JP2009061381A - Vacuum treating apparatus and vacuum treating method - Google Patents

Vacuum treating apparatus and vacuum treating method Download PDF

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JP2009061381A
JP2009061381A JP2007230866A JP2007230866A JP2009061381A JP 2009061381 A JP2009061381 A JP 2009061381A JP 2007230866 A JP2007230866 A JP 2007230866A JP 2007230866 A JP2007230866 A JP 2007230866A JP 2009061381 A JP2009061381 A JP 2009061381A
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top plate
substrate
decompression
processing apparatus
processing chamber
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JP5134317B2 (en
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Hidenori Miyamoto
英典 宮本
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Tokyo Ohka Kogyo Co Ltd
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a coating apparatus capable of drying a coating liquid applied on the surface of a substrate, in a short time without causing wind ripple. <P>SOLUTION: Supporting pins 2 on which a substrate W is placed and a top plate (a flow regulating plate) 3, are provided in a closed container 1, an opening for carrying out the delivery of the substrate W between the closed container 1 and a robot 4 arranged outside is formed on the side surface of the closed chamber 1, the opening is opened or closed by a cover body 7 moving up and down by driving a cylinder unit 6 and the top plate 3 is divided into several pieces, which are separately moved up and down by the cylinder units 12, 13. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

本発明は、基板表面に塗布した塗膜に対する減圧処理装置および減圧処理方法に関する。   The present invention relates to a vacuum processing apparatus and a vacuum processing method for a coating film applied to a substrate surface.

ガラス基板などに塗布した塗布液を乾燥せしめて被膜とするため、基板を減圧チャンバー内に所定時間入れておくことが従来から知られている。
例えば特許文献1には密閉容器内に整流板を配置し、初期の段階では表面に塗布液を塗布した基板と整流板との間を1mmまで接近させることで、基板と整流板との間に外側に広がる強い気流を生じさせ、この気流によって基板の周縁領域まで塗布液を行き渡らせ、そして、このままでは塗布液が周縁部に偏って、厚みが不均一になるので、ある程度、基板の周縁領域まで塗布液を行き渡ったならば、基板と整流板との間を5mmまで大きくすることが開示されている。
In order to dry a coating solution applied to a glass substrate or the like to form a film, it is conventionally known that the substrate is placed in a vacuum chamber for a predetermined time.
For example, in Patent Document 1, a current plate is arranged in a sealed container, and in the initial stage, the distance between the substrate having the coating liquid applied to the surface and the current plate is reduced to 1 mm, so that the space between the substrate and the current plate is between. A strong air current spreading outside is generated, and the coating liquid is spread to the peripheral area of the substrate by this air current, and since the coating liquid is biased toward the peripheral edge as it is, the thickness becomes non-uniform. It is disclosed that the distance between the substrate and the rectifying plate is increased to 5 mm when the coating solution is spread to the end.

特開2003−168643号公報Japanese Patent Laid-Open No. 2003-168643

特許文献1にあっては基板と整流板との間を狭くした状態で減圧を開始すると、基板と整流板との間で強い気流が発生し、この気流によって基板表面の中央部分に塗布された塗布液を、周縁部まで行き渡らせるというものである。   In Patent Document 1, when pressure reduction is started in a state where the space between the substrate and the current plate is narrowed, a strong air current is generated between the substrate and the current plate, and this air current is applied to the central portion of the substrate surface. The coating liquid is spread to the periphery.

しかしながら、本発明者らによる検証では、実際には塗布液を移動せしめる程の気流は発生しない。仮に発生した場合には、風紋が塗膜に転写されてしまう。むしろ、基板と整流板との間を大きくした場合の方が減圧時に乱流が発生し、これが風紋の原因になるとの知見を得た。   However, in the verification by the present inventors, an airflow that can move the coating liquid is not actually generated. If it occurs, the wind pattern is transferred to the coating film. Rather, it was found that when the space between the substrate and the rectifying plate is increased, turbulent flow is generated at the time of decompression, which causes wind ripples.

特に、最近ではガラス基板が大寸法になっており、このような基板と整流板との間を狭くして減圧乾燥を行うと、基板中央部から蒸発する溶媒の逃げ場がないため、基板中央部において乾燥不良を生じやすい。この場合も、時間を十分にかければ基板中央部を乾燥させることができるが、効率的ではない。   In particular, glass substrates have recently become large in size, and when such a substrate and a current plate are narrowed and dried under reduced pressure, there is no escape space for the solvent that evaporates from the center of the substrate. It is liable to cause poor drying. Also in this case, if the time is sufficient, the central portion of the substrate can be dried, but it is not efficient.

上記の課題を解決するため、本発明に係る減圧処理装置は、減圧装置につながる処理チャンバー内に基板載置台と天板とを配置し、前記天板は複数に分割され、各々独立して昇降動機構を有する構成とした。
または、減圧装置につながる処理チャンバー内に基板載置台と天板とを配置し、前記天板の一部または全部は伸縮可能な材質で構成され、かつ天板には1つまたは複数の独立した昇降駆動部が接続されている構成とした。
そして、いずれの構成においても前記天板の中央部分が独立して昇降動可能である構成とした。
In order to solve the above problems, a decompression processing apparatus according to the present invention has a substrate mounting table and a top plate disposed in a processing chamber connected to the decompression device, and the top plate is divided into a plurality of parts, each of which is lifted and lowered independently. The configuration has a moving mechanism.
Alternatively, a substrate mounting table and a top plate are arranged in a processing chamber connected to a decompression device, a part or all of the top plate is made of a stretchable material, and the top plate has one or more independent ones. It was set as the structure to which the raising / lowering drive part was connected.
And in any structure, it was set as the structure which the center part of the said top plate can raise / lower independently.

また、本発明に係る減圧処理装置は、減圧装置につながる処理チャンバー内に基板載置台と天板とを配置した減圧処理装置において、前記天板は一部例えば中央部が開閉可能な構成とした。   The decompression processing apparatus according to the present invention is a decompression processing apparatus in which a substrate mounting table and a top plate are arranged in a processing chamber connected to the decompression device. .

また、本発明に係る減圧乾燥処理方法は、減圧装置につながる処理チャンバー内に基板載置台と天板とを配置した減圧処理装置を用いた減圧乾燥処理方法であって、処理チャンバー内に塗布液が塗布された基板を投入した後、基板表面の塗布液と天板とを近接させた状態で処理チャンバー内を排気し、所定時間経過した後、前記基板表面の塗布液と天板との距離を大きくした状態で排気を継続するようにした。   The reduced-pressure drying treatment method according to the present invention is a reduced-pressure drying treatment method using a reduced-pressure treatment apparatus in which a substrate mounting table and a top plate are arranged in a treatment chamber connected to a decompression apparatus, and a coating liquid is provided in the treatment chamber. After the substrate coated with is applied, the processing chamber is evacuated in a state where the coating solution on the substrate surface and the top plate are close to each other, and after a predetermined time has elapsed, the distance between the coating solution on the substrate surface and the top plate. Exhaust was continued with a larger value.

また、天板の中央部分が周辺部分に対して独立して昇降動可能とされている場合には、処理チャンバー内に塗布液が塗布された基板を投入した後、基板表面の塗布液と天板とを近接させた状態で処理チャンバー内を排気し、所定時間経過した後、前記基板表面の塗布液と天板の中央部分との距離を大きくした状態で排気を継続する。   In addition, when the central portion of the top plate can be moved up and down independently with respect to the peripheral portion, after the substrate coated with the coating liquid is put into the processing chamber, the coating liquid on the substrate surface and the top The inside of the processing chamber is evacuated in a state in which the plate is in close proximity, and after a predetermined time has elapsed, the evacuation is continued in a state where the distance between the coating solution on the substrate surface and the central portion of the top plate is increased.

本発明によれば、基板の表面に塗布した塗布液を風紋などを生じることなく短時間のうちに乾燥(予備乾燥)せしめることができる。特に基板が大型化した場合でも、基板中央部の乾燥が周縁部に比べて遅くなることを防止することができる。   According to the present invention, the coating liquid applied to the surface of the substrate can be dried (preliminarily dried) in a short time without generating a wind pattern or the like. In particular, even when the substrate is enlarged, it is possible to prevent the drying of the central portion of the substrate from being slower than the peripheral portion.

以下に本発明の最適な実施例を添付図面に基づいて説明する。図1は本発明に係る減圧処理装置の内部構造を示す断面図、図2は天板の平面図、図3は天板が下降した状態を示す図1と同様の図、図4は天板の中央部分が上昇した状態の斜視図である。   DESCRIPTION OF EXEMPLARY EMBODIMENTS Hereinafter, preferred embodiments of the invention will be described with reference to the accompanying drawings. 1 is a cross-sectional view showing an internal structure of a decompression processing apparatus according to the present invention, FIG. 2 is a plan view of the top plate, FIG. 3 is a view similar to FIG. 1 showing a state where the top plate is lowered, and FIG. It is a perspective view of the state where the center part of the rose.

減圧処理装置は密閉チャンバー1内に基板Wを載置する支持ピン2と天板(整流板)3を設けている。密閉チャンバー1は側面に外部に配置したロボット4との間で基板Wの受け渡しを行うための開口5が形成され、この開口5をシリンダユニット6の駆動で上下する蓋体7で開閉するようにしている。   The decompression processing apparatus is provided with a support pin 2 and a top plate (rectifying plate) 3 for placing the substrate W in the sealed chamber 1. The hermetic chamber 1 is formed with an opening 5 for transferring the substrate W to and from the robot 4 disposed outside on the side surface, and the opening 5 is opened and closed by a lid 7 that moves up and down by driving of the cylinder unit 6. ing.

また、密閉チャンバー1の天井部には真空ポンプにつながる排気ポート8が設けられ、底面にはドレーンポート9が設けられている。   Further, an exhaust port 8 connected to a vacuum pump is provided on the ceiling portion of the sealed chamber 1, and a drain port 9 is provided on the bottom surface.

前記支持ピン2はホットプレート10を貫通するとともに、外部に設けたシリンダユニット11によって昇降動する。尚、図示例ではホットプレート10を設けているが、ホットプレート10は必ずしも必要ではない。   The support pin 2 penetrates the hot plate 10 and is moved up and down by a cylinder unit 11 provided outside. In the illustrated example, the hot plate 10 is provided, but the hot plate 10 is not necessarily required.

前記天板3は複数に分割されている。図2では、円形の中央部分3aとその外側部分3bの2つに分割された場合を示しているが、分割の形はこれに限定されず、中央部分は円形でなくても良いし、また天板は3つ以上に分割されたものであっても良い。中央部分3aはシリンダユニット12によって昇降動せしめられ、外側部分3bはシリンダユニット13によって昇降動せしめられる。   The top plate 3 is divided into a plurality of pieces. FIG. 2 shows a case where the circular portion is divided into a central portion 3a and an outer portion 3b. However, the shape of the division is not limited to this, and the central portion may not be circular. The top plate may be divided into three or more. The central portion 3 a is moved up and down by the cylinder unit 12, and the outer portion 3 b is moved up and down by the cylinder unit 13.

また別の態様では、前記天板3は伸縮可能な材質で構成され、天板3には1つまたは複数の昇降駆動部が設けられている。図5では、天板3の中央部分3aがシリンダユニット12によって昇降動せしめられ、外側部分3bはシリンダユニット13によって昇降動せしめられる。
伸縮可能な材質としては、ゴム、プラスチックなどの樹脂、あるいは、SUSなどのフレキシブルな金属板などを挙げることができる。
In another aspect, the top plate 3 is made of a stretchable material, and the top plate 3 is provided with one or a plurality of lifting drive units. In FIG. 5, the central portion 3 a of the top plate 3 is moved up and down by the cylinder unit 12, and the outer portion 3 b is moved up and down by the cylinder unit 13.
Examples of the stretchable material include resins such as rubber and plastic, and flexible metal plates such as SUS.

また、別の形態では、前記天板3はその一部、例えば中央部または周辺部が開閉可能に構成され、天板3は、蝶番によって、組み合わさっていて、ドアのように開閉することで、基板状の溶剤蒸発を促進させることができる。 Further, in another form, the top plate 3 is configured such that a part thereof, for example, a central portion or a peripheral portion can be opened and closed, and the top plate 3 is combined by a hinge and opened and closed like a door. The substrate-like solvent evaporation can be promoted.

以上において、基板Wの表面に塗布した塗布液を予備乾燥せしめるには、図1に示すように、シリンダユニット6の駆動で蓋体7を開け、ロボット4によって基板Wを密閉チャンバー1内の支持ピン2上に載置し、蓋体7を閉じる。   In the above, in order to preliminarily dry the coating solution applied to the surface of the substrate W, the lid 7 is opened by driving the cylinder unit 6 and the substrate 4 is supported in the sealed chamber 1 by the robot 4 as shown in FIG. Place on the pin 2 and close the lid 7.

次いで図3に示すように、天板3を押し下げて基板Wと天板3との間隔を5〜30mm程度とし、密閉チャンバー1内を減圧する。基板Wと天板3との間隔を5〜30mm程度とすることで、基板Wと天板3との間で乱流が発生することがなくなる。しかしながら、基板Wと天板3との間の容積は小さいため、基板中央部において特に塗布液中の溶剤が揮発しにくい。   Next, as shown in FIG. 3, the top plate 3 is pushed down so that the distance between the substrate W and the top plate 3 is about 5 to 30 mm, and the inside of the sealed chamber 1 is decompressed. By setting the distance between the substrate W and the top plate 3 to about 5 to 30 mm, turbulence is not generated between the substrate W and the top plate 3. However, since the volume between the substrate W and the top plate 3 is small, the solvent in the coating solution is particularly difficult to volatilize at the center of the substrate.

そこで、本発明にあってはある程度時間が経過して風紋が生じない程度まで塗膜が予備乾燥した時点で、シリンダユニット12を駆動し、図4に示すように天板の中央部分3aのみを上昇せしめ、中央部分3aが上昇することで形成された開口を介して、中央部分に溜まっていた溶剤蒸気を上方空間に逃がし、更に排気ポート8から回収または外部に逃す。このときの基板Wと天板3aとの間隔は基板サイズによっても異なるが、9〜70mm程度であることが望ましい。
尚、中央部分3aと外側部分3bを同時に上昇せしめて、基板Wと天板3との間の容積を大きくして溶剤の蒸発を促進せしめることも可能である。
Therefore, in the present invention, the cylinder unit 12 is driven when the coating film is preliminarily dried until a certain amount of time elapses and no wind ripples are generated, and only the central portion 3a of the top plate is moved as shown in FIG. The solvent vapor that has accumulated in the central portion is released to the upper space through the opening formed by raising the central portion 3a and then recovering from the exhaust port 8 or to the outside. Although the space | interval of the board | substrate W and the top plate 3a at this time changes also with board | substrate sizes, it is desirable that it is about 9-70 mm.
It is also possible to raise the central portion 3a and the outer portion 3b at the same time, thereby increasing the volume between the substrate W and the top plate 3 to promote the evaporation of the solvent.

また、上記の方法では、最初に天板3を押し下げる手段を記載したが、逆に基板Wを上昇させる方法をとることもできる。具体的には、基板Wを密閉チャンバー1内の支持ピン2上に載置し、蓋体7を閉じた後にシリンダユニット11の駆動で支持ピン2とともに基板Wを上昇させて基板Wと天板3との間隔を5〜30mm程度とし、密閉チャンバー1内を減圧する(なお、このとき天板3はなくても良く、その場合には密閉チャンバー1内の天井部と基板Wとの間隔を5〜30mm程度に保てば良い)。次いで、ある程度時間が経過して風紋が生じない程度まで塗膜が予備乾燥した時点で、シリンダユニット11を駆動し、支持ピン2とともに基板Wを下降させることで、中央部分に溜まっていた溶剤蒸気を上方空間に逃がし、更に排気ポート8から回収または外部に逃す。このときの基板Wと天板3(あるいは天井部)との間隔は基板サイズによっても異なるが、9〜70mm程度であることが望ましい。 Further, in the above method, the means for first pushing down the top plate 3 is described, but conversely, a method of raising the substrate W can be taken. Specifically, the substrate W is placed on the support pins 2 in the sealed chamber 1, the lid 7 is closed, and then the cylinder unit 11 is driven to raise the substrate W together with the support pins 2 so that the substrate W and the top plate are moved. 3 is set to about 5 to 30 mm, and the inside of the sealed chamber 1 is depressurized (in this case, the top plate 3 may not be provided. In this case, the distance between the ceiling portion in the sealed chamber 1 and the substrate W is It may be kept at about 5 to 30 mm). Next, when the coating film is preliminarily dried until a certain amount of time elapses, the cylinder unit 11 is driven, and the substrate W is lowered together with the support pins 2, so that the solvent vapor accumulated in the central portion is reached. Is allowed to escape to the upper space, and is further recovered from the exhaust port 8 or released to the outside. Although the space | interval of the board | substrate W and the top plate 3 (or ceiling part) at this time changes also with board | substrate sizes, it is desirable that it is about 9-70 mm.

この後、ポットプレート10によって基板を加熱し、予備乾燥せしめられた塗膜をベークし、被膜を形成する。   Thereafter, the substrate is heated by the pot plate 10 and the pre-dried coating film is baked to form a coating film.

図示例にあっては、天板を昇降させる駆動源としてシリンダユニットを示したが、モータ或いはモータとシリンダユニットとの組み合わせでもよい。例えば、中央部分3aをモータにて昇降動させ、外側部分3bをシリンダユニットによって昇降動せしめるようにしてもよい。また、天板昇降のタイミングは時間経過以外に真空計での接点をトリガーとしてもよい。更に、分割された天板のつなぎ目は、風紋を抑制するための初期乾燥工程で、天板上側と下側との空気の授受が行われない程度が望ましい。   In the illustrated example, the cylinder unit is shown as a drive source for raising and lowering the top plate, but a motor or a combination of a motor and a cylinder unit may be used. For example, the central portion 3a may be moved up and down by a motor, and the outer portion 3b may be moved up and down by a cylinder unit. Moreover, the timing of raising and lowering the top plate may be triggered by a contact point of a vacuum gauge other than the passage of time. Furthermore, it is desirable that the joints between the divided top plates are such that air is not exchanged between the upper and lower sides of the top plate in the initial drying process for suppressing wind ripples.

天板は塗膜の乾燥と連動してゆっくりと上昇させてもよいし、時間や真空度をトリガーとして一気に上昇させてもよい。また、天板の上昇は一括して行ってもよいし、分割して行ってもよい。   The top plate may be slowly raised in conjunction with the drying of the coating film, or may be raised at a stretch using time or the degree of vacuum as a trigger. Further, the top plate may be raised all at once or may be divided.

天板の分割は2分割だけではなく、3分割、4分割、又はそれ以上でもよい。また、 天板の開口パターンは真ん中だけではなくパンチング状に開口して溶剤蒸気を逃がしてもよい。また、天板をフレキシブルな被膜で形成し、各駆動部の昇降で凸形や凹形に変形させてもよい。更に、天板を基板に対して斜めに傾斜させて溶剤蒸気を逃がしてもよい。 The top plate may be divided not only into two parts but also into three parts, four parts, or more. Further, the opening pattern of the top plate may be opened not only in the middle but also in a punching shape to release the solvent vapor. Further, the top plate may be formed of a flexible film and may be deformed into a convex shape or a concave shape by raising and lowering each driving unit. Further, the top plate may be inclined with respect to the substrate to release the solvent vapor.

更に本発明に係る減圧処理装置は乾燥処理のみに適用することに限定されず、例えばスチームホットプレートにおいて、 処理終盤に余剰なスチームガスを置換するために、天板中央を開口させて排気をとる場合や、真空スピン塗布装置において、処理終盤に天板中央を開き、空気を導入して基板をスピン乾燥させる場合にも適用できる。   Further, the decompression apparatus according to the present invention is not limited to being applied only to the drying process. For example, in a steam hot plate, in order to replace excess steam gas at the end of the process, the center of the top plate is opened and exhausted. In the case of a vacuum spin coating apparatus, the present invention can also be applied to the case where the center of the top plate is opened at the end of the process and air is introduced to spin dry the substrate.

本発明に係る減圧処理装置の内部構造を示す断面図Sectional drawing which shows the internal structure of the decompression processing apparatus which concerns on this invention 天板の平面図Top view of the top plate 天板全体が下降した状態を示す図1と同様の図The same figure as FIG. 1 which shows the state which the whole top plate fell. 天板の中央部分が上昇した状態を示す図1と同様の図The same figure as FIG. 1 which shows the state which the center part of the top plate rose 別実施例を示す図4と同様の図The same figure as FIG. 4 showing another embodiment

符号の説明Explanation of symbols

1…密閉チャンバー、2…支持ピン、3…天板(整流板)、3a…天板の中央部分、3b…天板の外側部分、4…ロボット、5…開口、6…シリンダユニット、7…扉、8…排気ポート、9…ドレーンポート、10…ホットプレート、11、12、13…シリンダユニット、W…基板。   DESCRIPTION OF SYMBOLS 1 ... Sealed chamber, 2 ... Support pin, 3 ... Top plate (rectifier plate), 3a ... Center part of top plate, 3b ... Outer part of top plate, 4 ... Robot, 5 ... Opening, 6 ... Cylinder unit, 7 ... Door, 8 ... exhaust port, 9 ... drain port, 10 ... hot plate, 11, 12, 13 ... cylinder unit, W ... substrate.

Claims (8)

減圧装置につながる処理チャンバー内に基板載置台と天板とを配置した減圧処理装置において、前記天板は複数に分割され、各々独立して昇降動機構を有していることを特徴とする減圧処理装置。 A decompression processing apparatus in which a substrate mounting table and a top plate are arranged in a processing chamber connected to a decompression device, wherein the top plate is divided into a plurality of parts, and each has a lifting mechanism independently. Processing equipment. 前記天板の昇降動機構は処理レシピにより制御されていることを特徴とする請求項1に記載の減圧処理装置。 The decompression processing apparatus according to claim 1, wherein the elevating mechanism of the top plate is controlled by a processing recipe. 減圧装置につながる処理チャンバー内に基板載置台と天板とを配置した減圧処理装置において、前記天板の一部または全部は伸縮可能な材質で構成され、かつ天板には1つまたは複数の独立した昇降駆動部が接続されていることを特徴とする減圧処理装置。 In the decompression processing apparatus in which the substrate mounting table and the top plate are arranged in a processing chamber connected to the decompression device, a part or all of the top plate is made of a stretchable material, and the top plate has one or more An independent lifting drive unit is connected to the decompression apparatus. 減圧装置につながる処理チャンバー内に基板載置台と天板とを配置した減圧処理装置において、前記天板は一部が開閉可能な構成とされていることを特徴とする減圧処理装置。 A decompression processing apparatus in which a substrate mounting table and a top plate are disposed in a processing chamber connected to the decompression device, wherein the top plate is configured to be partially openable and closable. 前記減圧処理装置において、前記天板の中央部分が独立して昇降動可能であることを特徴とする請求項1〜3のいずれか1項に記載の減圧処理装置。 In the said decompression processing apparatus, the center part of the said top plate can be moved up and down independently, The decompression processing apparatus of any one of Claims 1-3 characterized by the above-mentioned. 前記減圧処理装置において、前記天板の中央部分が独立して開閉可能であることを特徴とする請求項4に記載の減圧処理装置。 The decompression processing apparatus according to claim 4, wherein a central portion of the top plate can be opened and closed independently. 減圧装置につながる処理チャンバー内に基板載置台と天板とを配置した減圧処理装置を用いた減圧乾燥処理方法であって、処理チャンバー内に塗布液が塗布された基板を投入した後、基板表面の塗布液と天板とを近接させた状態で処理チャンバー内を排気し、所定時間経過した後、前記基板表面の塗布液と天板との距離を大きくした状態で排気を継続することを特徴とする減圧乾燥処理方法。 A reduced-pressure drying method using a reduced-pressure processing apparatus in which a substrate mounting table and a top plate are arranged in a processing chamber connected to a reduced-pressure apparatus, and after a substrate coated with a coating liquid is introduced into the processing chamber, the substrate surface The processing chamber is evacuated in a state where the coating solution and the top plate are close to each other, and after a predetermined time has elapsed, the evacuation is continued in a state where the distance between the coating solution on the substrate surface and the top plate is increased. A vacuum drying treatment method. 請求項1から請求項6のいずれか1項に記載の減圧処理装置を用いた減圧乾燥処理方法であって、処理チャンバー内に塗布液が塗布された基板を投入した後、基板表面の塗布液と天板とを近接させた状態で処理チャンバー内を排気し、所定時間経過した後、前記基板表面の塗布液と天板の中央部分との距離を大きくした状態で排気を継続することを特徴とする減圧乾燥処理方法。 A reduced-pressure drying method using the reduced-pressure processing apparatus according to any one of claims 1 to 6, wherein after a substrate coated with a coating solution is placed in a processing chamber, the coating solution on the substrate surface The processing chamber is evacuated in a state where the top plate and the top plate are close to each other, and after a predetermined time has elapsed, the evacuation is continued in a state where the distance between the coating solution on the substrate surface and the central portion of the top plate is increased. A vacuum drying treatment method.
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CN102688840A (en) * 2012-06-14 2012-09-26 深圳广田高科新材料有限公司 Floating connection structure for vacuum spraying equipment
TWI417497B (en) * 2008-09-25 2013-12-01 Tokyo Electron Ltd Reduced-pressure drying device and reduced-pressure drying method
JP7381526B2 (en) 2021-08-20 2023-11-15 株式会社Screenホールディングス Vacuum drying equipment, vacuum drying method and program

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JP2003272992A (en) * 2002-03-12 2003-09-26 Tokyo Electron Ltd Vacuum dryer and vacuum drying method
JP2007040559A (en) * 2005-08-01 2007-02-15 Seiko Epson Corp Decompression drier

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JP2003272992A (en) * 2002-03-12 2003-09-26 Tokyo Electron Ltd Vacuum dryer and vacuum drying method
JP2007040559A (en) * 2005-08-01 2007-02-15 Seiko Epson Corp Decompression drier

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI417497B (en) * 2008-09-25 2013-12-01 Tokyo Electron Ltd Reduced-pressure drying device and reduced-pressure drying method
CN102688840A (en) * 2012-06-14 2012-09-26 深圳广田高科新材料有限公司 Floating connection structure for vacuum spraying equipment
JP7381526B2 (en) 2021-08-20 2023-11-15 株式会社Screenホールディングス Vacuum drying equipment, vacuum drying method and program

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