TW200609673A - Radiation-sensitive resin composition, spacer and the formation method thereof, and liquid crystal display element - Google Patents

Radiation-sensitive resin composition, spacer and the formation method thereof, and liquid crystal display element

Info

Publication number
TW200609673A
TW200609673A TW094113612A TW94113612A TW200609673A TW 200609673 A TW200609673 A TW 200609673A TW 094113612 A TW094113612 A TW 094113612A TW 94113612 A TW94113612 A TW 94113612A TW 200609673 A TW200609673 A TW 200609673A
Authority
TW
Taiwan
Prior art keywords
ethylenically unsaturated
radiation
resin composition
sensitive resin
spacer
Prior art date
Application number
TW094113612A
Other languages
English (en)
Inventor
Daigo Ichinohe
Toshihiro Nishio
Tomoko Iwabuchi
Original Assignee
Jsr Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jsr Corp filed Critical Jsr Corp
Publication of TW200609673A publication Critical patent/TW200609673A/zh

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/46—Polymerisation initiated by wave energy or particle radiation
    • C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
    • C08F2/50—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light with sensitising agents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/10—Esters
    • C08F220/26—Esters containing oxygen in addition to the carboxy oxygen
    • C08F220/32—Esters containing oxygen in addition to the carboxy oxygen containing epoxy radicals
    • C08F220/325—Esters containing oxygen in addition to the carboxy oxygen containing epoxy radicals containing glycidyl radical, e.g. glycidyl (meth)acrylate
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0005—Production of optical devices or components in so far as characterised by the lithographic processes or materials used therefor
    • G03F7/0007—Filters, e.g. additive colour filters; Components for display devices
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/031—Organic compounds not covered by group G03F7/029
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/075—Silicon-containing compounds
    • G03F7/0755—Non-macromolecular compounds containing Si-O, Si-C or Si-N bonds

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Organic Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Materials For Photolithography (AREA)
  • Liquid Crystal (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
TW094113612A 2004-05-12 2005-04-28 Radiation-sensitive resin composition, spacer and the formation method thereof, and liquid crystal display element TW200609673A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004142821A JP4539165B2 (ja) 2004-05-12 2004-05-12 感放射線性樹脂組成物、スペーサー、およびその形成方法、並びに液晶表示素子

Publications (1)

Publication Number Publication Date
TW200609673A true TW200609673A (en) 2006-03-16

Family

ID=35349590

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094113612A TW200609673A (en) 2004-05-12 2005-04-28 Radiation-sensitive resin composition, spacer and the formation method thereof, and liquid crystal display element

Country Status (4)

Country Link
JP (1) JP4539165B2 (zh)
KR (1) KR101169474B1 (zh)
CN (1) CN1696827A (zh)
TW (1) TW200609673A (zh)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005338831A (ja) * 2004-05-25 2005-12-08 Samsung Electronics Co Ltd 液晶表示装置の有機膜フォトレジスト組成物、そのスピンレスコーティング方法、これを用いた有機膜パターン形成方法及びこれにより製造された液晶表示装置
JP4772482B2 (ja) * 2005-12-02 2011-09-14 富士フイルム株式会社 カラーフィルタ及びその製造方法、並びにカラーフィルタを有する表示装置
JP4816917B2 (ja) * 2006-03-17 2011-11-16 Ｊｓｒ株式会社 感放射線性樹脂組成物、液晶表示パネル用スペーサー、液晶表示パネル用スペーサーの形成方法、および液晶表示パネル
JP4895034B2 (ja) * 2006-05-24 2012-03-14 Ｊｓｒ株式会社 感放射線性樹脂組成物、スペーサーおよびその形成方法
JP4998735B2 (ja) * 2006-12-28 2012-08-15 Ｊｓｒ株式会社 感放射線性組成物、カラーフィルタ、ブラックマトリックスおよび液晶表示素子
KR101473511B1 (ko) * 2007-10-09 2014-12-16 쇼와 덴코 가부시키가이샤 감광성 그래프트 폴리머 및 그것을 함유하는 감광성 수지 조성물
JP5817237B2 (ja) * 2010-07-29 2015-11-18 Jsr株式会社 感放射線性樹脂組成物、硬化膜、カラーフィルタ、硬化膜の形成方法及びカラーフィルタの形成方法
CN102385251B (zh) * 2010-08-17 2015-04-01 Jsr株式会社 放射线敏感性树脂组合物、固化膜、固化膜的形成方法、滤色器以及滤色器的形成方法
JP5966268B2 (ja) * 2011-07-22 2016-08-10 Jsr株式会社 アレイ基板、液晶表示素子およびアレイ基板の製造方法
JP6135063B2 (ja) * 2011-08-30 2017-05-31 住友化学株式会社 硬化性樹脂組成物
WO2013084283A1 (ja) 2011-12-05 2013-06-13 日立化成株式会社 タッチパネル用電極の保護膜の形成方法、感光性樹脂組成物及び感光性エレメント
WO2013084282A1 (ja) 2011-12-05 2013-06-13 日立化成株式会社 樹脂硬化膜パターンの形成方法、感光性樹脂組成物及び感光性エレメント
JP2013160921A (ja) * 2012-02-06 2013-08-19 Fujifilm Corp 着色感光性樹脂組成物、カラーフィルタ、液晶表示パネル及び液晶表示素子
CN107329330B (zh) * 2017-07-28 2020-05-19 武汉华星光电技术有限公司 液晶显示面板及其制作方法、柱状隔垫物

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62278545A (ja) * 1986-05-27 1987-12-03 Nec Corp パタ−ン形成方法
JPS63257748A (ja) * 1987-04-15 1988-10-25 Fuji Photo Film Co Ltd 水溶性感光性組成物
JP3471425B2 (ja) * 1994-05-30 2003-12-02 三菱化学株式会社 カラーフィルター用重合組成物
JPH10142793A (ja) * 1996-11-15 1998-05-29 Taiyo Ink Mfg Ltd アルカリ現像可能なソルダーレジスト組成物
JPH11133600A (ja) * 1997-10-30 1999-05-21 Jsr Corp 表示パネルスペーサー用感放射線性樹脂組成物
JP4269115B2 (ja) * 1999-05-10 2009-05-27 Ｊｓｒ株式会社 感放射線性樹脂組成物、層間絶縁膜およびスペーサー
JP2001154206A (ja) * 1999-11-25 2001-06-08 Jsr Corp スペーサー用感放射線性樹脂組成物、スペーサーおよび液晶表示素子
JP2001151829A (ja) * 1999-11-26 2001-06-05 Jsr Corp 感放射線性樹脂組成物およびスペーサー
JP3734436B2 (ja) * 2001-09-19 2006-01-11 奇美実業股▲分▼有限公司 液晶ディスプレーのスペーサー用感光性樹脂組成物

Also Published As

Publication number Publication date
KR101169474B1 (ko) 2012-07-30
JP2005326507A (ja) 2005-11-24
KR20060046050A (ko) 2006-05-17
JP4539165B2 (ja) 2010-09-08
CN1696827A (zh) 2005-11-16

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