TW200508379A - Resin composition for thermally conductive material and thermally conductive material - Google Patents
Resin composition for thermally conductive material and thermally conductive materialInfo
- Publication number
- TW200508379A TW200508379A TW093114069A TW93114069A TW200508379A TW 200508379 A TW200508379 A TW 200508379A TW 093114069 A TW093114069 A TW 093114069A TW 93114069 A TW93114069 A TW 93114069A TW 200508379 A TW200508379 A TW 200508379A
- Authority
- TW
- Taiwan
- Prior art keywords
- thermally conductive
- conductive material
- resin composition
- thermal conductivity
- liquid
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
- C08L33/04—Homopolymers or copolymers of esters
- C08L33/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, which oxygen atoms are present only as part of the carboxyl radical
- C08L33/10—Homopolymers or copolymers of methacrylic acid esters
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3737—Organic materials with or without a thermoconductive filler
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
- C08L33/04—Homopolymers or copolymers of esters
- C08L33/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, which oxygen atoms are present only as part of the carboxyl radical
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Polymerisation Methods In General (AREA)
Applications Claiming Priority (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003140048 | 2003-05-19 | ||
JP2003140047A JP4009224B2 (ja) | 2003-05-19 | 2003-05-19 | 放熱材料用樹脂組成物 |
JP2003283870A JP3875664B2 (ja) | 2003-07-31 | 2003-07-31 | 放熱材料用樹脂組成物およびその硬化物 |
JP2003283866A JP4344192B2 (ja) | 2003-07-31 | 2003-07-31 | 放熱材用樹脂組成物およびその硬化物 |
JP2004029235A JP2005220220A (ja) | 2004-02-05 | 2004-02-05 | 放熱材用樹脂組成物およびその硬化物 |
JP2004067387A JP3999751B2 (ja) | 2004-03-10 | 2004-03-10 | (メタ)アクリル系重合性液状樹脂組成物の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200508379A true TW200508379A (en) | 2005-03-01 |
TWI299751B TWI299751B (zh) | 2008-08-11 |
Family
ID=33459354
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW093114069A TW200508379A (en) | 2003-05-19 | 2004-05-19 | Resin composition for thermally conductive material and thermally conductive material |
Country Status (4)
Country | Link |
---|---|
US (1) | US7589147B2 (zh) |
KR (1) | KR100731279B1 (zh) |
TW (1) | TW200508379A (zh) |
WO (1) | WO2004101678A1 (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113614137A (zh) * | 2019-03-26 | 2021-11-05 | 气体运输技术公司 | 罐的隔热主体的聚氨酯/聚异氰脲酸酯泡沫块状物及其制备方法 |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104086929A (zh) * | 2008-10-21 | 2014-10-08 | 日立化成工业株式会社 | 导热片材、其制造方法以及使用了该导热片材的散热装置 |
US20120098117A1 (en) * | 2010-10-22 | 2012-04-26 | Renesas Technology America, Inc. | Power and thermal design using a common heat sink on top of high thermal conductive resin package |
US20140058015A1 (en) * | 2011-04-26 | 2014-02-27 | Win Tech Polymer Ltd. | Insert molded article |
JP5892734B2 (ja) | 2011-05-02 | 2016-03-23 | スリーエム イノベイティブ プロパティズ カンパニー | 熱伝導性シート |
KR20130026062A (ko) * | 2011-09-05 | 2013-03-13 | 삼성전자주식회사 | 인쇄회로기판 조립체 및 그 제조방법 |
EP3041627A4 (en) * | 2013-09-05 | 2017-05-03 | Henkel IP & Holding GmbH | Metal sintering film compositions |
KR101611513B1 (ko) * | 2014-10-22 | 2016-04-11 | 금오공과대학교 산학협력단 | 탄소계 충진재가 첨가된 열전도 테이프의 제조 방법 및 그에 의해 제조된 열전도 테이프 |
US11229147B2 (en) | 2015-02-06 | 2022-01-18 | Laird Technologies, Inc. | Thermally-conductive electromagnetic interference (EMI) absorbers with silicon carbide |
JP6494106B2 (ja) * | 2015-08-11 | 2019-04-03 | 協立化学産業株式会社 | 硬化性樹脂組成物 |
CA3024455C (en) | 2016-05-17 | 2023-03-28 | General Cable Technologies Corporation | Fire retardant compositions and cable separators formed thereof |
JP6537748B2 (ja) | 2016-12-28 | 2019-07-03 | 三菱電機株式会社 | 電源装置 |
US11772829B2 (en) | 2018-06-27 | 2023-10-03 | Mitsubishi Electric Corporation | Power supply device |
CN109679292A (zh) * | 2019-01-12 | 2019-04-26 | 莫爱军 | 一种高耐候低吸湿性led封装材料及其制备方法 |
KR102542423B1 (ko) | 2020-09-23 | 2023-06-12 | 라이르드 테크놀로지스, 아이엔씨 | 열전도성 전자파 장해(emi) 흡수체 |
Family Cites Families (35)
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US3920605A (en) | 1970-12-24 | 1975-11-18 | Mitsubishi Rayon Co | Metal-containing organic high molecular compound reinforced with particulate organic or inorganic material |
GB1493393A (en) | 1974-05-29 | 1977-11-30 | Ici Ltd | Fluid curable compositions containing particulate fillers and composite polymeric materials obtained therefrom |
JPS5922961A (ja) | 1982-07-29 | 1984-02-06 | Toshiba Corp | 耐熱性接着剤 |
JP3171276B2 (ja) | 1992-02-18 | 2001-05-28 | 日弘ビックス株式会社 | 熱可塑性樹脂の着色方法 |
CA2093191A1 (en) | 1992-04-15 | 1993-10-16 | Richard J. Webb | Psa containing thermally conductive, electrically insulative particles and a transfer tape from this psa |
US5395876A (en) | 1993-04-19 | 1995-03-07 | Acheson Industries, Inc. | Surface mount conductive adhesives |
US5705552A (en) | 1993-11-26 | 1998-01-06 | Aristech Chemical Corporation | Thermoformable acrylic sheet having uniform distribution of color and mineral filler |
US5773485A (en) | 1994-07-29 | 1998-06-30 | Minnesota Mining And Manufacturing Company | Acrylic syrup curable to a crosslinked viscoelastomeric material |
JP3072052B2 (ja) | 1995-06-21 | 2000-07-31 | 株式会社日本触媒 | (メタ)アクリル系成形材料およびその製造方法 |
JP3797628B2 (ja) | 1995-11-08 | 2006-07-19 | 日東電工株式会社 | 感圧接着剤及びその接着シート |
CA2273890C (en) | 1996-12-04 | 2006-03-14 | Nitto Denko Corporation | Thermally conductive pressure-sensitive adhesive, adhesive sheet containing the same, and method for fixing electronic part to heat-radiating member with the same |
JPH10316953A (ja) | 1997-05-16 | 1998-12-02 | Nitto Denko Corp | 剥離可能な熱伝導性感圧接着剤とその接着シ―ト類 |
US5968606A (en) | 1997-06-30 | 1999-10-19 | Ferro Corporation | Screen printable UV curable conductive material composition |
JP3921754B2 (ja) | 1997-09-19 | 2007-05-30 | 住友化学株式会社 | 硬質物打ち込み用アクリル板およびその製造方法 |
JP4337991B2 (ja) | 1997-12-22 | 2009-09-30 | 日東電工株式会社 | 熱伝導性感圧接着シ―ト類およびこれを用いた電子部品と放熱部材との固定方法 |
JPH11209431A (ja) | 1998-01-22 | 1999-08-03 | Mitsubishi Rayon Co Ltd | アクリル系シラップ組成物 |
JPH11269438A (ja) | 1998-03-25 | 1999-10-05 | Dainippon Ink & Chem Inc | 熱伝導難燃性感圧接着剤及び感圧接着テープ |
JP4448919B2 (ja) | 1998-10-23 | 2010-04-14 | 綜研化学株式会社 | 塊状重合用触媒および該触媒を用いた塊状重合法 |
JP4360007B2 (ja) | 2000-05-26 | 2009-11-11 | Jsr株式会社 | 熱伝導性シート用硬化性組成物、熱伝導性シートおよびその製造方法 |
JP4748850B2 (ja) | 1999-12-24 | 2011-08-17 | 株式会社日本触媒 | 塗料用樹脂組成物 |
JP2002003732A (ja) | 2000-06-26 | 2002-01-09 | Sekisui Chem Co Ltd | 熱伝導性樹脂組成物及び樹脂シート |
JP2002030212A (ja) | 2000-06-29 | 2002-01-31 | Three M Innovative Properties Co | 熱伝導性シート |
JP2002026202A (ja) | 2000-06-29 | 2002-01-25 | Three M Innovative Properties Co | 熱伝導性シート及びその製造方法 |
JP2002134665A (ja) | 2000-10-26 | 2002-05-10 | Achilles Corp | 放熱シート |
JP2002155110A (ja) | 2000-11-22 | 2002-05-28 | Sekisui Chem Co Ltd | 重合性組成物及び熱伝導性シート |
US6544596B2 (en) * | 2000-11-29 | 2003-04-08 | Pacific Northwest Coatings | Method of coating a substrate using a thermosetting basecoat composition and a thermoplastic top coat composition |
JP3712943B2 (ja) | 2001-02-08 | 2005-11-02 | 富士高分子工業株式会社 | 熱軟化放熱シート及びこれを用いた放熱シート |
DE10106567A1 (de) * | 2001-02-13 | 2002-08-22 | Basf Coatings Ag | Von flüchtigen organischen Stoffen im wesentlichen oder völlig freie wäßrige Primärdispersion, Verfahren zu ihrer Herstellung und ihre Verwendung |
JP2003049144A (ja) | 2001-08-08 | 2003-02-21 | Sekisui Chem Co Ltd | 熱伝導性感圧接着剤及び熱伝導性感圧接着シート |
JP2003133490A (ja) | 2001-10-19 | 2003-05-09 | Achilles Corp | 熱伝導性組成物及び熱伝導性成形体 |
JP3947410B2 (ja) | 2002-02-26 | 2007-07-18 | アキレス株式会社 | 熱伝導性液状充填物およびそれから得られる熱伝導材 |
JP4995403B2 (ja) | 2002-05-02 | 2012-08-08 | スリーエム イノベイティブ プロパティズ カンパニー | アクリル系熱伝導性組成物形成用組成物、熱伝導性シート並びにその製造方法 |
JP4065739B2 (ja) | 2002-08-01 | 2008-03-26 | 三菱レイヨン株式会社 | アクリルシラップの製造方法 |
JP4009224B2 (ja) | 2003-05-19 | 2007-11-14 | 株式会社日本触媒 | 放熱材料用樹脂組成物 |
JP4869584B2 (ja) | 2004-12-03 | 2012-02-08 | スリーエム イノベイティブ プロパティズ カンパニー | 熱伝導性シート及びその製造方法 |
-
2004
- 2004-05-19 TW TW093114069A patent/TW200508379A/zh not_active IP Right Cessation
- 2004-05-19 US US10/557,786 patent/US7589147B2/en not_active Expired - Fee Related
- 2004-05-19 WO PCT/JP2004/007113 patent/WO2004101678A1/ja active Application Filing
- 2004-05-19 KR KR1020057021364A patent/KR100731279B1/ko not_active IP Right Cessation
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113614137A (zh) * | 2019-03-26 | 2021-11-05 | 气体运输技术公司 | 罐的隔热主体的聚氨酯/聚异氰脲酸酯泡沫块状物及其制备方法 |
CN113614137B (zh) * | 2019-03-26 | 2024-03-01 | 气体运输技术公司 | 罐的隔热主体的聚氨酯/聚异氰脲酸酯泡沫块状物及其制备方法 |
Also Published As
Publication number | Publication date |
---|---|
KR20060015598A (ko) | 2006-02-17 |
US7589147B2 (en) | 2009-09-15 |
US20070027254A1 (en) | 2007-02-01 |
KR100731279B1 (ko) | 2007-06-21 |
TWI299751B (zh) | 2008-08-11 |
WO2004101678A1 (ja) | 2004-11-25 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |