vacuum processing apparatus that can continuously process objects to be vacuum-processed and that can handle objects of various shapes and sizes is desired.

Further, it is desirable that such a vacuum processing can be automated.

Conventionally, as a vacuum apparatus for coating a plastics molded product with a thin film, for example, a batch-type vacuum vapor deposition apparatus or a sputtering apparatus which is inexpensive to form a film is often used.

FIG. 16 is a sectional view conceptually showing the structure of a conventional batch vacuum evaporation apparatus. That is, the apparatus illustrated in the figure includes a bell jar type vacuum chamber 102,
It has an evaporation source 103, an exhaust pump 104, and a gate valve 105. After the processing object 101 such as a plastics molded product is arranged inside the chamber 102 with the vacuum chamber 102 raised in the direction of the upper arrow, the filament or the like is evacuated by lowering the chamber below the arrow and evacuating the inside. A predetermined material can be evaporated from an evaporation source 103 such as an electron beam evaporation source to form a thin film on the surface of the processing object 101.

However, the batch type processing apparatus illustrated in FIG. 1 has a problem that automation is difficult because the supply of the object to be processed and the supply of the filament and the evaporation material are performed manually.

Further, in order to vacuum-treat a large amount of the object to be treated 101 at a time, it is necessary to increase the size of the apparatus. poor. In addition, in order to ensure the workability of the worker 200, it is necessary to dig the pit 110 and bury the lower side of the device, which causes a problem that the installation cost increases.

On the other hand, there is an "in-line" type vacuum processing apparatus as one of apparatuses for continuously vacuum-processing a large amount of objects to be processed.

FIG. 17 is a conceptual diagram illustrating the configuration of an in-line continuous film forming apparatus. The device shown in the figure is
The preliminary chamber 202A, the processing chamber 205, and the preliminary chamber 202B are connected linearly, and gate valves 203 and 208 are provided between them. In each chamber, an exhaust valve 206 and a vacuum break valve 207 are appropriately provided.

In operation, first, the vacuum break valve 20
7, the preparatory chamber 202A is set to the atmospheric pressure, the lid is opened in the direction of arrow B, and the workpiece 101 is introduced in the direction of arrow A. Thereafter, the exhaust valve 206 is opened and the spare chamber 202 is opened.
A is exhausted, the gate valve 208 is opened, and the workpiece 101 is introduced into the processing chamber 205. The processing chamber 205 is provided with, for example, a sputter source 204 and the like, and performs predetermined processing as appropriate. The processing object 101 is placed in the processing chamber 2
After the introduction into the preparatory chamber 05, a new object 101 can be introduced into the preliminary chamber 202A by the same procedure.

On the other hand, the workpiece 101 having undergone predetermined processing in the processing chamber 205 is introduced into the spare chamber 202B via the gate valve 203. Then, gate valve 2
03, the vacuum break valve 207 is opened to set the preliminary chamber to atmospheric pressure, and the lid is opened in the direction of arrow C to open the workpiece 101.
Can be taken out.

As described above, in a continuous processing apparatus, introduction, processing and removal of an object to be processed can be performed simultaneously. In the case of this type of apparatus, in order to further increase the productivity, the processing chamber is not exposed to the atmosphere, and the technology for replacing the processing object, and the volume of the spare chamber is minimized in order to accelerate the processing cycle. There is a need for technology to do this.

However, in the case of an in-line type vacuum processing apparatus as exemplified in FIG. 17, since the spare chamber, the gate valve, the processing chamber, and the like are sequentially connected, the apparatus becomes large-sized and complicated, and the manufacturing cost of the apparatus and its cost are reduced. Large expenditures are required, such as a large amount of electric power during operation of the apparatus and a large installation area.

The present inventors have proposed an apparatus for continuously performing vacuum processing while solving this problem. Documents that disclose this vacuum processing apparatus include, for example, JP-A-2000-6
No. 4042 can be cited.

FIG. 18 is a conceptual diagram showing the configuration of the vacuum processing apparatus. The device illustrated in FIG.
This is a sputtering apparatus for depositing a thin film on a disk substrate such as a disk, and has a configuration in which a substantially cylindrical substrate transfer chamber 312 and a substantially cylindrical sputtering chamber 311 are connected. The disk substrate 301, which is an object to be processed, is placed on a susceptor 302 of a disk, and the rotating mechanism 303 is rotated in a direction of an arrow C in a state where the disk substrate 301 is placed on a transfer arm 310. Substrate transfer chamber 31
2 is conveyed.

The loading and unloading of the disk substrate 301 is performed through the opening 306 of the transfer chamber. At this time, the disk substrate 301 is moved together with the susceptor 302 into the susceptor pusher 3.
08 lifts in the direction of arrow B. Then, the disk substrate 301 is shielded from the transfer chamber 312 by the susceptor 302, and the transfer chamber 3
The substrate 301 can be taken in and out of the atmosphere while the vacuum chamber 12 is maintained. At this time, the gate valve 305 can be opened and closed appropriately to perform vacuum breaking and vacuum roughing.

On the other hand, at the time of sputtering, the disk substrate 301 is rotated by the rotating mechanism 303 in the sputtering chamber 3.
11 is lifted in the direction of arrow D by the susceptor pusher 309. In this state, the sputtering source 3
By operating 07, a predetermined thin film can be deposited on the substrate 301.

In the apparatus shown in FIG. 18, a susceptor 302 for transferring a disk substrate 301 as an object to be processed is also provided with a role of a "sluice valve" so that a transfer chamber 3 is provided.
The substrate 301 can be taken in and out of the opening 306 while the vacuum chamber 12 and the sputtering chamber 311 are maintained in a vacuum state.

The apparatus shown in FIG. 18 is applicable to a fixed-size object having a small thickness such as a disk substrate of a CD.
A continuous film can be formed with very high productivity.

However, in order to cope with film formation on a non-standard and thick plastics molded product or the like, due to its structure, the susceptor pusher 3 must be at least as long as the thickness of the object to be processed.
Since it is necessary to transfer the wafer to the sputtering chamber 311 after moving it by 08 and 309, the apparatus becomes large-scale. In particular, the movable portions of the susceptor pushers 308 and 309 that move up and down in a vacuum require an airtight mechanism such as a bellows and a magnetic coupling mechanism. A longer stroke of the up and down movement complicates the device configuration. It becomes a factor.

[0021]

FIG. 16 to FIG.
As described with reference to FIG. 8, it is based on a new idea to continuously vacuum-treat a thick, non-standard non-processed material, and to save labor, space, and energy. A device configuration is needed.

The present invention has been made based on the recognition of such a problem, and an object of the present invention is to be able to continuously perform vacuum processing even on an object having an irregular thickness, and to have a compact device configuration. Another object of the present invention is to provide a simple vacuum processing apparatus.

[0023]

In order to achieve the above object, a vacuum processing apparatus according to the present invention is a vacuum processing apparatus for performing vacuum processing of an object to be processed, which has a load lock space and a vacuum processing space, and is provided with an atmosphere. A main chamber capable of maintaining a reduced-pressure atmosphere, a plurality of work chambers accommodated in the main chamber, the work chamber having a first opening and a second opening, and transporting the work chamber in the main chamber A transfer mechanism, and an exhaust pipe movable in the main chamber, and when introducing or removing an object to be processed, the transfer mechanism transfers one of the work chambers to the load lock space, A state in which the first opening is pressed against an inner wall surface of the main chamber and the exhaust pipe is connected to the second opening of the work chamber. By doing so, the internal space of the work chamber is cut off from the internal space of the main chamber so that the object to be processed can be introduced or taken out of the work chamber. The work chamber in which the object is introduced is transferred to the vacuum processing space by the transfer mechanism, and vacuum processing can be performed with at least one of the first opening and the second opening opened in the main chamber. It is characterized by having.

According to the above configuration, flexibility for vacuum processing of the non-standard workpiece can be obtained, and the work chamber is moved by a small stroke that does not damage the seal mechanism of the press-contact portion. Since the space can be transported, the device can be made compact and highly reliable.

Here, when the first opening is pressed against the inner wall surface of the main chamber and the exhaust pipe is connected to the second opening of the work chamber, airtightness of the pressed portion is maintained. It is desirable to provide a sealing mechanism such as an O-ring.

Further, the apparatus further comprises a power introducing means having a drive shaft movable in the main chamber, wherein the power introducing means is provided in the state where the work chamber is transported to the vacuum processing space. If the object to be processed in the work chamber is given a motion by the drive shaft via the above, the vacuum processing can be further enhanced.

[0027] Alternatively, the apparatus further comprises a power introducing means having a drive shaft movable in the main chamber, wherein the power introducing means is configured to move the first opening when the work chamber is conveyed to the vacuum processing space. If the object to be processed in the work chamber is given a motion by the drive shaft via the above, the vacuum processing can be further enhanced.

Power introduction means having a drive shaft movable in the main chamber, a power transmission mechanism provided on a side wall of the work chamber via a seal mechanism,
The power introduction means further comprises: in a state where the work chamber is transported to the vacuum processing space,
The object to be processed in the work chamber may be given a motion by the drive shaft via the power transmission mechanism.

Alternatively, if the work chamber has a driving means for giving a motion to the processing object accommodated therein, the vacuum processing can be further enhanced. As the movement given to the object to be processed, specifically, any one of rotation, rotation, vibration, and swing of the object to be processed can be given, and various vacuum processes such as thin film formation and etching can be uniformly performed. Can be implemented.

Further, during the vacuum processing, by evacuating the work chamber through the second opening while introducing a predetermined gas into the work chamber, differential evacuation is easily performed. be able to.

The main chamber has a plurality of vacuum processing spaces, and if the load lock space and the plurality of vacuum processing spaces are arranged substantially concentrically, pre-processing, post-processing, etc. And a plurality of vacuum processes including a vacuum process can be continuously performed with a compact apparatus configuration.

Further, the vacuum processing space can perform any one of film formation, etching, surface processing, surface modification and evaluation.

Here, the transfer mechanism has a rotatable transfer table and an up-and-down mechanism, and the work chamber is placed on the transfer table in a state where the work chamber is mounted on the load lock space or the vacuum processing. The first opening may be brought into pressure contact with the inner wall surface of the main chamber by transporting the work chamber to a space and raising the work chamber by the vertical mechanism.

In the load lock space, if the first opening is pressed against the inner wall surface of the main chamber by moving the exhaust pipe, the vertical mechanism can be omitted.

Further, the transfer mechanism has a plurality of transfer arms, and transfers the work chamber to the load lock space or the vacuum processing space by rotating the transfer arm around a rotation axis. By moving the arm in the direction of the rotation axis, the first opening can be pressed against the inner wall surface of the main chamber.

Further, if each of the work chambers is fixed to each of the transfer arms, a so-called vertical vacuum processing apparatus can be easily realized.

Further, the work chamber may have a deposition preventing plate which is detachable through the first opening, so that contamination of the inner wall of the work chamber and the like can be prevented and the work chamber can be easily opened from the opening of the load lock. Maintenance such as replacement of the protection plate can be performed.

In the specification of the present application, "vacuum processing"
The term “all” refers to any processing performed on an object to be processed in an atmosphere at a pressure lower than that of the atmosphere, and includes, for example, various kinds of processing such as film formation, etching, surface processing, surface modification, and evaluation.

[0039]

Embodiments of the present invention will be described below in detail with reference to the drawings. 1 and 2
1 is a sectional view conceptually illustrating the configuration of a vacuum processing apparatus of the present invention. That is, FIG. 2 shows an example in which the present invention is applied to a sputtering apparatus.

The main chamber 3 evacuated by the exhaust pump 15 is provided on the gantry 30. A plurality of work chambers 2A and 2B are provided inside the main chamber. These work chambers 2A and 2B have an upper opening (first opening) 4 and a lower opening (second opening) 5, respectively. As described later in detail, the number of work chambers is not limited to two, and three or more work chambers can be provided.

These work chambers are provided with a vertical mechanism 10
, And can be pressed against the lower surface of the upper lid 9 of the main chamber. FIG. 1 shows a state in which the work chamber is lifted up by the up-and-down mechanism 10, and FIG. 2 shows a state in which the work chamber is lowered.

As shown in FIG. 2, the work chamber 2
A and 2B are placed on the arm-shaped transfer table 8 when they are lowered. Then, in this state, the rotary transport mechanism 7 which rotates in the direction of the arrow,
The main chamber 3 can be rotated and conveyed.

On the other hand, the upper lid 9 of the main chamber 3 is provided with an openable lid 13 and a sputtering source 14 for film formation. The portion of the openable lid 13 is a load lock space 3A for the object to be processed, and the portion below the sputter source 14 functions as a sputter processing space 3B.

FIG. 3 is a conceptual diagram illustrating a planar positional relationship between the transfer table 8, the load lock space 3A, and the sputter processing space 3B. As illustrated in the figure, the work chambers 2A, 2B are rotatably transported in the direction of the arrow by the rotary transport mechanism 7 while being placed on the transport table 8, and moved to any of these spaces. It is possible. In FIG. 3, the planar shape of each of the spaces 3A and 3B and the work chambers 2A and 2B is substantially square. However, the present invention is not limited to this, and is substantially circular, substantially elliptical, polygonal, and the like. It is also possible to give the various planar shapes in the same manner.

A seal mechanism 22 such as an O-ring is provided around the upper opening 4 of each of the work chambers 2A and 2B. Then, as shown in FIG. 1, when the work chamber is pressed against the upper lid 8, airtightness is obtained by the seal mechanism 22. However, the seal mechanism 22 does not necessarily need to be provided on the side of the work chamber, and may be provided on the side of the upper lid 9 of the main chamber. During vacuum processing required for the workpiece,
If the work chamber is to be heated considerably,
The seal mechanism 22 such as a ring may be deteriorated.
In such a case, it is desirable to provide the seal mechanism 22 on the main chamber side.

On the other hand, below the openable lid 13, an exhaust pipe 11 for exhausting the work chamber is provided.
The exhaust pipe 11 is connected to an exhaust pump (not shown) via a gate valve 16, and a vacuum break valve 17 is also connected in parallel. Further, the exhaust pipe 11 is vertically movable by an exhaust pipe driving mechanism 12.

Next, the basic operation of the vacuum processing apparatus will be described with reference to FIGS.

First, in the work chamber 2A arranged in the load lock space 3A as shown in FIG.
Loading (introduction) and unloading (removal) of the processing object 1 are performed. Specifically, the work chamber 2A is transported to the load lock space 3A by the rotation mechanism 7. Then, the work chamber is lifted by the vertical mechanism 10 and brought into a state of being pressed against the upper lid 9. Thus, airtightness is ensured by the seal mechanism 22.

Further, the exhaust pipe 11 is moved by the vertical mechanism 12.
And connect it to the lower opening 5 of the work chamber 2A. Since the seal mechanism 23 such as an O-ring is provided between the exhaust pipe and the work chamber, airtightness can be obtained also here. Therefore, the vacuum in the work chamber can be broken by opening the vacuum break valve 17 while maintaining the vacuum state of the main chamber 3.

Thereafter, the openable lid 13 of the upper lid 9 is opened in the direction of arrow A, and the workpiece 1 is introduced into the work chamber. Then, the openable lid 13 is closed, and the work chamber is exhausted through the exhaust pipe 11.

When the work chamber 2A loaded with the workpiece 1 is evacuated to a predetermined degree of vacuum, as shown in FIG. 2, the evacuation pipe 11 is lowered by the up / down mechanism 12 to separate it from the work chamber, and the up / down mechanism 10 Then, the work chamber is lowered onto the transfer table 8.

According to the present invention, the required vertical movement stroke of the work chamber is only required to be able to be conveyed by separating the vacuum seal mechanism 22 between the work chamber and the main chamber 3, and is about 1 mm to 10 mm. Can be made an extremely short stroke.

When the work table 2 is placed on the transfer table 8 in this manner, the upper opening 4 of the work chamber 2A is released to the main chamber 3, and the lower opening 5 of the work chamber is also set in the transfer table 8. It is released to the main chamber through the opening H. By these two openings, the atmosphere inside the work chamber and around the workpiece 1 is coupled to the space in the high vacuum state of the main chamber,
High vacuum can be evacuated by an exhaust pump 15 such as an oil diffusion pump, a turbo molecular pump, a cryopump, or a mechanical booster pump provided in the main chamber.

On the other hand, at the same time as or before or after the loading operation described above, the sputter processing space 3
In B, a predetermined vacuum process is performed by the work chamber 2B. In the apparatus illustrated in FIG. 1, a predetermined gas is introduced (not shown) into the work chamber 2B, the power supply 40 connected to the sputtering source 14 is operated, and the magnet 2
By moving 0 in the direction of arrow B, magnetron sputtering can be generated, and a predetermined material can be deposited on the surface of the processing target 1.

As shown in FIG. 1, this sputtering process can be performed with the work chamber 2B in the sputtering process space 3B lifted up. In this way, it is possible to prevent sputter deposits from flying on the surface of the seal mechanism 22 and impairing the sealing characteristics.

Further, as shown in FIG. 1, when the work chamber 2B is lifted up, the internal space of the work chamber communicates with the main chamber 3 through the lower opening 5. Therefore, the inside of the work chamber 2B can be differentially evacuated through the lower opening 5. For example, in the case of a sputtering apparatus as illustrated in FIG.
It is necessary to introduce a predetermined gas such as argon into the sputtering space to set a predetermined sputtering pressure. On the other hand, the inside of the main chamber 3 is desirably maintained at a high vacuum. According to the present invention, the inside of the work chamber 2B is differentially evacuated by the exhaust pump 15 through the lower opening 5, so that a predetermined sputtering gas is introduced into the work chamber 2B and a predetermined sputtering pressure is applied. The inside of the main chamber 3 can be maintained in a high vacuum state. As a result, the surface of the processing object 1 before and after sputtering can be kept clean, and further, another high vacuum processing can be performed in parallel in the main chamber.

As described above, when a predetermined film forming process is completed in the sputtering process space 3B, the vertical mechanism 1
0, the work chamber 2B is lowered onto the transfer table 8. Then, the work chamber 2 is rotated by the rotation mechanism 7.
B can be transported to the position of the load lock space 3A, and the processed workpiece 1 can be taken out and a new workpiece 1 can be introduced by the loading / unloading procedure described above. In parallel with this, the work chamber 2A into which the object 1 is introduced is transported to the sputter processing space 3B, where the sputtering process can be performed as described above.

In FIGS. 1 and 2, in the load lock space 3A and the sputter processing space 3B, either the work chamber is raised or the work chamber is lowered, but the present invention is not limited to this. However, the present invention is not limited to this.

FIG. 4 shows a state where the work chamber 2A of the load lock space 3A is lowered on the transfer table 8 and the work chamber 2B of the sputter processing space 3B is lifted up. This is because, for example, in the sputtering process space 3B, the film forming process is in progress,
On the other hand, in the load lock space 3A, this corresponds to a state in which the removal and introduction of the workpiece 1 have been completed and high vacuum evacuation has started.

On the contrary, FIG. 5 shows that the work chamber 2A of the load lock space 3A is lifted up,
The work chamber 2B in the sputter processing space 3B shows a state where the work chamber 2B is lowered onto the transfer table 8. This is because, for example, the sputter processing space 3B
Corresponds to a standby state before or after the film forming process is performed. Alternatively, in the sputter processing space 3B, the film formation may be performed while the work chamber 2B is lowered on the transfer table 8. On the other hand, in the load lock space 3A, the work chamber may be lifted by the exhaust pipe 11 without using the vertical mechanism 10.

FIG. 6 is a conceptual diagram illustrating the configuration of such an apparatus. That is, in the load lock space 3A, the vertical mechanism 10 as illustrated in FIG. 1 is omitted. Then, the work chamber is lifted upward by the exhaust pipe 11 driven in the vertical direction by the vertical mechanism 12.

As described above with reference to FIGS. 1 to 6, according to the present invention, two or more work chambers can be sequentially transferred between the load lock space and the sputter processing space. Introduction and removal of processed materials,
The sputtering process can be performed continuously.

Moreover, as long as it has a shape and dimensions that can be accommodated in the work chamber, it is possible to continuously vacuum-treat various non-standard workpieces. Therefore,
The flexibility of the apparatus is greatly improved, and a single vacuum processing apparatus can process various products.

The vertical movement stroke of the work chamber may be a width that does not damage the seal mechanism 22 such as an O-ring, and is extremely short, about 1 mm to 10 mm. Accordingly, it is possible to minimize the size of the main chamber. Therefore, the size of the vacuum processing apparatus can be suppressed to be compact, and the apparatus cost, installation cost, and running cost can be significantly improved.

Further, since the airtight mechanism of the vertical mechanism 10 can be simple, the cost of the apparatus can be reduced and the reliability can be increased.

In the present invention, the lower opening 5 of the work chamber acts as a vacuum breaker or a vacuum roughing port when loading and unloading the workpiece, and is lowered onto the transfer table 8. In the above description, the lower opening 5 acts as a high-vacuum exhaust port and also acts as a differential exhaust exhaust port during sputtering processing or the like. Rocking,
It can also be used as a power inlet for vibration and the like.

FIG. 7 is a conceptual view exemplifying an apparatus provided with a mechanism for rotating an object to be processed in the sputter processing space 3B. In this figure, the same elements as those described above with reference to FIGS. 1 to 6 are denoted by the same reference numerals, and detailed description thereof will be omitted.

In the apparatus shown in FIG. 7, a workpiece 1 in a work chamber is placed on a table 34. A rotary up-down mechanism 32 is provided below the sputter processing space 3B, and a shaft (drive shaft) 33 extending therefrom is connected to the opening H of the transfer table 8 and the work chamber 2
B is coupled to the table 34 of the workpiece 1 through the lower opening 5. During the sputtering, the object 1 can be rotated continuously or discontinuously in the direction of arrow D. Alternatively, the object to be processed can be vibrated or rocked using a cam mechanism or the like.

The operation of the shaft 33 during the sputtering process is not limited to the rotation in the direction of the arrow D, but may be an operation in the vertical direction parallel to the arrow C. Alternatively, the operation of the shaft 33 may be a combination of rotation and translation.

The rotary up / down mechanism 32 extends the shaft 33 to the table 34 as shown in the drawing during the sputtering process. When the sputtering process is completed, the shaft 33 is lowered in the direction of arrow C. Therefore, when the transfer table 8 transfers the work chamber, the shaft does not interfere.

If the table 34 is a single flat plate, the lower opening 5 may be blocked in the load lock space 3A. In response, table 34
If an opening (not shown) or a protruding portion extending downward is provided, the exhaust conductance through the lower opening 5 can be ensured.

Although the exhaust pump of the main chamber 3 is omitted in FIG. 7 for simplicity of explanation, the exhaust pump can be appropriately provided at a position where it does not interfere with other vertical mechanisms or rotating mechanisms.

FIG. 7 shows the simplest configuration, but the present invention is not limited to this. That is, according to the present invention, in the sputter processing space 3B, power is introduced into the work chamber via the lower opening 5 to rotate, rotate, vibrate, and swing the workpiece 1 or other elements. Various movements such as parallel movement, vertical movement, etc. can be appropriately given.

For example, when performing etching instead of sputtering in the processing space 3 B, it is possible to adjust the etching position of the object to be processed or introduce power for arranging the etching mask through the lower opening 5. it can.

By the way, power for rotating or swinging the object to be processed can be introduced through the upper opening 4 of the work chamber.

FIG. 8 is a conceptual diagram exemplifying an apparatus to which a mechanism for giving a motion to the workpiece 1 is added in the sputter processing space 3B. In this figure, the same elements as those described above with reference to FIGS. 1 to 7 are denoted by the same reference numerals, and detailed description thereof will be omitted.

In the apparatus illustrated in FIG. 8, a rotary up / down mechanism 32 is provided above the upper lid 9 in the sputter processing space 3B, and a shaft (drive shaft) 3 extending therefrom.
3 is connected to the table 34 of the workpiece 1 via the upper opening 4 of the work chamber 2B. And, during the sputtering, the workpiece 1 is continuously rotated or discontinuously rotated in the direction of arrow D, or the workpiece is vibrated or rocked using a cam mechanism or the like. Can also.

Also in this embodiment, the operation of the shaft 33 for imparting motion to the object is not limited to the rotation or rotation in the direction of arrow D, but the parallel movement parallel to arrow C. It may be an operation or an operation combining rotation and translation.

The rotary up-and-down mechanism 32 extends the shaft 33 to the table 34 as shown in the drawing during the sputtering process. When the sputtering process is completed, the shaft 33 is raised in the direction of arrow C. Therefore, when the transfer table 8 transfers the work chamber, the shaft does not interfere.

On the other hand, power for rotating or swinging the workpiece 1 can be introduced through the side wall of the work chamber.

FIG. 9 is a conceptual view exemplifying an apparatus to which a mechanism for imparting a movement to the workpiece 1 via the side wall of the work chamber is added in the sputter processing space 3B. Also in this figure, the same elements as those described above with reference to FIGS. 1 to 8 are denoted by the same reference numerals, and detailed description thereof will be omitted.

In the apparatus illustrated in FIG. 9, a rotary linear introduction mechanism 32 is provided on the side wall of the main chamber 3 in the sputter processing space 3B, and a shaft (drive shaft) 33A extends from the mechanism, and a table (not shown) of the work chamber 2B is provided. A coupling 33 is coupled to a shaft 33 </ b> B for driving the coupling 34. Further, a shaft 33B extending from the table 34 of the work chamber is rotatably attached to the side wall of the work chamber via the hermetic seal mechanism 24 (also capable of linear movement).

FIG. 9 illustrates a state in which the shafts 33A and 33B are connected by the coupling mechanism 35. In this state, when the rotary linear introduction mechanism 32 rotates or rotates in the direction of arrow D, the operation
A, is introduced into the work chamber 2B via 33B,
The workpiece 1 on the table 34 is appropriately rotated, rotated, vibrated, or rocked by a cam mechanism or a gear mechanism (not shown). Further, the rotation linear introduction mechanism 32 may introduce a linear motion along the direction of the arrow C or the direction opposite thereto.

When the predetermined vacuum processing is completed in the processing space 3B, the rotary linear introduction mechanism 32 moves the shaft 33A backward in the direction of arrow C. Thereby, the coupling mechanism 35 is separated, and the work chamber 2B can be transferred to the load lock space 3A or the like by the transfer table 8.

When the workpiece 1 is replaced in the load lock space 3A, the inside of the work chamber is brought to the atmospheric pressure in the state illustrated in FIG. At this time, the seal mechanism 24 of the mounting portion of the shaft 33B on the side wall of the work chamber 2B maintains airtightness.

Also in this example, the operation of the shafts 33A and 33B for imparting movement to the workpiece 1 is not limited to the rotation or rotation in the direction of arrow D, but is
May be performed in parallel, or may be a combination of rotation and parallel movement.

As described above, according to the configuration illustrated in FIG. 9, the seal mechanism 24 is provided on the side wall of the work chamber, and the seal mechanism 24 is provided via the coupling mechanism 35.
Power can be introduced through the side walls. Note that FIG.
In FIG. 5, the shaft 33B and the seal mechanism 24 are shown only in the work chamber 2B for simplicity, but it is obvious that a similar configuration can be added to the work chamber 2A in FIG.

By the way, the driving means for rotating and swinging the workpiece can be provided in the work chamber itself.

FIG. 10 is a conceptual diagram illustrating a device in which a driving means is added to a work chamber. That is, FIG. 2A is a plan view of the inside of the main chamber,
FIG. 2B is a partial cross-sectional view in the vertical direction. In FIG. 10, the same elements as those described above with reference to FIGS. 1 to 9 are denoted by the same reference numerals, and detailed description thereof will be omitted.

In the apparatus illustrated in FIG. 10, driving means 36 such as a vacuum-resistant motor is mounted on the outer walls of the work chambers 2A and 2B. A shaft 38 extends from the driving means 36 into the work chamber. A power transmission mechanism or a power conversion mechanism such as a cam or a gear (not shown) is provided at the tip of the shaft 38, and can appropriately impart a motion such as rotation, rotation, vibration, or swing to the workpiece 1. it can.

A power line 39 for applying power is connected to the driving means 36, and the power line 39 can be taken out through the rotary shaft 50 of the transfer table 8 and the like. However, when such a power line 39 is connected, the transport table cannot be continuously rotated in the direction of arrow A. For example, by rotating the transport table 180 degrees to the right and 180 degrees to the left, the work table is rotated. The chamber is transported to a predetermined space.

However, if the power line 39 is connected to a connecting means such as a slip ring, the transport table 8 can be continuously rotated.

FIG. 10 shows a specific example in which the driving means is attached to the side surface of the outer wall of the work chamber. However, the present invention is not limited to this. It can be mounted either inside the chamber or on the underside of the outer wall.

The sputtering apparatus having the basic structure to which the present invention is applied has been described with reference to FIGS. Hereinafter, modified examples of the present invention will be described.

FIG. 11 is a plan view conceptually showing the structure of a vacuum processing apparatus according to a modification of the present invention. That is, FIG. 2 shows the configuration of the main chamber, in which a load lock space 3A and a vacuum processing space 3B are provided.
Then, the four work chambers 2 </ b> A to 2 </ b> D are sequentially transferred to these spaces by the transfer table 8 in the direction of arrow A. The load lock space 3A is a portion for taking out and introducing an object to be processed as described above. On the other hand, in the vacuum processing space 3B, any one of various vacuum processes performed in a reduced pressure atmosphere such as film formation, etching, surface processing, surface modification, and evaluation is performed.

[0096] As the film formation, for example, evaporation, sputtering, chemical vapor deposition (Chemical Vapor Deposition: C)
VD), ion plating and the like.

The etching and surface processing include reactive ion etching (RIE) and chemical dry etching (CD).
E), ion milling (Ion Milling), plasma etching, focused ion beam etching (Focused Ion Be)
am etching: FIB), reactive ion beam etching, and the like.

Examples of the surface modification include plasma irradiation, ion implantation, electron beam irradiation, and vacuum heating.

The evaluation includes various evaluations for maintaining the surface of the object to be cleaned, evaluation of irradiating the object with an electron beam, and evaluation of detecting an electron beam emitted from the object. And evaluation using an ion beam. Specifically, for example, Auger electron spectroscopy, secondary ion mass spectroscopy (SIMS), electron energy loss spectroscopy (ELS) ESCA, X-ray photoelectron spectroscopy (XP
S), Ultraviolet photoelectron spectroscopy (UPS), X-ray probe micro analysis

According to the present modification, an irregular workpiece is placed in the work chamber, and at least one of the above-described various film formation, etching, surface processing, surface modification, and evaluation is performed under vacuum. It can be performed continuously in the processing space 3B.

Although FIG. 11 shows a case where four work chambers are provided, the present invention is not limited to this, and the number of work chambers may be three or five or more. . Further, the planar shape is not limited to the quadrangular shape as shown in the figure, and various shapes such as a circular shape, an elliptical shape, and a polygonal shape can be given. It can be appropriately determined according to the conditions.

Next, another modified example of the present invention will be described.

FIG. 12 is a plan view conceptually showing the structure of a vacuum processing apparatus according to another modification of the present invention. In this modification, four spaces 3A to 3A are provided in the main chamber.
3D is provided. Then, the four work chambers 2 </ b> A to 2 </ b> D are sequentially transferred to these spaces by the transfer table 8 along the direction of arrow A.

In the four spaces 3A to 3D provided in the main chamber, an object to be processed can be introduced and taken out, and various kinds of vacuum processing can be performed. The following are some specific examples. (Specific Example 1) (Space) (Contents) 3A Introduction and removal of the object to be treated 3B Pretreatment 3C Thin film deposition 3D Posttreatment

In this example, the treatment can be performed before and after the deposition of the thin film. For example, when depositing a thin film of a metallic material on the surface of a plastic molded product, a coating process called “lacquering” has conventionally been required to obtain a gloss on the surface. On the other hand, according to this specific example, before and after the deposition of the thin film, a special gas is introduced into the work chamber to generate plasma to form a polymerized film, or to irradiate the surface of plastics with plasma to irradiate the surface. It is possible to improve the adhesion of the sputtered film to be performed later and to improve the surface gloss by modifying the surface. That is, “pre-processing” and “post-processing” in this specific example
It can be said that this is a surface modification. According to this specific example, a series of processes can be continuously performed, and the productivity of the covering step of the plastics molded article can be dramatically improved.

Further, as described above, it is possible to process molded articles of various shapes having different shapes with the same apparatus, thereby improving the flexibility of the production line and reducing the equipment cost. (Specific Example 2) (Space) (Contents) 3A Introduction of Workpiece 3B Pretreatment 3C Thin Film Deposition 3D Removal of Workpiece

In this specific example, introduction and removal of the object to be processed are performed in different spaces. That is, the space 3A is used exclusively for introduction, and the space 3D is used exclusively for taking out. This makes it easy to automate the introduction and removal of the object to be processed, and to connect the preceding and subsequent steps with an automatic device. That is, the workpiece is transferred to the space 3A of the vacuum processing apparatus by the automation line, and is introduced into the work chamber by an automatic device such as a robot. On the other hand, the processing object after the vacuum processing is completed in the space 3
At D, it can be picked up by automatic equipment and sent to the next step by automatic line.

In this specific example, the space 3B,
The processing performed in 3C is not limited to the above. (Specific Example 3) (Space) (Contents) 3A Introduction of the object to be treated 3B Thin film deposition 3C Post-processing 3D Removal of the object to be treated

The third specific example is similar to the second specific example, except that post-processing is performed instead of pre-processing. (Specific Example 4) (Space) (Contents) 3A Introduction and removal of the object to be processed 3B Thin film deposition 3C Etching 3D Post-processing

In the case of the fourth specific example, the thin film deposition and the etching process can be performed continuously. Therefore,
It goes without saying that the productivity is improved, but in addition to this, the effect that the etching process can be performed while the surface of the deposited thin film is kept clean in a high vacuum. In this sense, a similar effect can be obtained when a thin film is deposited after the etching process. Further, various vacuum processes other than the thin film deposition and the etching process can be continuously performed in the same manner while maintaining the clean surface.

Although the present modified example has been described with reference to the four specific examples, other than these, various vacuum processes can be appropriately combined and continuously performed.

Furthermore, the number of processing spaces and the number of work chambers are not limited to four. Further, the number of processing spaces and the number of work chambers do not need to be the same, and the number of processing spaces may be larger than the work chamber, or may be smaller.

FIGS. 13 and 14 are conceptual diagrams showing further modifications of the present invention. For these figures, see FIG.
Elements similar to those described above with reference to FIG. 12 are denoted by the same reference numerals, and detailed description thereof will be omitted.

In this modification, a transfer arm is used in place of the transfer table 8 illustrated in FIGS. That is, the work chambers 2A and 2B are transported in the main chamber 3 while being placed on the transport arms 8A and 8B, respectively. Here, the work chamber may be fixed to the transfer arm, or may be just mounted.

The transfer arms 8A and 8B are rotatable about a shaft 72 in the direction of arrow C by a rotary up / down mechanism 70. FIG. 13 shows a work chamber 2A,
2B is lowered, indicating that the sheet can be transported. At the time of loading / unloading of the workpiece 1 or predetermined vacuum processing, the transfer arms 8A and 8B are lifted in the direction of arrow D by the rotary up / down mechanism 70 along the axial direction of the shaft 72. The chamber is brought into pressure contact with the upper lid 9.

As shown in FIG. 14, the transfer arms 8A,
8B each have a planar shape on which a work chamber can be placed. Further, as described above with reference to FIG.

The transfer arms 8A and 8B do not necessarily need to be linked. That is, the transfer arms can transfer the respective work chambers independently in the rotation direction (arrow C) or the up-down direction (arrow D) as long as they do not interfere with each other.

In the present invention, as described above, the stroke of the vertical movement of the work chamber is extremely small.

Although FIGS. 13 and 14 illustrate the case where two transfer arms are provided, three or more transfer arms can be provided.

As described above, FIGS. 1 to 14 illustrate a so-called “horizontal arrangement type” vacuum processing apparatus in which a load lock space and a vacuum processing space are arranged in a substantially horizontal plane.

However, the present invention can be applied to a "vertical arrangement type" vacuum processing apparatus. FIG. 15 is a conceptual diagram illustrating the configuration of the vacuum processing apparatus of the vertical arrangement type according to the present invention. Also in this figure, the same elements as those described above with reference to FIGS. 1 to 14 are denoted by the same reference numerals, and detailed description thereof will be omitted.

In the apparatus of this embodiment, the upper lid 9 of the main chamber 3 is arranged in a direction parallel to the vertical direction.
The opening of the load lock space 3A is also oriented parallel to the vertical direction. The inside of the configuration has a configuration similar to that illustrated in FIGS. 13 and 14. That is, the work chambers 2A and 2B are transported by the transport arms 8A and 8B, respectively. However, in this specific example, the work chamber is fixed to the transfer arm. Further, the workpiece 1 is also fixed by a fixing mechanism (not shown) as necessary so as not to fall down inside the work chamber.

According to this example, an object to be processed can be introduced and taken out from the introduction port parallel to the vertical direction, which is advantageous in that work can be easily performed. Further, since the main chamber 3 can be arranged vertically, the space occupied by the apparatus can be reduced. Since the vacuum processing apparatus is often installed in a clean room, if the occupied space is reduced, the manufacturing cost can be significantly reduced.

Further, according to this example, a so-called "wall-embedded type" apparatus in which the work surface of the vacuum processing apparatus is embedded in a wall surface can be provided. If the device is of a wall-embedded type, only the work surface of the device needs to be directed into the clean room, and the space occupied in the clean room can be reduced and the cost can be reduced.

The embodiment of the invention has been described with reference to examples. However, the present invention is not limited to these specific examples.

For example, FIGS. 1 to 14 show an example in which the work chamber is conveyed while being rotated coaxially by the transfer table 8 and the transfer arms 8A and 8B.
However, other than this, the spaces in the main chamber may be linearly arranged, and the work chamber may be linearly conveyed on a belt conveyor. In this case, a mechanism for returning the work chamber transported to the end point space to the start point space may be added.

Further, FIGS. 1 to 7 show an example in which the work chamber is not fixed to the transfer table 8 and can be separated from the transfer table 8. Is also good. In this case, the up-and-down mechanism 10 becomes unnecessary. Instead, the work chamber can be brought into pressure contact with the upper lid 9 by moving the transfer table 8 in the up-down direction. In addition, in this way, a vertically arranged vacuum processing apparatus as illustrated in FIG. 15 can be realized. That is, by arranging the transport table in parallel to the vertical direction instead of the horizontal direction, the opening of the load lock can be formed in a direction parallel to the vertical direction. In this way, a continuous vacuum processing apparatus of a wall-embedded type can be realized.

[0128]

The present invention is embodied in the form described above, and has the following effects.

First, according to the present invention, two or more work chambers can be sequentially transferred between the load lock space and the sputter processing space, and the introduction of the object to be processed,
The removal and the sputtering process can be performed continuously.

Further, according to the present invention, it is possible to continuously vacuum-treat various non-standard workpieces as long as they have a shape and dimensions that can be accommodated in the work chamber. Therefore, the flexibility of the apparatus is greatly improved, and various products can be processed by one vacuum processing apparatus.

Further, according to the present invention, the vertical movement stroke of the work chamber is controlled by the sealing mechanism 2
2 may be a width that does not damage 2 and is 1 mm to 1 mm.
It is extremely short, about 0 mm. Accordingly, it is possible to minimize the size of the main chamber. Therefore, the size of the vacuum processing apparatus can be suppressed to be compact, and the apparatus cost, installation cost, and running cost can be significantly improved.

As described above, according to the present invention, various vacuum processes can be easily and reliably performed in a wide range of industrial fields, and the industrial merit is great.

[Brief description of the drawings]

FIG. 1 is a sectional view conceptually illustrating the configuration of a vacuum processing apparatus of the present invention.

FIG. 2 is a sectional view conceptually illustrating the configuration of a vacuum processing apparatus of the present invention.

FIG. 3 shows a transfer table 8 and a load lock space 3
3A is a conceptual diagram illustrating a planar positional relationship with a sputter processing space 3B. FIG.

FIG. 4 is a work chamber 2 of a load lock space 3A.
A is lowered onto the transfer table 8 and the work chamber 2B of the sputter processing space 3B is lifted upward.

FIG. 5 is a work chamber 2 of a load lock space 3A.
A is lifted upward, and the work chamber 2B of the sputter processing space 3B is lowered on the transfer table 8.

FIG. 6 is a conceptual diagram illustrating a configuration of a device in which an up-down mechanism is omitted.

FIG. 7 is a conceptual diagram illustrating an apparatus to which a mechanism for rotating an object to be processed is added in a sputter processing space 3B.

FIG. 8 is a conceptual diagram exemplifying an apparatus to which a mechanism for giving a motion to an object to be processed is added in a sputter processing space 3B.

FIG. 9 is a conceptual diagram exemplifying an apparatus to which a mechanism for imparting a movement to a workpiece 1 via a side wall of a work chamber is added in a sputtering processing space 3B.

FIG. 10 is a conceptual diagram illustrating a device in which a driving unit is added to a work chamber.

FIG. 11 is a plan view conceptually showing a configuration of a vacuum processing apparatus of a modified example of the present invention.

FIG. 12 is a plan view conceptually showing the configuration of a vacuum processing apparatus according to another modification of the present invention.

FIG. 13 is a conceptual cross-sectional view illustrating a modified example including a transfer arm.

FIG. 14 is a conceptual plan view illustrating a main part of a transfer arm.

FIG. 15 is a conceptual diagram illustrating a configuration of a vacuum processing apparatus of a vertical arrangement type according to the present invention.

FIG. 16 is a cross-sectional view conceptually showing a configuration of a conventional batch vacuum evaporation apparatus.

FIG. 17 is a conceptual diagram illustrating the configuration of an in-line continuous film forming apparatus.

FIG. 18 is a conceptual diagram showing a main configuration of another vacuum processing apparatus proposed by the present inventors.

[Explanation of symbols]

 1 Workpiece 2A-2D Work chamber 3 Main chamber 3A Load lock space 3B Sputter processing space 3C, 3D load lock space, vacuum processing space 4 Upper opening (first opening) 5 Lower opening (second opening) 7 rotation Mechanism 8 Transfer table 8A, 8B Transfer arm 9 Upper lid 10 Vertical mechanism 11 Exhaust pipe 12 Vertical mechanism 13 Openable lid 14 Sputter source 15 Exhaust pump 16 Gate valve 17 Vacuum break valve 20 Magnet 22, 23, 24 Seal mechanism 30 Mount 32 Rotation Vertical mechanism (power introduction means) 33, 33A, 33B Shaft (drive shaft) 34 Table 35 Coupling mechanism 36 Drive means 38 Shaft 39 Power line 40 Power supply 50 Rotary axis 70 Rotating vertical mechanism 72 Shaft H Opening

 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 4F209 PB02 PQ16 4K029 AA11 CA05 DA01 DA10 JA02 KA02 KA09 4K030 CA07 GA04 GA05 GA12 KA08 KA11 KA12

Claims (14)

[Claims] 1. A vacuum processing apparatus for vacuum processing an object to be processed, comprising: a main chamber having a load lock space and a vacuum processing space, capable of maintaining an atmosphere reduced in pressure from the atmosphere; A plurality of work chambers accommodated and having a first opening and a second opening, a transfer mechanism for transferring the work chamber in the main chamber, and an exhaust pipe movable in the main chamber. When introducing or removing an object to be processed, one of the work chambers is transferred to the load lock space by the transfer mechanism, the first opening is pressed against an inner wall surface of the main chamber, and the exhaust pipe is Is connected to the second opening of the work chamber,
The internal space of the work chamber is cut off from the internal space of the main chamber so that the object can be introduced or taken out of the work chamber. When the object is vacuum-processed, the object is introduced. Transferring the work chamber to the vacuum processing space by the transfer mechanism, and performing vacuum processing in a state where at least one of the first opening and the second opening is opened in the main chamber. Characteristic vacuum processing equipment. 2. The apparatus according to claim 1, further comprising a power introduction unit having a drive shaft movable in the main chamber, wherein the power introduction unit is configured to move the second opening when the work chamber is transferred to the vacuum processing space. 2. The vacuum processing apparatus according to claim 1, wherein a motion is applied to the workpiece in the work chamber by the drive shaft via a shaft. 3. The apparatus according to claim 1, further comprising a power introduction unit having a drive shaft movable in said main chamber, wherein said power introduction unit is provided with said first opening when said work chamber is transferred to said vacuum processing space. 2. The vacuum processing apparatus according to claim 1, wherein a motion is applied to the workpiece in the work chamber by the drive shaft via a shaft. 4. A power introduction means having a drive shaft movable in the main chamber; and a power transmission mechanism provided on a side wall of the work chamber via a seal mechanism, wherein the power introduction means is provided. 2. The apparatus according to claim 1, wherein, in a state in which the work chamber is transported to the vacuum processing space, the workpiece is moved in the work chamber by the drive shaft via the power transmission mechanism. Vacuum processing equipment. 5. The vacuum processing apparatus according to claim 1, wherein said work chamber has a driving means for giving a motion to an object to be processed housed therein. 6. The apparatus according to claim 2, wherein the movement applied to the object is any one of rotation, rotation, vibration, and swing of the object. The vacuum processing apparatus according to item 1. 7. The method according to claim 1, wherein, during the vacuum processing, the inside of the work chamber is evacuated through the second opening while introducing a predetermined gas into the work chamber. A vacuum processing apparatus according to any one of the preceding claims. 8. The apparatus according to claim 1, wherein said main chamber has a plurality of vacuum processing spaces, and said load lock space and said plurality of vacuum processing spaces are arranged substantially concentrically. A vacuum processing apparatus according to any one of the preceding claims. 9. The vacuum processing space according to claim 1, wherein the vacuum processing space performs one of film formation, etching, surface processing, surface modification, and evaluation.
The vacuum processing apparatus according to any one of the above. 10. The transfer mechanism has a rotatable transfer table and an up-and-down mechanism, and the work chamber is placed on the transfer table in a state where the work chamber is mounted on the load lock space or the vacuum processing space. 10. The vacuum according to claim 1, wherein the first opening is pressed against the inner wall surface of the main chamber by raising the work chamber by the vertical mechanism. Processing equipment. 11. The load lock space, wherein the first opening is pressed against an inner wall surface of the main chamber by movement of the exhaust pipe.
The vacuum processing apparatus according to any one of the above. 12. The transfer mechanism has a plurality of transfer arms, and transfers the work chamber to the load lock space or the vacuum processing space by rotating the transfer arm around a rotation axis. The vacuum processing apparatus according to claim 1, wherein the first opening is pressed against an inner wall surface of the main chamber by moving an arm in a direction of the rotation axis. 13. The vacuum processing apparatus according to claim 12, wherein said work chamber is fixed to said transfer arm. 14. The vacuum processing apparatus according to claim 1, wherein said work chamber has a deposition-preventing plate detachable through said first opening.