CN1860004A - 多层陶瓷电子元件用介电糊的制备方法 - Google Patents
多层陶瓷电子元件用介电糊的制备方法 Download PDFInfo
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- CN1860004A CN1860004A CNA2004800284614A CN200480028461A CN1860004A CN 1860004 A CN1860004 A CN 1860004A CN A2004800284614 A CNA2004800284614 A CN A2004800284614A CN 200480028461 A CN200480028461 A CN 200480028461A CN 1860004 A CN1860004 A CN 1860004A
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- dielectric
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- multilayer ceramic
- mixture
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- 239000000919 ceramic Substances 0.000 title claims abstract description 67
- 238000004519 manufacturing process Methods 0.000 title abstract description 6
- 239000000203 mixture Substances 0.000 claims abstract description 63
- 239000002904 solvent Substances 0.000 claims abstract description 63
- 239000000843 powder Substances 0.000 claims abstract description 54
- 239000002002 slurry Substances 0.000 claims abstract description 33
- 238000004898 kneading Methods 0.000 claims abstract description 26
- 239000000463 material Substances 0.000 claims description 39
- 238000000034 method Methods 0.000 claims description 31
- 238000002360 preparation method Methods 0.000 claims description 30
- 239000002270 dispersing agent Substances 0.000 claims description 24
- -1 butyl carbitol acetate ester Chemical class 0.000 claims description 10
- 239000007787 solid Substances 0.000 claims description 10
- RBNWAMSGVWEHFP-UHFFFAOYSA-N trans-p-Menthane-1,8-diol Chemical compound CC(C)(O)C1CCC(C)(O)CC1 RBNWAMSGVWEHFP-UHFFFAOYSA-N 0.000 claims description 9
- 239000002202 Polyethylene glycol Substances 0.000 claims description 7
- 239000000084 colloidal system Substances 0.000 claims description 7
- 229920001223 polyethylene glycol Polymers 0.000 claims description 7
- UODXCYZDMHPIJE-UHFFFAOYSA-N menthanol Chemical compound CC1CCC(C(C)(C)O)CC1 UODXCYZDMHPIJE-UHFFFAOYSA-N 0.000 claims description 6
- 239000003995 emulsifying agent Substances 0.000 claims description 5
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 claims description 5
- 239000011347 resin Substances 0.000 claims description 5
- 229920005989 resin Polymers 0.000 claims description 5
- 239000001856 Ethyl cellulose Substances 0.000 claims description 4
- ZZSNKZQZMQGXPY-UHFFFAOYSA-N Ethyl cellulose Chemical compound CCOCC1OC(OC)C(OCC)C(OCC)C1OC1C(O)C(O)C(OC)C(CO)O1 ZZSNKZQZMQGXPY-UHFFFAOYSA-N 0.000 claims description 4
- IGODOXYLBBXFDW-UHFFFAOYSA-N alpha-Terpinyl acetate Chemical compound CC(=O)OC(C)(C)C1CCC(C)=CC1 IGODOXYLBBXFDW-UHFFFAOYSA-N 0.000 claims description 4
- 229920001249 ethyl cellulose Polymers 0.000 claims description 4
- 235000019325 ethyl cellulose Nutrition 0.000 claims description 4
- 239000004925 Acrylic resin Substances 0.000 claims description 3
- 229920000178 Acrylic resin Polymers 0.000 claims description 3
- 239000003350 kerosene Substances 0.000 claims description 2
- 239000000969 carrier Substances 0.000 claims 1
- 239000003989 dielectric material Substances 0.000 abstract description 40
- 239000011230 binding agent Substances 0.000 abstract description 2
- 239000010410 layer Substances 0.000 description 30
- 239000000654 additive Substances 0.000 description 18
- 230000000996 additive effect Effects 0.000 description 18
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 15
- 239000006185 dispersion Substances 0.000 description 13
- 238000009835 boiling Methods 0.000 description 12
- 230000000052 comparative effect Effects 0.000 description 12
- 239000003985 ceramic capacitor Substances 0.000 description 10
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 9
- 238000005259 measurement Methods 0.000 description 9
- 238000003475 lamination Methods 0.000 description 7
- 239000011362 coarse particle Substances 0.000 description 6
- 238000001704 evaporation Methods 0.000 description 6
- 230000008020 evaporation Effects 0.000 description 6
- 230000003746 surface roughness Effects 0.000 description 5
- 238000001035 drying Methods 0.000 description 4
- 239000011229 interlayer Substances 0.000 description 4
- 229920000139 polyethylene terephthalate Polymers 0.000 description 4
- 239000005020 polyethylene terephthalate Substances 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 239000004020 conductor Substances 0.000 description 3
- 230000001404 mediated effect Effects 0.000 description 3
- 239000004014 plasticizer Substances 0.000 description 3
- 230000035939 shock Effects 0.000 description 3
- ZTQSAGDEMFDKMZ-UHFFFAOYSA-N Butyraldehyde Chemical compound CCCC=O ZTQSAGDEMFDKMZ-UHFFFAOYSA-N 0.000 description 2
- MQIUGAXCHLFZKX-UHFFFAOYSA-N Di-n-octyl phthalate Natural products CCCCCCCCOC(=O)C1=CC=CC=C1C(=O)OCCCCCCCC MQIUGAXCHLFZKX-UHFFFAOYSA-N 0.000 description 2
- 206010013786 Dry skin Diseases 0.000 description 2
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- BJQHLKABXJIVAM-UHFFFAOYSA-N bis(2-ethylhexyl) phthalate Chemical compound CCCCC(CC)COC(=O)C1=CC=CC=C1C(=O)OCC(CC)CCCC BJQHLKABXJIVAM-UHFFFAOYSA-N 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 238000004880 explosion Methods 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 238000006116 polymerization reaction Methods 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- 239000011342 resin composition Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 229910019142 PO4 Inorganic materials 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000002280 amphoteric surfactant Substances 0.000 description 1
- 125000000129 anionic group Chemical group 0.000 description 1
- 239000012752 auxiliary agent Substances 0.000 description 1
- 125000002091 cationic group Chemical group 0.000 description 1
- 230000032798 delamination Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000002003 electrode paste Substances 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- MTNDZQHUAFNZQY-UHFFFAOYSA-N imidazoline Chemical compound C1CN=CN1 MTNDZQHUAFNZQY-UHFFFAOYSA-N 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 239000004570 mortar (masonry) Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- XNGIFLGASWRNHJ-UHFFFAOYSA-N o-dicarboxybenzene Natural products OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 1
- 239000010452 phosphate Substances 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000010298 pulverizing process Methods 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
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- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
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- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/01—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics
- C04B35/46—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on titanium oxides or titanates
- C04B35/462—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on titanium oxides or titanates based on titanates
- C04B35/465—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on titanium oxides or titanates based on titanates based on alkaline earth metal titanates
- C04B35/468—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on titanium oxides or titanates based on titanates based on alkaline earth metal titanates based on barium titanates
- C04B35/4682—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on titanium oxides or titanates based on titanates based on alkaline earth metal titanates based on barium titanates based on BaTiO3 perovskite phase
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28B—SHAPING CLAY OR OTHER CERAMIC COMPOSITIONS; SHAPING SLAG; SHAPING MIXTURES CONTAINING CEMENTITIOUS MATERIAL, e.g. PLASTER
- B28B17/00—Details of, or accessories for, apparatus for shaping the material; Auxiliary measures taken in connection with such shaping
- B28B17/02—Conditioning the material prior to shaping
- B28B17/023—Conditioning gypsum
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28C—PREPARING CLAY; PRODUCING MIXTURES CONTAINING CLAY OR CEMENTITIOUS MATERIAL, e.g. PLASTER
- B28C1/00—Apparatus or methods for obtaining or processing clay
- B28C1/02—Apparatus or methods for obtaining or processing clay for producing or processing clay suspensions, e.g. slip
- B28C1/04—Producing suspensions, e.g. by blunging or mixing; with means for removing stones
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- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/622—Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/62218—Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products obtaining ceramic films, e.g. by using temporary supports
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- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/622—Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/626—Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B
- C04B35/62605—Treating the starting powders individually or as mixtures
- C04B35/6261—Milling
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- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/622—Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/626—Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B
- C04B35/62605—Treating the starting powders individually or as mixtures
- C04B35/62625—Wet mixtures
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- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/622—Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/626—Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B
- C04B35/62605—Treating the starting powders individually or as mixtures
- C04B35/62625—Wet mixtures
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- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/622—Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/626—Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B
- C04B35/62605—Treating the starting powders individually or as mixtures
- C04B35/62625—Wet mixtures
- C04B35/62635—Mixing details
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- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/622—Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/626—Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B
- C04B35/62605—Treating the starting powders individually or as mixtures
- C04B35/62625—Wet mixtures
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- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/622—Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/626—Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B
- C04B35/62605—Treating the starting powders individually or as mixtures
- C04B35/62645—Thermal treatment of powders or mixtures thereof other than sintering
- C04B35/62665—Flame, plasma or melting treatment
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- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/622—Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/626—Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B
- C04B35/63—Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B using additives specially adapted for forming the products, e.g.. binder binders
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- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/622—Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/626—Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B
- C04B35/63—Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B using additives specially adapted for forming the products, e.g.. binder binders
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- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/622—Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/626—Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B
- C04B35/63—Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B using additives specially adapted for forming the products, e.g.. binder binders
- C04B35/632—Organic additives
- C04B35/634—Polymers
- C04B35/63404—Polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds
- C04B35/6342—Polyvinylacetals, e.g. polyvinylbutyral [PVB]
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- H—ELECTRICITY
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- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/12—Ceramic dielectrics
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- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/30—Constituents and secondary phases not being of a fibrous nature
- C04B2235/32—Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
- C04B2235/3205—Alkaline earth oxides or oxide forming salts thereof, e.g. beryllium oxide
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- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/30—Constituents and secondary phases not being of a fibrous nature
- C04B2235/32—Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
- C04B2235/3205—Alkaline earth oxides or oxide forming salts thereof, e.g. beryllium oxide
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- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/30—Constituents and secondary phases not being of a fibrous nature
- C04B2235/32—Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
- C04B2235/3224—Rare earth oxide or oxide forming salts thereof, e.g. scandium oxide
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- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/30—Constituents and secondary phases not being of a fibrous nature
- C04B2235/32—Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
- C04B2235/3231—Refractory metal oxides, their mixed metal oxides, or oxide-forming salts thereof
- C04B2235/3239—Vanadium oxides, vanadates or oxide forming salts thereof, e.g. magnesium vanadate
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- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
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Abstract
公开了制备多层陶瓷电子元件用介电糊的方法,该方法能制备这样的介电糊,其中介电材料是高度分散的,同时以希望的方式控制该介电材料的浓度。该制备多层陶瓷电子元件用介电糊的方法的特征在于包括:捏合介电粉末、基料和溶剂以形成粘土状混合物的捏合步骤,和向该通过捏合步骤获得的混合物中添加与在捏合步骤中所使用的溶剂相同的溶剂以降低该混合物的粘度从而淤浆化该混合物的淤浆化步骤。
Description
发明领域
本发明涉及多层陶瓷电子元件用介电糊的制备方法,具体地说,涉及能够制备其中介电材料高度分散同时以希望的方式控制该介电材料的浓度的介电糊的多层陶瓷电子元件用介电糊的制备方法。
发明背景
近来,为了小型化各种电子器件使得必须小型化包括在这些器件中的电子元件并改进它们的性能。在多层陶瓷电子元件,如多层陶瓷电容器中,也强烈要求增加层数目并使得层压单元更薄。
当要制造以多层陶瓷电容器为代表的多层陶瓷电子元件时,混合并分散陶瓷粉、基料(binder)如丙烯酸系树脂,缩丁醛树脂等、增塑剂如邻苯二甲酸酯,二醇,己二酸酯,磷酸酯等、和有机溶剂如甲苯,甲基乙基酮,丙酮等,从而制备介电糊。
然后,使用挤涂机、凹版涂布机等将该介电糊涂布到由聚对苯二甲酸乙二酯(PET)、聚丙烯(PP)等制成的支撑片上以形成涂层,加热该涂层到干燥,从而制造出陶瓷生片。
此外,使用丝网印刷机将例如镍的电极糊以预定图案印刷到该陶瓷生片上并干燥来形成电极层。
当该电极层已经形成时,将在其上形成电极层的陶瓷生片从支撑片上剥离以形成包括陶瓷生片和电极层的多层单元。然后,通过层压希望数目的多层单元以形成层压体、按压该层压体并将该层压体切成方块来形成陶瓷生芯片。
最后,从该生芯片中除去基料、烘烤该生芯片并形成外部电极,从而完成了多层陶瓷电子元件如多层陶瓷电容器。
当今,小型化电子元件和改进其性能的需要使得必须设定该陶瓷生片的厚度(其决定了多层陶瓷电容器各层间的距离)到等于或小于3微米或2微米并层压三百或更多各自包括陶瓷生片和电极层的多层单元。
然而,在常规的多层陶瓷电容器中,因为电极层以预定的图案形成于陶瓷生片上,所以在电极层表面和没有形成电极层的陶瓷生片的表面间形成了阶梯。因此,在层压许多多层单元(各自包括陶瓷生片和电极层)的情况下,难以按照希望方式粘结包括在该许多多层单元中的陶瓷生片,以致通过层压该许多多层单元而制造的层压体通常会变形且有时还发生脱层。
为了解决这些问题,已经建议通过以与电极层的图案互补的图案印刷介电糊于该陶瓷生片的表面上从而在相邻电极层间形成间隔层来消除该陶瓷生片表面上的阶梯。
当按照这一方式在相邻电极层间的陶瓷生片上印刷间隔层从而制造该多层单元时,可消除各个多层单元的陶瓷生片表面上的阶梯甚至在层压许多多层单元(各自包括陶瓷生片和电极层)并制造多层陶瓷电容器的情况下,有可能以希望方式粘结包括在该许多多层单元中的陶瓷生片并有可能防止该通过层压许多多层单元(各自包括该陶瓷生片和电极层)而制造的层压体变形。
为了最小化该多层陶瓷电容器的厚度使得必须形成具有厚度例如等于或薄于2微米的电极层,且为了满足这一要求,必须改进在导电糊中所含有的导电材料的分散性。
具体地说,当包含在导电糊中的导电材料的分散性低时,通过在陶瓷生片上印刷该导电糊并干燥该导电糊而获得的电极层中的导电材料的密度会变低并且当烘烤该多层陶瓷电容器时该电极层会显著地收缩。因此,当通过印刷来形成薄电极层时,在烘烤之后电极层会变得不连续且该电容器电极的重叠区域会变小,因而电容器的有效电容会变低。
另一方面,间隔层由与用于形成该陶瓷生片的介电糊具有相同组成的介电糊来形成并含有介电粉末、基料、增塑剂和有机溶剂。当为了最小化该多层陶瓷电容器的厚度使得必须形成具有厚度例如等于或薄于2微米的电极层时,必须高精度地通过在该陶瓷生片上印刷介电糊来形成基本上与该电极层具有相同厚度的间隔层,以致在烘烤之后该间隔层的厚度基本上与该电极层的厚度相同。
与形成电极层的导电糊一样,为了满足这样的要求必须高精度地控制包含在该用于形成间隔层的介电糊中的介电材料的浓度并改进包含在该介电糊中的介电材料的分散性,从而增加包含在该通过在陶瓷生片上印刷介电糊并干燥该介电糊而获得的间隔层中的介电材料的密度。
因此,日本专利申请公开No.200-237140提出了一种含有高度分散的介电粉末的介电糊的制备方法,其包括步骤:使用球磨机混合介电粉末和低沸点溶剂如甲基乙基酮,丙酮等从而将介电粉末分散在溶剂中,将高沸点溶剂如松油醇和有机基料如乙基纤维素添加到该所得的分散产物中,混合它们从而制备陶瓷淤浆,或使用球磨机混合介电粉末、低沸点溶剂如甲基乙基酮,丙酮等和高沸点溶剂如松油醇从而将介电粉末分散在溶剂中,将高沸点溶剂如松油醇和有机基料如乙基纤维素添加到该所得的分散产物中,混合它们从而制备陶瓷淤浆,使用蒸发器等蒸发该低沸点溶剂以从该陶瓷淤浆中除去该低沸点溶剂从而制备介电糊,向该所得的介电糊中添加高沸点溶剂如松油醇以调节该介电糊的粘度并使用自动研钵将介电粉末分散在溶剂中。
发明内容
本发明要解决的问题
然而,当根据该在日本专利申请公开No.2001-237140中公开的方法来制备介电糊时,当蒸发该低沸点溶剂时难以精确地控制已经蒸发和还没有蒸发的低沸点溶剂的量并且极其难以制备含有希望浓度的介电材料的介电糊。因此,极其难以通过在该陶瓷生片上印刷该介电糊形成具有希望干燥厚度的间隔层。另一方面,当通过蒸发低沸点溶剂来制备介电糊和通过向该介电糊中添加高沸点溶剂如松油醇来调节该介电糊的粘度时,会发生所谓的溶剂冲击(solvent shock)。具体地说,由于混合了对介电粉末具有不同亲合性的溶剂和固体含量的突变使得该介电粉末凝集。因此,有时不可能获得其中介电材料是高度分散的介电糊。
因此,本发明目的是提供制备多层陶瓷电子元件用介电糊的方法,该方法能制备这样的介电糊,其中介电材料高度分散同时以希望的方式控制该介电材料浓度。
解决问题的方法
本发明的上述目的通过一种制备多层陶瓷电子元件用介电糊的方法得以实现,该方法包括:捏合介电粉末、基料和溶剂以形成粘土状混合物的捏合步骤,和向该由捏合步骤获得的混合物中添加与在捏合步骤中所使用的溶剂相同的溶剂以降低该混合物的粘度从而淤浆化该混合物的淤浆化步骤。
根据本发明,因为包含在该介电糊中的介电材料的浓度取决于被添加到该混合物中的溶剂的量,所以有可能制备含有希望浓度的介电材料的介电糊。
此外,根据本发明,因为将与在捏合步骤中所使用的溶剂相同的溶剂添加到该混合物中以调节该介电糊的粘度,所以有可能可靠地防止发生所谓的溶剂冲击,因此,可制备含有高度分散的介电材料的介电糊。
在本发明优选方面中,捏合该介电粉末、基料和溶剂直到该混合物到达其湿点(球点(ball point))。
在本发明的优选方面中,捏合该介电粉末、基料和溶剂直到该混合物的固体含量达到85-95%。
在本发明的优选方面中,使用选自高速剪切混合器、行星式捏和机和捏和机的混合器捏合该介电粉末、基料和溶剂。
在本发明的优选方面,该制备多层陶瓷电子元件用介电糊的方法还包括使用密封型乳化器连续分散该由淤浆化步骤获得的淤浆从而制备介电糊的步骤。
根据本发明的这一优选方面,因为该淤浆使用密封型乳化器进行连续地分散从而制备介电糊,所以有可能进一步改进该包含在介电糊中的介电材料的分散性并以希望的方式控制该包含在介电糊中的介电材料的浓度。
另外根据本发明的这一优选方面,因为该淤浆使用密封型乳化器进行连续地分散从而制备导介电糊,所以与当使用三辊研磨机分散该淤浆来制备介电糊时相比,有可能在分散步骤抑制该淤浆固体含量的变化并显著地改进制造该介电糊的效率。
本发明的技术优势
根据本发明,有可能提供一种制备多层陶瓷电子元件用介电糊的方法,该方法能制备其中介电材料高度分散同时以希望的方式控制该介电材料的浓度的介电糊。
优选实施方案的描述
在本发明中,优选捏合该介电粉末、基料和溶剂直到该混合物达到其湿点且更优选捏合该介电粉末、基料和溶剂直到该混合物的固体含量达到85到95%。
在本发明中,优选使用选自高速剪切混合器、行星式捏和机和捏和机的混合器捏合该介电粉末、基料和溶剂。
在本发明中,作为高速剪切混合器,优选使用由Mitsui MiningCo.,Ltd.制造的“Henshel Mixer”(产品名称)、由Nippon EirichCo.,Ltd.制造的“Eirich Mixer”(产品名称)等,且当使用高速剪切混合器捏合该介电粉末、基料和溶剂时,该高速剪切混合器的转数通常设置为500r.p.m.到3000r.p.m。
在本发明中,作为行星式捏和机,优选使用具有两个或更多轴的行星式混合机/捏和机的行星混合器,且当使用行星混合器捏合该介电粉末、基料和溶剂时,以等于或低于100r.p.m.的低速度运转该行星混合器,从而捏合该介电粉末、基料和溶剂。
在本发明中,当使用捏和机捏合该介电粉末、基料和溶剂时,以等于或低于100r.p.m.的低速度运转该捏和机,从而捏合该介电粉末、基料和溶剂。
在本发明中,优选向100重量份介电粉末中添加0.25到3.0重量份基料和4.75到19.0重量份溶剂并捏合该介电粉末、基料和溶剂直到该混合物的固体含量达到85到95%,更优选向100重量份介电粉末中添加0.5到2.0重量份基料和5.0到15.0重量份溶剂并捏合该介电粉末、基料和溶剂直到该混合物的固体含量达到85到95%。
在本发明中,优选将该基料溶解于该溶剂中从而制备有机载体,向该介电粉末中添加3到15wt%的有机载体并捏合该介电粉末、基料和溶剂。
在本发明中,优选向该由捏合步骤获得的混合物中添加分散剂从而淤浆化该混合物。
在本发明中,更优选相对于100重量份介电粉末添加0.25到2.0重量份分散剂到该由捏合步骤获得的混合物中从而降低该混合物的粘度,然后向该混合物中添加该溶剂从而淤浆化该混合物。
在本发明中,优选向该由捏合步骤获得的混合物中添加分散剂并淤浆化该混合物直到该混合物的固体含量变成40到50%且该混合物粘度变成数帕到数十帕。
在本发明中,优选还使用封闭型乳化器连续地分散该由淤浆化步骤获得的淤浆,从而制备介电糊。
在本发明中,更优选还使用均化器或胶体磨连续地分散该由淤浆化步骤获得的淤浆从而制备介电糊。
对在本发明中所使用的基料不作特别限制,但优选使用选自乙基纤维素、聚乙烯醇缩丁醛、丙烯酸系树脂及其混合物的基料作为本发明中的基料。
对在本发明中所使用的溶剂不作特别限制,但优选使用选自松油醇、二氢松油醇、丁基卡必醇、乙酸丁基卡必醇酯、乙酸松油醇酯、乙酸二氢松油醇酯、煤油及其混合物的溶剂作为本发明中的溶剂。
对在本发明中所使用的分散剂不作特别限制,聚合物型分散剂、非离子型分散剂、阴离子型分散剂、阳离子型分散剂或两性表面活性剂可用于本发明。在这些之中,非离子型分散剂是优选的,亲水-亲油性平衡(HLB)为5到7的聚乙二醇体系分散剂在本发明中是尤其优选的。
使用丝网印刷机等将介电糊以与印刷在该陶瓷生片表面上的电极层的图案互补的图案印刷于陶瓷生片的表面上,从而形成间隔层且通过从该陶瓷生片上剥离支撑片而制造出包括陶瓷生片、电极层和间隔层的多层单元。
有可能使用丝网印刷机等将根据本发明制备的介电糊以与电极层的图案互补的图案印刷于陶瓷生片的表面上从而形成间隔层,并在干燥该间隔层之后使用丝网印刷机等将导电糊印刷于陶瓷生片的表面上从而形成该电极层。
此外,有可能在第一支撑片的表面上形成陶瓷生片,印刷导电糊于第二支撑片的表面上从而形成电极层,以与电极层的图案互补的图案印刷根据本发明所制备的介电糊于该第二支撑片的表面上从而形成间隔层,转移形成于第三支撑片表面上的粘合剂层到该陶瓷生片的表面上或该电极层与该间隔层的表面上并经由该粘合剂层粘结该陶瓷生片和该电极层与该间隔层从而制造多层单元。
层压并按压希望数目的如此制造的多层单元以制造层压体并将该所得的层压体切成方块,从而制造出陶瓷生芯片。
此外,从该生芯片中除去基料、烘烤该生芯片并形成外部电极,从而完成了多层陶瓷电子元件如多层陶瓷电容器。
工作实施例
下文将说明工作实施例和对比实施例以进一步阐明本发明的优点。
工作实施例
按照以下方式制备介电糊使得包含在该介电糊中的介电材料的浓度为43wt%。
混合1.48重量份(BaCa)SiO3、1.01重量份Y2O3、0.72重量份MgCO3、0.13重量份MnO和0.045重量份V2O5,从而制备添加剂粉末。
将150重量份丙酮、104.3重量份松油醇和1.5重量份聚乙二醇体系分散剂添加到100重量份所制备的添加剂粉末中以制备淤浆且使用由Ashizawa Finetech Co.,Ltd制造的“LMZO.6”(产品名称)粉碎机磨碎包含在该淤浆中的添加剂。
当要磨碎包含在该淤浆中的添加剂时,将具有直径为0.1毫米的ZrO2珠加入容器中以致占据该容器80%的体积,转子以14m/min的圆周速度旋转并使淤浆在容器和淤浆槽之间流通直到整个淤浆的滞留时间变成5分钟,从而磨碎该包含在淤浆中的添加剂。
在粉碎之后该添加剂的中值粒径为0.1微米。
然后,使用蒸发器蒸发并从该淤浆中除去丙酮,从而制备了其中添加剂分散在松油醇中的添加剂糊。包含在该添加剂糊中的添加剂的浓度为49.3wt%。
此外,由SAKAI CHEMICAL INDUSTRY CO.,LTD制造的且具有粒径为0.2微米的BaTiO3粉末“BT-02”(产品名称)用作介电粉末,将9.3重量份该添加剂糊添加到100重量份该介电粉末中并使用行星混合器混合混合物。该行星混合器的转数设置到50r.p.m。
然后,在70℃将5重量份聚乙烯醇缩丁醛(聚合度:2400,缩丁醛度:69%,缩醛度:12%)溶于95重量份松油醇中,从而制备5%的有机载体溶液。将该所制备的有机载体溶液逐渐添加到并混合进入该介电粉末、添加剂糊和聚乙二醇体系分散剂的混合物中直到该介电粉末、添加剂糊和聚乙二醇体系分散剂的混合物变成粘土状且捏和机的负载电流值(一度变得极高)降低并稳定在一个恒定值。
当捏合该混合物三十小时然后添加12.1重量份有机载体溶液到该混合物中时,该负载电流值稳定在一个恒定值。
然后,将1重量份聚乙二醇体系分散剂添加到该粘土状混合物中以降低该粘土状混合物的粘度从而获得膏状混合物。
此外,将0.5重量份作为抗静电助剂的咪唑啉体系表面活性剂、2.3重量份作为增塑剂的邻苯二甲酸二辛酯、81.3重量份剩余的有机载体溶液和34.7重量份松油醇添加到该粘土状混合物中,从而逐渐降低该粘土状混合物的粘度。
然后,使用胶体磨在胶体间隙为40微米和转速为1800r.p.m.的条件下分散处理该所得的粘土状混合物三次从而制备介电糊。
使用由HAKKE Co.,Ltd.制造的流变仪在温度为25℃和剪切速度为8sec-1的条件下测量该所得的介电糊的粘度。
此外,称出1克该所得的介电糊加入坩埚中并在600℃烧爆,在爆裂之后测量该介电糊的重量,从而测量包含在该介电糊中的介电材料的浓度。
该介电糊的粘度和介电材料的浓度的测量结果在表1中示出。
此外,使用粒度计测量该介电糊中是否含有任何粗糙颗粒和不溶解的树脂组分。
该测量结果在表1中示出。
接下来,使用丝网印刷方法将该介电糊印刷到聚对苯二甲酸乙二酯膜上并在80℃干燥五分钟,从而形成介电膜。然后,测量该所得的介电膜的表面粗糙度(Ra)、光泽度和密度。
在此,使用由Kosaka Laboratory Ltd.制造的“SURFCORDER(SE-30D)”(产品名称)测量该介电膜的表面粗糙度(Ra)并使用由Nippon Denshoku Kogyo Co.,Ltd制造的光泽计测量该介电膜的光泽度。
另一方面,从该干燥的介电膜中冲切出12毫米的圆形样品并根据用精密天平测量的样品重量及其用测微计测量的厚度来计算该介电膜的密度。
该测量结果在表1中示出。
对比实施例
按照以下方式制备介电糊使得包含在该介电糊中的介电材料的浓度为43wt%。
按工作实施例的方式首先制备添加剂糊。
然后,使用球磨机分散具有以下组成的淤浆十六小时。
分散操作的条件经设置,使得所加入的具有直径为2.0毫米的ZrO2的量为该球磨机的30体积%,在该球磨机中的淤浆的量为60体积%且该球磨机的圆周速度为45m/min。
介电粉末 100重量份
添加剂糊 9.3重量份
聚乙烯醇缩丁醛 4.5重量份
聚乙二醇体系分散剂 1.0重量份
邻苯二甲酸二辛酯 2.25重量份
松油醇 120重量份
丙酮 57重量份
在此,使用由SAKAI CHEMICAL INDUSTRY CO.,LTD制造的BaTiO3粉末(“BT-02”(产品名称)作为介电粉末且该聚乙烯醇缩丁醛的聚合度,缩丁醛度和缩醛度分别为2400、69%和12%。
在该分散操作之后,使用具有蒸发器和加热机构的搅拌装置蒸发并从该淤浆中除去丙酮,从而制备介电糊。
使用由HAKKE Co.,Ltd.制造的流变仪在温度为25℃和剪切速度为8sec-1的条件下测量该所得的介电糊的粘度。
此外,在坩埚中加入1克该所得的介电糊并在600℃烧爆,在爆裂之后测量该介电糊的重量,从而测量包含在该介电糊中的介电材料的浓度。
该介电糊的粘度和介电材料的浓度的测量结果在表1中示出。
此外,使用粒度计测量该介电糊中是否含有任何粗糙颗粒和不溶解的树脂组分。
该测量结果在表1中示出。
接下来,使用丝网印刷方法将该介电糊印刷到聚对苯二甲酸乙二酯膜上并在80℃干燥五分钟,从而形成介电膜。然后,按工作实施例中的方式测量该所得的介电膜的表面粗糙度(Ra)、光泽度和密度。
该测量结果在表1中示出。
表1
糊的粘度 | 介电材料的浓度(wt%) | 粗糙颗粒(μm) | 表面粗糙度(μm) | 介电膜的光泽度(%) | 介电膜的密度(g/cm3) | |
工作实施例 | 5.6 | 43.1 | 无 | 0.06 | 58 | 3.7 |
对比实施例 | 8.4 | 45.1 | 20 | 0.09 | 30 | 3.3 |
如表1所示,发现根据工作实施例制备的介电糊的粘度为5.6Pa,而根据对比实施例制备的介电糊的粘度为8.4Pa,且根据工作实施例制备的介电糊中介电材料是高度分散的。
此外,如表1所示,发现虽然包含在根据对比实施例制备的介电糊中的介电材料的浓度为45.1%且显著地不同于43%(包含在介电糊中的介电材料的目标浓度),但是包含在根据工作实施例制备的介电糊中的介电材料的浓度为43.1%并基本上与包含在介电糊中的介电材料的目标浓度(43%)相符。
因此,发现根据本发明可以按照希望的方式控制包含在介电糊中的介电材料的浓度。
此外,根据工作实施例制备的介电糊中没有检测到粗糙颗粒和不溶解的树脂,而根据对比实施例制备的介电糊中可检测到直径测量为20微米的粗糙颗粒。可合理的断定这归因于改进了根据工作实施例制备的介电糊中的介电材料的分散性。
另外,如表1所示,发现与根据工作实施例制造的介电膜相比,根据对比实施例制造的介电膜具有更高的表面粗糙度Ra和更差的表面平滑度。可合理的假定这归因于与根据工作实施例制备的介电糊相比,根据对比实施例制备的介电糊含有直径测量为20微米的粗糙颗粒且介电材料的分散性更差。
此外,如表1所示,发现根据工作实施例制造的介电膜的光泽水平和密度都比根据对比实施例制造的介电膜的那些要高。可合理的假定这归因于根据工作实施例制备的介电糊中的介电材料的分散性要高于根据对比实施例制备的介电糊中的介电材料。
如上所述,从工作实施例和对比实施例中发现根据本发明制备的介电糊中的介电材料是高度分散的且根据本发明有可能制备其中介电材料是高度分散的介电糊。
此外,从工作实施例和对比实施例中发现包含在根据本发明制备的介电糊中的介电材料的浓度基本上与介电材料的目标浓度相符且根据本发明有可能以希望的方式控制包含在介电糊中的介电材料的浓度。
因此已参照工作实施例示出并描述了本发明。然而,应该注意到本发明不限于所述安排的细节,在不脱离所附权利要求书的范围下可作出改变和修改。
例如,在工作实施例中,虽然使用胶体磨分散该粘土状混合物,但是不是绝对必须使用胶体磨来分散该粘土状混合物且该粘土状混合物可使用均化器代替胶体磨来分散。
此外,在工作实施例中,虽然是使用行星混合器来捏合该介电粉末、添加剂糊和分散剂,但是不是绝对必须使用行星混合器来捏合该介电粉末、添加剂糊和分散剂,可使用捏和机或高速剪切混合器如由Mitsui Mining Co.,Ltd.制造的“Henshel Mixer”(产品名称)、由Nippon Eirich Co.,Ltd.制造的“Eirich Mixer”(产品名称)等代替行星混合器来捏合该介电粉末、添加剂糊和分散剂。
Claims (16)
1.制备多层陶瓷电子元件用介电糊的方法,包括:捏合介电粉末、基料和溶剂以形成粘土状混合物的捏合步骤,和向该由捏合步骤获得的混合物中添加与在捏合步骤中所使用的溶剂相同的溶剂以降低该混合物的粘度从而淤浆化该混合物的淤浆化步骤。
2.根据权利要求1的制备多层陶瓷电子元件用介电糊的方法,其中捏合该介电粉末、基料和溶剂直到该混合物达到其湿点(球点)。
3.根据权利要求1或2的制备多层陶瓷电子元件用介电糊的方法,其中捏合该介电粉末、基料和溶剂直到该混合物的固体含量达到85到95%。
4.根据权利要求1到3中任一项的制备多层陶瓷电子元件用介电糊的方法,其中使用混合器捏合该介电粉末、基料和溶剂,该混合器选自高速剪切混合器、行星式捏和机和捏和机。
5.根据权利要求3或4的制备多层陶瓷电子元件用介电糊的方法,其包括步骤:添加0.25到3.0重量份基料和4.75到19.0重量份溶剂到100重量份介电粉末中并捏合该介电粉末、基料和溶剂直到该混合物的固体含量达到85到95%。
6.根据权利要求5的制备多层陶瓷电子元件用介电糊的方法,其包括步骤:添加0.5到2.0重量份基料和5.0到15.0重量份溶剂到100重量份介电粉末中并捏合该介电粉末、基料和溶剂直到该混合物的固体含量达到85到95%。
7.根据权利要求1到6中任一项的制备多层陶瓷电子元件用介电糊的方法,其包括步骤:将该基料溶于溶剂中从而制备有机载体,添加3到15wt%该有机载体到该介电粉末中并捏合该介电粉末、基料和溶剂。
8.根据权利要求1到7中任一项的制备多层陶瓷电子元件用介电糊的方法,其包括步骤:添加分散剂到该由捏合步骤获得的混合物中从而淤浆化该混合物。
9.根据权利要求8的制备多层陶瓷电子元件用介电糊的方法,其包括步骤:相对于100重量份该介电粉末添加0.25到2.0重量份分散剂到该由捏合步骤获得的混合物中从而降低该混合物的粘度,然后添加溶剂到该混合物中从而淤浆化该混合物。
10.根据权利要求1到7中任一项的制备多层陶瓷电子元件用介电糊的方法,其还包括步骤:使用密封型乳化器连续地分散该由淤浆化步骤获得的淤浆。
11.根据权利要求10的制备多层陶瓷电子元件用介电糊的方法,其中使用均化器连续地分散该由淤浆化步骤获得的淤浆。
12.根据权利要求10的制备多层陶瓷电子元件用介电糊的方法,其中使用胶体磨连续地分散该由淤浆化步骤获得的淤浆。
13.根据权利要求1到12中任一项的制备多层陶瓷电子元件用介电糊的方法,其中使用选自乙基纤维素、聚乙烯醇缩丁醛、丙烯酸系树脂及其混合物的基料作为该基料。
14.根据权利要求1到13中任一项的制备多层陶瓷电子元件用介电糊的方法,其中使用选自松油醇、二氢松油醇、丁基卡必醇、乙酸丁基卡必醇酯、乙酸松油醇酯、乙酸二氢松油醇酯、煤油及其混合物的溶剂作为该溶剂。
15.根据权利要求1到14中任一项的制备多层陶瓷电子元件用介电糊的方法,其中使用非离子型分散剂作为该分散剂。
16.根据权利要求15的制备多层陶瓷电子元件用介电糊的方法,其中使用亲水-亲油性平衡(HLB)为5到7的聚乙二醇体系分散剂用作该分散剂。
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2004
- 2004-09-28 KR KR1020067005733A patent/KR100853278B1/ko not_active IP Right Cessation
- 2004-09-28 JP JP2005514430A patent/JPWO2005032785A1/ja active Pending
- 2004-09-28 US US10/573,958 patent/US20070007700A1/en not_active Abandoned
- 2004-09-28 WO PCT/JP2004/014160 patent/WO2005032785A1/ja active Application Filing
- 2004-09-28 CN CNA2004800284614A patent/CN1860004A/zh active Pending
- 2004-09-29 TW TW093129484A patent/TWI304594B/zh not_active IP Right Cessation
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US9447218B2 (en) | 2013-03-29 | 2016-09-20 | Sekisui Chemical Co., Ltd. | Binder for manufacturing inorganic sintered body |
CN104903275B (zh) * | 2013-03-29 | 2017-09-15 | 积水化学工业株式会社 | 无机质烧结体制造用粘合剂 |
CN112142480A (zh) * | 2020-09-22 | 2020-12-29 | 中国振华(集团)新云电子元器件有限责任公司(国营第四三二六厂) | 一种湿法工艺多层片式瓷介电容器的瓷浆及其制备方法 |
Also Published As
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JPWO2005032785A1 (ja) | 2007-11-15 |
KR20060095984A (ko) | 2006-09-05 |
KR100853278B1 (ko) | 2008-08-20 |
TW200519975A (en) | 2005-06-16 |
US20070007700A1 (en) | 2007-01-11 |
WO2005032785A1 (ja) | 2005-04-14 |
TWI304594B (en) | 2008-12-21 |
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