TW200601551A - Non-volatile ferroelectric thin film device using an organic ambipolar semiconductor and method for processing such a device - Google Patents

Non-volatile ferroelectric thin film device using an organic ambipolar semiconductor and method for processing such a device

Info

Publication number
TW200601551A
TW200601551A TW093139253A TW93139253A TW200601551A TW 200601551 A TW200601551 A TW 200601551A TW 093139253 A TW093139253 A TW 093139253A TW 93139253 A TW93139253 A TW 93139253A TW 200601551 A TW200601551 A TW 200601551A
Authority
TW
Taiwan
Prior art keywords
processing
thin film
ferroelectric thin
volatile ferroelectric
ambipolar semiconductor
Prior art date
Application number
TW093139253A
Other languages
English (en)
Inventor
Gerwin Hermanus Gelinck
Albert W Marsman
Fredericus Johannes Touwslager
Leeuw Dagobert Michel De
Original Assignee
Koninkl Philips Electronics Nv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koninkl Philips Electronics Nv filed Critical Koninkl Philips Electronics Nv
Publication of TW200601551A publication Critical patent/TW200601551A/zh

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K19/00Integrated devices, or assemblies of multiple devices, comprising at least one organic element specially adapted for rectifying, amplifying, oscillating or switching, covered by group H10K10/00
    • H10K19/201Integrated devices having a three-dimensional layout, e.g. 3D ICs
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B82NANOTECHNOLOGY
    • B82YSPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C11/00Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
    • G11C11/21Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements
    • G11C11/22Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using ferroelectric elements
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K10/00Organic devices specially adapted for rectifying, amplifying, oscillating or switching; Organic capacitors or resistors having potential barriers
    • H10K10/40Organic transistors
    • H10K10/46Field-effect transistors, e.g. organic thin-film transistors [OTFT]
    • H10K10/462Insulated gate field-effect transistors [IGFETs]
    • H10K10/468Insulated gate field-effect transistors [IGFETs] characterised by the gate dielectrics
    • H10K10/471Insulated gate field-effect transistors [IGFETs] characterised by the gate dielectrics the gate dielectric comprising only organic materials
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/40Electrodes ; Multistep manufacturing processes therefor
    • H01L29/401Multistep manufacturing processes
    • H01L29/4011Multistep manufacturing processes for data storage electrodes
    • H01L29/40111Multistep manufacturing processes for data storage electrodes the electrodes comprising a layer which is used for its ferroelectric properties
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/40Electrodes ; Multistep manufacturing processes therefor
    • H01L29/43Electrodes ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
    • H01L29/49Metal-insulator-semiconductor electrodes, e.g. gates of MOSFET
    • H01L29/51Insulating materials associated therewith
    • H01L29/516Insulating materials associated therewith with at least one ferroelectric layer
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/66007Multistep manufacturing processes
    • H01L29/66075Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
    • H01L29/66227Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
    • H01L29/66409Unipolar field-effect transistors
    • H01L29/66477Unipolar field-effect transistors with an insulated gate, i.e. MISFET
    • H01L29/6684Unipolar field-effect transistors with an insulated gate, i.e. MISFET with a ferroelectric gate insulator
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76Unipolar devices, e.g. field effect transistors
    • H01L29/772Field effect transistors
    • H01L29/78Field effect transistors with field effect produced by an insulated gate
    • H01L29/78391Field effect transistors with field effect produced by an insulated gate the gate comprising a layer which is used for its ferroelectric properties

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Nanotechnology (AREA)
  • Mathematical Physics (AREA)
  • Ceramic Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Semiconductor Memories (AREA)
  • Non-Volatile Memory (AREA)
  • Formation Of Insulating Films (AREA)
  • Thin Film Transistor (AREA)
  • Liquid Deposition Of Substances Of Which Semiconductor Devices Are Composed (AREA)
TW093139253A 2003-12-22 2004-12-17 Non-volatile ferroelectric thin film device using an organic ambipolar semiconductor and method for processing such a device TW200601551A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP03104889 2003-12-22

Publications (1)

Publication Number Publication Date
TW200601551A true TW200601551A (en) 2006-01-01

Family

ID=34717220

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093139253A TW200601551A (en) 2003-12-22 2004-12-17 Non-volatile ferroelectric thin film device using an organic ambipolar semiconductor and method for processing such a device

Country Status (9)

Country Link
US (1) US7829884B2 (zh)
EP (1) EP1700309B1 (zh)
JP (1) JP2007523469A (zh)
KR (1) KR20060123368A (zh)
CN (1) CN1898747B (zh)
AT (1) ATE362178T1 (zh)
DE (1) DE602004006441T2 (zh)
TW (1) TW200601551A (zh)
WO (1) WO2005064614A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI737308B (zh) * 2020-01-03 2021-08-21 台灣積體電路製造股份有限公司 用於電容匹配的積體電路及製造包括mfmis-fet的積體電路的方法

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4883558B2 (ja) * 2005-03-25 2012-02-22 国立大学法人大阪大学 両極性有機電界効果薄層トランジスター及びその製造方法
JP4883672B2 (ja) * 2005-11-16 2012-02-22 国立大学法人神戸大学 強誘電体記憶素子及び強誘電体記憶装置
JP2007184462A (ja) * 2006-01-10 2007-07-19 Agfa Gevaert Nv 強誘電性記憶素子、その素子を含むデバイス及びその製法
JP5297633B2 (ja) 2006-11-22 2013-09-25 富士フイルム株式会社 反射防止フィルムの製造方法
EP1995736A1 (en) * 2007-05-22 2008-11-26 Rijksuniversiteit Groningen Ferro-electric device and modulatable injection barrier
CN102203974A (zh) * 2008-10-29 2011-09-28 皇家飞利浦电子股份有限公司 双栅极场效应晶体管和生产双栅极场效应晶体管的方法
KR101201891B1 (ko) 2009-03-26 2012-11-16 한국전자통신연구원 투명 비휘발성 메모리 박막 트랜지스터 및 그의 제조 방법
WO2010119124A1 (en) 2009-04-16 2010-10-21 Imec Organic non-volatile memory device
DE102009032696A1 (de) * 2009-07-09 2011-01-13 Polyic Gmbh & Co. Kg Organisch elektronische Schaltung
US8558295B2 (en) 2009-08-25 2013-10-15 Electronics And Telecommunications Research Institute Nonvolatile memory cell and method of manufacturing the same
KR101148798B1 (ko) * 2010-02-26 2012-05-24 연세대학교 산학협력단 누설 전류를 억제하는 수단이 구비된 강유전체 메모리 소자 및 그 강유전체 메모리 소자의 제조 방법
ITMI20111447A1 (it) 2011-07-29 2013-01-30 E T C Srl Transistor organico elettroluminescente
ITMI20111446A1 (it) * 2011-07-29 2013-01-30 E T C Srl Transistor organico elettroluminescente
CN103296206B (zh) * 2013-06-13 2016-08-10 复旦大学 有机非易失性铁电三位存储器及其制造方法
JP2016164899A (ja) * 2013-07-05 2016-09-08 旭硝子株式会社 有機トランジスタ素子の製造方法
WO2015134904A1 (en) 2014-03-06 2015-09-11 The Regents Of The University Of Michigan Field effect transistor memory device
KR101537492B1 (ko) * 2014-12-26 2015-07-16 성균관대학교산학협력단 강유전체를 이용한 2차원 구조 물질의 p―n 접합 형성 방법 및 강유전체를 이용하여 p―n 접합된 2차원 구조 물질
CN113892156A (zh) 2019-04-08 2022-01-04 开普勒计算公司 掺杂极性层及并入有掺杂极性层的半导体装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3035331B2 (ja) 1990-11-15 2000-04-24 オリンパス光学工業株式会社 メモリセル及びメモリ装置
CN100483774C (zh) * 1999-12-21 2009-04-29 造型逻辑有限公司 半导体器件及其形成方法
JP4688343B2 (ja) * 2001-05-16 2011-05-25 ルネサスエレクトロニクス株式会社 強誘電体メモリ装置
EP1306909A1 (en) * 2001-10-24 2003-05-02 Interuniversitair Micro-Elektronica Centrum Ambipolar organic transistors
DE10200475A1 (de) * 2002-01-09 2003-07-24 Samsung Sdi Co Nichtflüchtiges Speicherelement und Anzeigematrizen daraus
NO315399B1 (no) * 2002-03-01 2003-08-25 Thin Film Electronics Asa Minnecelle
JP2003281883A (ja) * 2002-03-26 2003-10-03 Matsushita Electric Ind Co Ltd 半導体記憶装置及びその駆動方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI737308B (zh) * 2020-01-03 2021-08-21 台灣積體電路製造股份有限公司 用於電容匹配的積體電路及製造包括mfmis-fet的積體電路的方法

Also Published As

Publication number Publication date
CN1898747B (zh) 2010-06-16
JP2007523469A (ja) 2007-08-16
DE602004006441T2 (de) 2008-05-15
KR20060123368A (ko) 2006-12-01
EP1700309B1 (en) 2007-05-09
CN1898747A (zh) 2007-01-17
US20070252137A1 (en) 2007-11-01
EP1700309A1 (en) 2006-09-13
ATE362178T1 (de) 2007-06-15
WO2005064614A1 (en) 2005-07-14
DE602004006441D1 (de) 2007-06-21
US7829884B2 (en) 2010-11-09

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