TW200507239A - ESD protection circuit having control circuit - Google Patents

ESD protection circuit having control circuit

Info

Publication number
TW200507239A
TW200507239A TW093118238A TW93118238A TW200507239A TW 200507239 A TW200507239 A TW 200507239A TW 093118238 A TW093118238 A TW 093118238A TW 93118238 A TW93118238 A TW 93118238A TW 200507239 A TW200507239 A TW 200507239A
Authority
TW
Taiwan
Prior art keywords
circuit
esd protection
pad
protection circuit
control circuit
Prior art date
Application number
TW093118238A
Other languages
English (en)
Other versions
TWI282617B (en
Inventor
Kazuhisa Sakihama
Akira Yamaguchi
Original Assignee
Toshiba Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Kk filed Critical Toshiba Kk
Publication of TW200507239A publication Critical patent/TW200507239A/zh
Application granted granted Critical
Publication of TWI282617B publication Critical patent/TWI282617B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
    • H01L27/0203—Particular design considerations for integrated circuits
    • H01L27/0248—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection
    • H01L27/0251—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection for MOS devices
    • H01L27/0266—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection for MOS devices using field effect transistors as protective elements
    • H01L27/0285—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection for MOS devices using field effect transistors as protective elements bias arrangements for gate electrode of field effect transistors, e.g. RC networks, voltage partitioning circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
TW093118238A 2003-08-04 2004-06-24 ESD protection circuit having control circuit TWI282617B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003205735A JP4000096B2 (ja) 2003-08-04 2003-08-04 Ｅｓｄ保護回路

Publications (2)

Publication Number Publication Date
TW200507239A true TW200507239A (en) 2005-02-16
TWI282617B TWI282617B (en) 2007-06-11

Family

ID=34113677

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093118238A TWI282617B (en) 2003-08-04 2004-06-24 ESD protection circuit having control circuit

Country Status (4)

Country Link
US (1) US6980408B2 (zh)
JP (1) JP4000096B2 (zh)
CN (1) CN100359685C (zh)
TW (1) TWI282617B (zh)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4137888B2 (ja) * 2003-05-13 2008-08-20 富士通株式会社 半導体集積回路装置
TWI281740B (en) * 2004-09-08 2007-05-21 Winbond Electronics Corp Electrostatic discharge protection circuit
JP2006294903A (ja) * 2005-04-12 2006-10-26 Nec Electronics Corp ヒューズトリミング回路
JP4913376B2 (ja) * 2005-08-22 2012-04-11 ローム株式会社 半導体集積回路装置
KR20080045244A (ko) * 2005-09-19 2008-05-22 더 리젠츠 오브 더 유니버시티 오브 캘리포니아 Ｅｓｄ 보호회로
JP4562674B2 (ja) * 2006-03-23 2010-10-13 川崎マイクロエレクトロニクス株式会社 Ｅｓｄ保護回路
US7511931B2 (en) * 2006-08-01 2009-03-31 Intersil Americas Inc. Self protecting output stage
JP4723443B2 (ja) * 2006-09-13 2011-07-13 Ｏｋｉセミコンダクタ株式会社 半導体集積回路
JP2008177491A (ja) * 2007-01-22 2008-07-31 Renesas Technology Corp 半導体装置
US7804669B2 (en) * 2007-04-19 2010-09-28 Qualcomm Incorporated Stacked ESD protection circuit having reduced trigger voltage
KR101387252B1 (ko) * 2008-03-27 2014-04-18 에이저 시스템즈 엘엘시 입력/출력 인터페이스 회로, 입력/출력 인터페이스 회로를 포함하는 집적 회로, 및 입력/출력 인터페이스 회로의 전압 내성 증대 방법
JP4783442B2 (ja) * 2009-03-18 2011-09-28 株式会社東芝 Ｅｓｄ保護検証装置及びｅｓｄ保護検証方法
CN101964518A (zh) * 2009-07-23 2011-02-02 天钰科技股份有限公司 静电保护装置
CN102055179B (zh) * 2009-11-04 2013-09-18 上海宏力半导体制造有限公司 静电放电保护装置
JP5724623B2 (ja) * 2011-05-23 2015-05-27 ソニー株式会社 信号伝達装置および撮像表示システム
US8730626B2 (en) * 2011-10-04 2014-05-20 Taiwan Semiconductor Manufacturing Company, Ltd. Electrostatic discharge protection
JP5743850B2 (ja) 2011-10-28 2015-07-01 株式会社東芝 集積回路
US9337644B2 (en) 2011-11-09 2016-05-10 Mediatek Inc. ESD protection circuit
US9182767B2 (en) * 2013-03-11 2015-11-10 Qualcomm Incorporated Devices and methods for calibrating and operating a snapback clamp circuit
JP6589296B2 (ja) * 2015-02-27 2019-10-16 セイコーエプソン株式会社 静電気保護回路、回路装置及び電子機器
JP6326021B2 (ja) * 2015-09-16 2018-05-16 ローム株式会社 半導体チップ及びこれをパッケージングした半導体装置
US10256227B2 (en) * 2016-04-12 2019-04-09 Vishay-Siliconix Semiconductor device having multiple gate pads
CN109286181B (zh) * 2017-07-21 2022-06-28 苏州瀚宸科技有限公司 电源钳位esd保护电路
TWI654733B (zh) * 2018-06-04 2019-03-21 茂達電子股份有限公司 靜電放電保護電路
US11217541B2 (en) 2019-05-08 2022-01-04 Vishay-Siliconix, LLC Transistors with electrically active chip seal ring and methods of manufacture
CN112350290B (zh) * 2019-08-06 2023-01-31 世界先进积体电路股份有限公司 操作电路
US11218144B2 (en) 2019-09-12 2022-01-04 Vishay-Siliconix, LLC Semiconductor device with multiple independent gates
CN112218513B (zh) * 2020-10-13 2023-08-22 Oppo广东移动通信有限公司 一种芯片、天线模组以及终端

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US5151611A (en) * 1990-12-10 1992-09-29 Westinghouse Electric Corp. Programmable device for integrated circuits
US5280235A (en) * 1991-09-12 1994-01-18 Texas Instruments Incorporated Fixed voltage virtual ground generator for single supply analog systems
JPH05121662A (ja) 1991-10-25 1993-05-18 Nec Corp 半導体集積回路
US5272371A (en) * 1991-11-19 1993-12-21 Sgs-Thomson Microelectronics, Inc. Electrostatic discharge protection structure
US5400202A (en) * 1992-06-15 1995-03-21 Hewlett-Packard Company Electrostatic discharge protection circuit for integrated circuits
US5550699A (en) 1994-08-15 1996-08-27 Hewlett-Packard Co. Hot plug tolerant ESD protection for an IC
US5682049A (en) * 1995-08-02 1997-10-28 Texas Instruments Incorporated Method and apparatus for trimming an electrical value of a component of an integrated circuit
US5841723A (en) * 1996-05-28 1998-11-24 Micron Technology, Inc. Method and apparatus for programming anti-fuses using an isolated well programming circuit
TW351010B (en) * 1998-02-12 1999-01-21 Winbond Electronics Corp Static discharge protective circuit for recording of static discharging
US5959820A (en) * 1998-04-23 1999-09-28 Taiwan Semiconductor Manufacturing Co., Ltd. Cascode LVTSCR and ESD protection circuit
JP3633297B2 (ja) 1998-07-31 2005-03-30 松下電器産業株式会社 サージ保護装置及び方法
KR100267107B1 (ko) * 1998-09-16 2000-10-02 윤종용 반도체 소자 및 그 제조방법
US6249410B1 (en) * 1999-08-23 2001-06-19 Taiwan Semiconductor Manufacturing Company ESD protection circuit without overstress gate-driven effect
US6556409B1 (en) * 2000-08-31 2003-04-29 Agere Systems Inc. Integrated circuit including ESD circuits for a multi-chip module and a method therefor

Also Published As

Publication number Publication date
CN100359685C (zh) 2008-01-02
JP4000096B2 (ja) 2007-10-31
JP2005056892A (ja) 2005-03-03
CN1581481A (zh) 2005-02-16
US6980408B2 (en) 2005-12-27
US20050030688A1 (en) 2005-02-10
TWI282617B (en) 2007-06-11

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees