TW200519148A - Inorganic powder-containing resin composition, film-forming material layer, transfer sheet, method for producing substrate with dielectric layer, and substrate with dielectric layer - Google Patents

Inorganic powder-containing resin composition, film-forming material layer, transfer sheet, method for producing substrate with dielectric layer, and substrate with dielectric layer

Info

Publication number
TW200519148A
TW200519148A TW093122159A TW93122159A TW200519148A TW 200519148 A TW200519148 A TW 200519148A TW 093122159 A TW093122159 A TW 093122159A TW 93122159 A TW93122159 A TW 93122159A TW 200519148 A TW200519148 A TW 200519148A
Authority
TW
Taiwan
Prior art keywords
dielectric layer
substrate
resin composition
inorganic powder
containing resin
Prior art date
Application number
TW093122159A
Other languages
English (en)
Inventor
Tomohide Banba
Katsuya Kume
Makoto Kai
Natsuki Kobayashi
Mami Ikeya
Yasushi Buzoujima
Junichi Sekiya
Mitsuhiro Kanada
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Publication of TW200519148A publication Critical patent/TW200519148A/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/49—Phosphorus-containing compounds
    • C08K5/51—Phosphorus bound to oxygen
    • C08K5/52—Phosphorus bound to oxygen only
    • C08K5/521—Esters of phosphoric acids, e.g. of H3PO4
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K13/00—Use of mixtures of ingredients not covered by one single of the preceding main groups, each of these compounds being essential
    • C08K13/02—Organic and inorganic ingredients
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2211/00—Plasma display panels with alternate current induction of the discharge, e.g. AC-PDPs
    • H01J2211/20—Constructional details
    • H01J2211/34—Vessels, containers or parts thereof, e.g. substrates
    • H01J2211/38—Dielectric or insulating layers

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Gas-Filled Discharge Tubes (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Laminated Bodies (AREA)
TW093122159A 2003-07-24 2004-07-23 Inorganic powder-containing resin composition, film-forming material layer, transfer sheet, method for producing substrate with dielectric layer, and substrate with dielectric layer TW200519148A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003279206 2003-07-24

Publications (1)

Publication Number Publication Date
TW200519148A true TW200519148A (en) 2005-06-16

Family

ID=34100810

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093122159A TW200519148A (en) 2003-07-24 2004-07-23 Inorganic powder-containing resin composition, film-forming material layer, transfer sheet, method for producing substrate with dielectric layer, and substrate with dielectric layer

Country Status (6)

Country Link
US (1) US7585907B2 (zh)
EP (1) EP1666526A4 (zh)
KR (1) KR20060063912A (zh)
CN (1) CN100412121C (zh)
TW (1) TW200519148A (zh)
WO (1) WO2005010092A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI721979B (zh) * 2015-05-08 2021-03-21 德商漢高智慧財產控股公司 可燒結膜及膠及其應用方法

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7324635B2 (en) 2000-05-04 2008-01-29 Telemaze Llc Branch calling and caller ID based call routing telephone features
CN1860004A (zh) * 2003-09-30 2006-11-08 Tdk株式会社 多层陶瓷电子元件用介电糊的制备方法
JP4487542B2 (ja) * 2003-11-27 2010-06-23 Ｔｄｋ株式会社 積層セラミック電子部品用の導電体ペーストおよび積層セラミック電子部品用の積層体ユニットの製造方法
JP2005171178A (ja) * 2003-12-15 2005-06-30 Tdk Corp 積層セラミック電子部品のスペーサ層用の誘電体ペースト
JP4662298B2 (ja) * 2003-12-15 2011-03-30 Ｔｄｋ株式会社 積層セラミック電子部品のスペーサ層用の誘電体ペースト
JP4487596B2 (ja) * 2004-02-27 2010-06-23 Ｔｄｋ株式会社 積層セラミック電子部品用の積層体ユニットの製造方法
JP4487595B2 (ja) * 2004-02-27 2010-06-23 Ｔｄｋ株式会社 積層セラミック電子部品用の積層体ユニットの製造方法
JP4412013B2 (ja) * 2004-03-16 2010-02-10 Ｔｄｋ株式会社 積層セラミック電子部品用の誘電体ペーストおよび積層セラミック電子部品用の積層体ユニットの製造方法
US20070108419A1 (en) * 2004-11-24 2007-05-17 Tdk Corporation Conductive paste for an electrode layer of a multi-layered ceramic electronic component and a method for manufacturing a multi-layered unit for a multi-layered ceramic electronic component
US8659158B2 (en) 2006-08-16 2014-02-25 Funai Electric Co., Ltd. Thermally inkjettable acrylic dielectric ink formulation and process
JP4849612B2 (ja) * 2006-10-19 2012-01-11 日東電工株式会社 無機粉体含有樹脂組成物及び誘電体層形成基板
KR20130114265A (ko) * 2008-08-22 2013-10-16 히타치가세이가부시끼가이샤 감광성 도전 필름, 도전막의 형성 방법, 도전 패턴의 형성 방법 및 도전막 기판
KR101447775B1 (ko) * 2012-05-08 2014-10-06 (주)엘지하우시스 감촉 특성이 우수한 코팅 조성물, 그 제조방법 및 이를 이용한 전사시트
US10000670B2 (en) 2012-07-30 2018-06-19 Henkel IP & Holding GmbH Silver sintering compositions with fluxing or reducing agents for metal adhesion

Family Cites Families (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4557856A (en) * 1978-02-18 1985-12-10 Mita Industrial Co., Ltd. Electrically conductive composition for electro-responsive recording materials
JPS62133425A (ja) 1985-12-06 1987-06-16 Sumitomo Bakelite Co Ltd 液晶セル用シ−ル剤組成物
JP2801708B2 (ja) 1989-12-20 1998-09-21 住友ベークライト株式会社 液晶セル用シール剤組成物
KR950015461A (ko) * 1993-11-29 1995-06-16 이헌조 칼라브라운관의 형광면 도포용 형광체 처리방법
JP3384113B2 (ja) 1994-05-20 2003-03-10 ソニー株式会社 熱転写シート
US5827792A (en) * 1994-08-30 1998-10-27 Ube Industries, Ltd. Dielectric ceramic composition
JP3746420B2 (ja) 1995-08-01 2006-02-15 Ｊｓｒ株式会社 プラズマディスプレイパネルの製造方法
JPH09102273A (ja) 1995-08-01 1997-04-15 Japan Synthetic Rubber Co Ltd プラズマディスプレイパネルの製造方法
JPH09176471A (ja) * 1995-12-27 1997-07-08 Nippon G Ii Plast Kk ポリカーボネート系樹脂組成物
JP4576486B2 (ja) 1997-07-15 2010-11-10 綜研化学株式会社 誘電体層形成用樹脂組成物および誘電体層形成用フィルム
KR100536868B1 (ko) * 1997-10-03 2006-02-28 다이니폰 인사츠 가부시키가이샤 전사시트
JPH11260254A (ja) 1998-03-13 1999-09-24 Dainippon Printing Co Ltd 転写シート
JPH11135008A (ja) 1997-10-27 1999-05-21 Dainippon Printing Co Ltd 転写シート
TW513614B (en) * 1997-12-18 2002-12-11 Nippon Synthetic Chem Ind Photosensitive resin composition
JP4090103B2 (ja) * 1998-03-02 2008-05-28 太陽インキ製造株式会社 感光性組成物及びそれを用いて得られる焼成物パターン
JP2000053444A (ja) 1998-08-07 2000-02-22 Jsr Corp ガラスペースト組成物、転写フィルムおよびプラズマディスプレイパネル
JP2000319548A (ja) * 1999-05-11 2000-11-21 Daicel Chem Ind Ltd アルカリ現像型光硬化性ガラスペースト組成物及びそれを用いたプラズマディスプレイパネル隔壁の製造方法
KR20010085203A (ko) 1998-12-28 2001-09-07 고지마 아끼로, 오가와 다이스께 경화성 수지조성물, 변성공중합체 및 수지조성물, 알칼리현상형 광경화성 유리 페이스트
WO2000042622A1 (fr) 1999-01-14 2000-07-20 Soken Chemical & Engineering Co., Ltd. Composition de resine pour la formation de couches dielectriques et film pour la formation de couches dielectriques
JP2000272251A (ja) 1999-03-29 2000-10-03 Dainippon Printing Co Ltd 熱転写シート
JP4139519B2 (ja) * 1999-06-02 2008-08-27 大日本印刷株式会社 焼成用インキ組成物
JP2001001653A (ja) 1999-06-22 2001-01-09 Dainippon Printing Co Ltd 熱転写シート
US20030175615A1 (en) * 2000-01-25 2003-09-18 Hiroto Miyake Photocurable resin composition
JP2001243837A (ja) 2000-02-29 2001-09-07 Kyocera Corp 誘電体ペースト及びこれを用いたセラミック回路基板の製法
JP4565705B2 (ja) * 2000-06-09 2010-10-20 Ｄｉｃ株式会社 静電荷像現像剤
JP2002025431A (ja) * 2000-07-04 2002-01-25 Hitachi Chem Co Ltd 障壁形成用樹脂組成物エレメント及びこれを用いたプラズマディスプレイパネル用基板の製造法
JP2002105112A (ja) 2000-09-29 2002-04-10 Taiyo Ink Mfg Ltd 感光性ペースト組成物及びそれを用いて焼成物パターンを形成したパネル
JP2002179925A (ja) 2000-12-12 2002-06-26 Murata Mfg Co Ltd セラミックグリーンシート及びその製造方法
JP2003089274A (ja) * 2001-09-18 2003-03-25 Dainippon Printing Co Ltd 熱転写シート
JP2003201577A (ja) * 2002-01-09 2003-07-18 Kobe Steel Ltd 熱交換器フィン用アルミニウム又はアルミニウム合金材及び熱交換器用フィン
JP2004115783A (ja) 2002-09-03 2004-04-15 Asahi Glass Co Ltd 隔壁用ペーストおよびプラズマディスプレイパネルの製造方法。
US7057631B2 (en) * 2002-09-26 2006-06-06 Fuji Photo Film Co., Ltd. Image forming process and image forming apparatus, electrophotographic image-receiving sheet, and electrophotographic print

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI721979B (zh) * 2015-05-08 2021-03-21 德商漢高智慧財產控股公司 可燒結膜及膠及其應用方法

Also Published As

Publication number Publication date
US20060199883A1 (en) 2006-09-07
CN100412121C (zh) 2008-08-20
WO2005010092A1 (ja) 2005-02-03
KR20060063912A (ko) 2006-06-12
CN1813024A (zh) 2006-08-02
EP1666526A1 (en) 2006-06-07
US7585907B2 (en) 2009-09-08
EP1666526A4 (en) 2006-12-06

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