TW200525793A - Method for the application of active materials onto active surfaces and devices made with such methods - Google Patents
Method for the application of active materials onto active surfaces and devices made with such methods Download PDFInfo
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- TW200525793A TW200525793A TW093128654A TW93128654A TW200525793A TW 200525793 A TW200525793 A TW 200525793A TW 093128654 A TW093128654 A TW 093128654A TW 93128654 A TW93128654 A TW 93128654A TW 200525793 A TW200525793 A TW 200525793A
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- Prior art keywords
- active
- fluorinated
- layer
- group
- liquid
- Prior art date
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- ZOQXMEDOTSCWAG-UHFFFAOYSA-N n-phenyl-n-(2-phenylethenyl)aniline Chemical compound C=1C=CC=CC=1N(C=1C=CC=CC=1)C=CC1=CC=CC=C1 ZOQXMEDOTSCWAG-UHFFFAOYSA-N 0.000 description 1
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- 235000012149 noodles Nutrition 0.000 description 1
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 1
- 150000002902 organometallic compounds Chemical class 0.000 description 1
- 125000002524 organometallic group Chemical group 0.000 description 1
- 150000004880 oxines Chemical class 0.000 description 1
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- IEQIEDJGQAUEQZ-UHFFFAOYSA-N phthalocyanine Chemical compound N1C(N=C2C3=CC=CC=C3C(N=C3C4=CC=CC=C4C(=N4)N3)=N2)=C(C=CC=C2)C2=C1N=C1C2=CC=CC=C2C4=N1 IEQIEDJGQAUEQZ-UHFFFAOYSA-N 0.000 description 1
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- 229920000553 poly(phenylenevinylene) Polymers 0.000 description 1
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- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920002098 polyfluorene Polymers 0.000 description 1
- 230000000379 polymerizing effect Effects 0.000 description 1
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- 229920002223 polystyrene Polymers 0.000 description 1
- USHAGKDGDHPEEY-UHFFFAOYSA-L potassium persulfate Chemical compound [K+].[K+].[O-]S(=O)(=O)OOS([O-])(=O)=O USHAGKDGDHPEEY-UHFFFAOYSA-L 0.000 description 1
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- KBPHJBAIARWVSC-XQIHNALSSA-N trans-lutein Natural products CC(=C/C=C/C=C(C)/C=C/C=C(C)/C=C/C1=C(C)CC(O)CC1(C)C)C=CC=C(/C)C=CC2C(=CC(O)CC2(C)C)C KBPHJBAIARWVSC-XQIHNALSSA-N 0.000 description 1
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- TVIVIEFSHFOWTE-UHFFFAOYSA-K tri(quinolin-8-yloxy)alumane Chemical compound [Al+3].C1=CN=C2C([O-])=CC=CC2=C1.C1=CN=C2C([O-])=CC=CC2=C1.C1=CN=C2C([O-])=CC=CC2=C1 TVIVIEFSHFOWTE-UHFFFAOYSA-K 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/12—Deposition of organic active material using liquid deposition, e.g. spin coating
- H10K71/15—Deposition of organic active material using liquid deposition, e.g. spin coating characterised by the solvent used
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/12—Deposition of organic active material using liquid deposition, e.g. spin coating
- H10K71/13—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing
- H10K71/135—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing using ink-jet printing
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
- H10K85/10—Organic polymers or oligomers
- H10K85/111—Organic polymers or oligomers comprising aromatic, heteroaromatic, or aryl chains, e.g. polyaniline, polyphenylene or polyphenylene vinylene
- H10K85/113—Heteroaromatic compounds comprising sulfur or selene, e.g. polythiophene
- H10K85/1135—Polyethylene dioxythiophene [PEDOT]; Derivatives thereof
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
- H10K85/30—Coordination compounds
- H10K85/311—Phthalocyanine
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
- H10K85/30—Coordination compounds
- H10K85/321—Metal complexes comprising a group IIIA element, e.g. Tris (8-hydroxyquinoline) gallium [Gaq3]
- H10K85/324—Metal complexes comprising a group IIIA element, e.g. Tris (8-hydroxyquinoline) gallium [Gaq3] comprising aluminium, e.g. Alq3
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/93—Batch processes
- H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L2224/9512—Aligning the plurality of semiconductor or solid-state bodies
- H01L2224/95143—Passive alignment, i.e. self alignment, e.g. using surface energy, chemical reactions, thermal equilibrium
- H01L2224/95146—Passive alignment, i.e. self alignment, e.g. using surface energy, chemical reactions, thermal equilibrium by surface tension
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Inorganic Chemistry (AREA)
- Electroluminescent Light Sources (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Liquid Deposition Of Substances Of Which Semiconductor Devices Are Composed (AREA)
Applications Claiming Priority (1)
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| US10/669,403 US7686978B2 (en) | 2003-09-24 | 2003-09-24 | Method for the application of active materials onto active surfaces and devices made with such methods |
Publications (1)
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|---|---|
| TW200525793A true TW200525793A (en) | 2005-08-01 |
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| TW093128654A TW200525793A (en) | 2003-09-24 | 2004-09-22 | Method for the application of active materials onto active surfaces and devices made with such methods |
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| US (3) | US7686978B2 (enExample) |
| JP (3) | JP5339678B2 (enExample) |
| KR (1) | KR101176678B1 (enExample) |
| TW (1) | TW200525793A (enExample) |
| WO (1) | WO2005031889A2 (enExample) |
Cited By (1)
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|---|---|---|---|---|
| TWI643251B (zh) * | 2016-01-28 | 2018-12-01 | 東京威力科創股份有限公司 | 金屬氧化物之旋塗式沉積方法 |
Families Citing this family (22)
| Publication number | Priority date | Publication date | Assignee | Title |
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| US7686978B2 (en) * | 2003-09-24 | 2010-03-30 | E. I. Du Pont De Nemours And Company | Method for the application of active materials onto active surfaces and devices made with such methods |
| US7709050B2 (en) * | 2004-08-02 | 2010-05-04 | Hewlett-Packard Development Company, L.P. | Surface treatment for OLED material |
| JP4876415B2 (ja) * | 2005-03-29 | 2012-02-15 | セイコーエプソン株式会社 | 有機ｅｌ装置の製造方法、デバイスの製造方法 |
| US8563331B2 (en) * | 2005-06-03 | 2013-10-22 | E. I. Du Pont De Nemours And Company | Process for fabricating and repairing an electronic device |
| US20070170401A1 (en) * | 2005-12-28 | 2007-07-26 | Che-Hsiung Hsu | Cationic compositions of electrically conducting polymers doped with fully-fluorinated acid polymers |
| DE102006021410B4 (de) * | 2006-05-09 | 2009-07-16 | Leonhard Kurz Gmbh & Co. Kg | Verfahren zur Herstellung eines Mehrschichtgebildes und Verwendung des Verfahrens |
| WO2007145977A1 (en) * | 2006-06-05 | 2007-12-21 | E. I. Du Pont De Nemours And Company | Process for making an organic electronic device |
| WO2007145976A2 (en) * | 2006-06-05 | 2007-12-21 | E. I. Du Pont De Nemours And Company | Process for making an organic light-emitting diode |
| WO2007145978A1 (en) * | 2006-06-05 | 2007-12-21 | E. I. Du Pont De Nemours And Company | Process for making contained layers and devices made with same |
| JP2009076779A (ja) * | 2007-09-21 | 2009-04-09 | Casio Comput Co Ltd | 有機ｅｌ素子およびその製造方法 |
| KR20100094475A (ko) * | 2007-10-26 | 2010-08-26 | 이 아이 듀폰 디 네모아 앤드 캄파니 | 격납된 층을 제조하기 위한 방법 및 재료, 및 이를 사용하여 제조된 소자 |
| EP2109163A1 (de) * | 2008-04-08 | 2009-10-14 | Alcan Technology & Management Ltd. | Substrat mit aufgedruckter Struktur |
| US8759818B2 (en) | 2009-02-27 | 2014-06-24 | E I Du Pont De Nemours And Company | Deuterated compounds for electronic applications |
| TW201104357A (en) * | 2009-07-27 | 2011-02-01 | Du Pont | Process and materials for making contained layers and devices made with same |
| TW201111326A (en) | 2009-09-29 | 2011-04-01 | Du Pont | Deuterated compounds for luminescent applications |
| WO2011059463A1 (en) | 2009-10-29 | 2011-05-19 | E. I. Du Pont De Nemours And Company | Deuterated compounds for electronic applications |
| FR2965089B1 (fr) * | 2010-09-20 | 2016-04-29 | Philippe Foucqueteau | Dispositif pour simuler un geste medical |
| KR101547410B1 (ko) | 2010-12-20 | 2015-08-25 | 이 아이 듀폰 디 네모아 앤드 캄파니 | 전자적 응용을 위한 조성물 |
| JP2012212704A (ja) * | 2011-03-30 | 2012-11-01 | Sumitomo Chemical Co Ltd | 液状組成物及びそれを用いた積層膜の製造方法 |
| BR112015020725A2 (pt) | 2013-03-11 | 2017-07-18 | Saudi Basic Ind Corp | ariloxi-ftalocianinas de metais do grupo iv |
| JP6014779B2 (ja) | 2013-03-11 | 2016-10-25 | サウジ ベイシック インダストリーズ コーポレイション | Ｉｉｉ族金属のアリールオキシ−フタロシアニン |
| US20220025240A1 (en) * | 2018-12-20 | 2022-01-27 | Solvay Specialty Polymers Italy S.P.A. | Method of manufacturing semiconductor devices using a heat transfer fluid comprising fluorinated compounds having a low gwp |
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| US2994664A (en) * | 1958-02-19 | 1961-08-01 | Nalco Chemical Co | Dry acid cleaning compositions |
| US2947703A (en) * | 1958-07-16 | 1960-08-02 | Nalco Chemical Co | Process of inhibiting corrosion of ferrous metals in contact with aqueous solutions of acids |
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-
2003
- 2003-09-24 US US10/669,403 patent/US7686978B2/en not_active Expired - Lifetime
-
2004
- 2004-09-22 KR KR1020067005767A patent/KR101176678B1/ko not_active Expired - Fee Related
- 2004-09-22 TW TW093128654A patent/TW200525793A/zh unknown
- 2004-09-22 WO PCT/US2004/031246 patent/WO2005031889A2/en not_active Ceased
- 2004-09-22 JP JP2006528165A patent/JP5339678B2/ja not_active Expired - Fee Related
-
2005
- 2005-06-16 US US11/154,925 patent/US8287766B2/en not_active Expired - Fee Related
-
2011
- 2011-04-05 US US13/080,317 patent/US8465850B2/en not_active Expired - Fee Related
-
2012
- 2012-03-22 JP JP2012065874A patent/JP5602173B2/ja not_active Expired - Fee Related
-
2013
- 2013-12-24 JP JP2013265744A patent/JP5757989B2/ja not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI643251B (zh) * | 2016-01-28 | 2018-12-01 | 東京威力科創股份有限公司 | 金屬氧化物之旋塗式沉積方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| US8465850B2 (en) | 2013-06-18 |
| KR101176678B1 (ko) | 2012-08-23 |
| US20110180761A1 (en) | 2011-07-28 |
| US7686978B2 (en) | 2010-03-30 |
| JP5339678B2 (ja) | 2013-11-13 |
| JP5602173B2 (ja) | 2014-10-08 |
| JP2014090195A (ja) | 2014-05-15 |
| US20050269550A1 (en) | 2005-12-08 |
| JP5757989B2 (ja) | 2015-08-05 |
| US20050062021A1 (en) | 2005-03-24 |
| JP2007506547A (ja) | 2007-03-22 |
| US8287766B2 (en) | 2012-10-16 |
| JP2012157859A (ja) | 2012-08-23 |
| KR20070029625A (ko) | 2007-03-14 |
| WO2005031889A3 (en) | 2005-06-23 |
| WO2005031889A2 (en) | 2005-04-07 |
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