TW200506520A - Novel photosensitive resin compositions - Google Patents

Novel photosensitive resin compositions

Info

Publication number
TW200506520A
TW200506520A TW093116126A TW93116126A TW200506520A TW 200506520 A TW200506520 A TW 200506520A TW 093116126 A TW093116126 A TW 093116126A TW 93116126 A TW93116126 A TW 93116126A TW 200506520 A TW200506520 A TW 200506520A
Authority
TW
Taiwan
Prior art keywords
group
divalent
integer
mixtures
heterocyclic
Prior art date
Application number
TW093116126A
Other languages
English (en)
Other versions
TWI354865B (en
Inventor
Ilya Rushkin
Ahmad A Naiini
Richard Hopla
Pamela J Waterson
William D Weber
David B Powell
Original Assignee
Arch Spec Chem Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Arch Spec Chem Inc filed Critical Arch Spec Chem Inc
Publication of TW200506520A publication Critical patent/TW200506520A/zh
Application granted granted Critical
Publication of TWI354865B publication Critical patent/TWI354865B/zh

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0382—Macromolecular compounds which are rendered insoluble or differentially wettable the macromolecular compound being present in a chemically amplified negative photoresist composition
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/075—Silicon-containing compounds
    • G03F7/0751—Silicon-containing compounds used as adhesion-promoting additives or as means to improve adhesion
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
    • Y10S430/1053—Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
    • Y10S430/1055—Radiation sensitive composition or product or process of making
    • Y10S430/106—Binder containing

Landscapes

  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Materials For Photolithography (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
TW093116126A 2003-06-06 2004-06-04 Novel photosensitive resin compositions TWI354865B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US47681603P 2003-06-06 2003-06-06

Publications (2)

Publication Number Publication Date
TW200506520A true TW200506520A (en) 2005-02-16
TWI354865B TWI354865B (en) 2011-12-21

Family

ID=33551642

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093116126A TWI354865B (en) 2003-06-06 2004-06-04 Novel photosensitive resin compositions

Country Status (6)

Country Link
US (1) US7129011B2 (zh)
EP (1) EP1636649B1 (zh)
JP (1) JP4464396B2 (zh)
KR (1) KR101067828B1 (zh)
TW (1) TWI354865B (zh)
WO (1) WO2004111726A2 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI413863B (zh) * 2007-02-13 2013-11-01 Toray Industries 正型感光性樹脂組成物

Families Citing this family (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100787352B1 (ko) * 2005-02-23 2007-12-18 주식회사 하이닉스반도체 하드마스크용 조성물 및 이를 이용한 반도체 소자의 패턴형성 방법
JP5099979B2 (ja) * 2005-04-27 2012-12-19 日立化成デュポンマイクロシステムズ株式会社 ネガ型感光性樹脂組成物、パターンの製造方法及び電子部品
JP2008546204A (ja) * 2005-06-03 2008-12-18 フジフィルム・エレクトロニック・マテリアルズ・ユーエスエイ・インコーポレイテッド 前処理組成物
US7803510B2 (en) * 2005-08-17 2010-09-28 Fujifilm Electronic Materials U.S.A., Inc. Positive photosensitive polybenzoxazole precursor compositions
US7419611B2 (en) * 2005-09-02 2008-09-02 International Business Machines Corporation Processes and materials for step and flash imprint lithography
US7488771B2 (en) * 2005-09-02 2009-02-10 International Business Machines Corporation Stabilization of vinyl ether materials
US8871422B2 (en) * 2005-09-22 2014-10-28 Hitachi Chemical Dupont Microsystems Ltd. Negative-type photosensitive resin composition, pattern forming method and electronic parts
JP4923656B2 (ja) * 2006-03-22 2012-04-25 日立化成デュポンマイクロシステムズ株式会社 ネガ型感光性樹脂組成物、パターンの製造方法及び電子部品
TWI477906B (zh) * 2006-06-20 2015-03-21 Hitachi Chem Dupont Microsys 負片型感光性樹脂組成物、圖案的製造方法以及電子零件
KR101025395B1 (ko) * 2006-06-20 2011-03-28 히다치 가세이듀퐁 마이쿠로시스데무즈 가부시키가이샤 네거티브형 감광성 수지 조성물, 패턴의 제조방법 및 전자부품
JP5028059B2 (ja) * 2006-09-28 2012-09-19 富士フイルム株式会社 感光性樹脂組成物、それを用いた硬化レリーフパターンの製造方法及び半導体装置
US20080088983A1 (en) * 2006-10-11 2008-04-17 Gereon Meyer Damping control in magnetic nano-elements using ultrathin damping layer
KR100833706B1 (ko) * 2007-02-01 2008-05-29 삼성전자주식회사 감광성 폴리이미드 조성물, 폴리이미드 필름 및 이를 이용한 반도체 소자
EP2133743B1 (en) * 2007-03-12 2018-01-24 Hitachi Chemical DuPont Microsystems, Ltd. Photosensitive resin composition, process for producing patterned hardened film with use thereof and electronic part
EP1970761B1 (en) * 2007-03-14 2012-02-29 FUJIFILM Corporation Photosensitive composition and method of producing a cured relief pattern
KR101275474B1 (ko) * 2007-10-29 2013-06-14 히다치 가세이듀퐁 마이쿠로시스데무즈 가부시키가이샤 포지티브형 감광성 수지 조성물, 패턴의 제조방법 및 전자부품
KR100932765B1 (ko) * 2008-02-28 2009-12-21 한양대학교 산학협력단 폴리이미드-폴리벤조옥사졸 공중합체, 이의 제조방법, 및이를 포함하는 기체 분리막
CA2640517A1 (en) * 2008-05-19 2009-11-19 Industry-University Cooperation Foundation, Hanyang University Polyamic acids dope composition, preparation method of hollow fiber using the same and hollow fiber prepared therefrom
KR100913058B1 (ko) * 2008-08-25 2009-08-20 금호석유화학 주식회사 포지티브형 감광성 수지 조성물, 패턴 형성 방법 및 반도체소자
US8013103B2 (en) * 2008-10-10 2011-09-06 Industry-University Cooperation Foundation, Hanyang University Polymer compounds and a preparation method thereof
US8487064B2 (en) 2008-10-10 2013-07-16 Industry-University Cooperation Foundation, Hanyang University Polymer compounds and a preparation method thereof
KR101333698B1 (ko) * 2009-11-10 2013-11-27 제일모직주식회사 포지티브형 감광성 수지 조성물
KR101812528B1 (ko) 2010-01-08 2017-12-27 후지필름 가부시키가이샤 패턴형성방법, 감활성광선성 또는 감방사선성 수지 조성물 및 레지스트 막
KR20120066923A (ko) 2010-12-15 2012-06-25 제일모직주식회사 신규 페놀 화합물 및 이를 포함하는 포지티브형 감광성 수지 조성물
KR101423539B1 (ko) 2010-12-20 2014-07-25 삼성전자 주식회사 포지티브형 감광성 수지 조성물
WO2012172793A1 (ja) * 2011-06-15 2012-12-20 日立化成デュポンマイクロシステムズ株式会社 感光性樹脂組成物、該樹脂組成物を用いたパターン硬化膜の製造方法及び電子部品
KR101609631B1 (ko) * 2012-12-24 2016-04-06 제일모직 주식회사 포지티브형 감광성 수지 조성물, 및 이를 이용한 표시 소자용 유기 절연막 및 표시 소자
KR101674989B1 (ko) 2013-05-21 2016-11-22 제일모직 주식회사 레지스트 하층막용 조성물, 이를 사용한 패턴 형성 방법 및 상기 패턴을 포함하는 반도체 집적회로 디바이스
WO2015011893A1 (ja) * 2013-07-23 2015-01-29 日立化成デュポンマイクロシステムズ株式会社 樹脂組成物、それを用いたパターン形成方法及び電子部品
KR102028483B1 (ko) * 2013-09-17 2019-10-07 동우 화인켐 주식회사 착색 감광성 수지 조성물, 컬러필터 및 이를 구비한 액정표시장치
KR101667788B1 (ko) 2013-12-31 2016-10-19 제일모직 주식회사 하드마스크 조성물 및 이를 사용한 패턴 형성 방법
KR102399270B1 (ko) * 2014-11-27 2022-05-19 도레이 카부시키가이샤 수지 및 감광성 수지 조성물
JP6453186B2 (ja) * 2015-08-19 2019-01-16 富士フイルム株式会社 感光性樹脂組成物、硬化膜の製造方法、硬化膜、液晶表示装置、有機エレクトロルミネッセンス表示装置およびタッチパネル
JP6838369B2 (ja) * 2016-11-28 2021-03-03 Ｈｄマイクロシステムズ株式会社 ネガ型感光性樹脂組成物、硬化パターンの製造方法、硬化物及び電子デバイス
KR102477633B1 (ko) * 2020-02-12 2022-12-13 삼성에스디아이 주식회사 알칼리 가용성 수지, 이를 포함하는 감광성 수지 조성물, 감광성 수지막 및 디스플레이 장치

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE59010552D1 (de) * 1990-03-29 1996-12-05 Siemens Ag Hochwärmebeständige Negativresists und Verfahren zur Herstellung hochwärmebeständiger Reliefstrukturen
JPH05341522A (ja) * 1992-06-09 1993-12-24 Fuji Photo Film Co Ltd ネガ型フオトレジスト組成物
DE59606492D1 (de) * 1995-08-31 2001-04-05 Infineon Technologies Ag Herstellung von Poly-o-hydroxyamiden und Poly-o-mercaptoamiden
JP3477077B2 (ja) * 1997-07-01 2003-12-10 株式会社東芝 ネガ型感光性樹脂組成物、これを用いたパターン形成方法、および電子部品
JP3966590B2 (ja) * 1997-11-20 2007-08-29 旭化成エレクトロニクス株式会社 感光性組成物
JP4288796B2 (ja) 1999-10-29 2009-07-01 日立化成デュポンマイクロシステムズ株式会社 ネガ型感光性樹脂組成物、パターンの製造法及び電子部品
DE60142844D1 (de) * 2000-10-31 2010-09-30 Intel Corp Positive lichtempfindliche harzzusammensetzung, prozess zu ihrer herstellung und halbleiterbauelemente
JP4211225B2 (ja) 2001-02-27 2009-01-21 日本ゼオン株式会社 感放射線性樹脂組成物
JP2003121998A (ja) 2001-10-11 2003-04-23 Hitachi Chemical Dupont Microsystems Ltd 感光性重合体組成物及びパターン製造法及び電子部品
JP4317870B2 (ja) * 2003-03-11 2009-08-19 フジフィルム・エレクトロニック・マテリアルズ・ユーエスエイ・インコーポレイテッド 新規な感光性樹脂組成物

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI413863B (zh) * 2007-02-13 2013-11-01 Toray Industries 正型感光性樹脂組成物

Also Published As

Publication number Publication date
WO2004111726A3 (en) 2007-06-28
KR101067828B1 (ko) 2011-09-27
JP4464396B2 (ja) 2010-05-19
JP2007526493A (ja) 2007-09-13
KR20060019509A (ko) 2006-03-03
TWI354865B (en) 2011-12-21
WO2004111726A2 (en) 2004-12-23
US7129011B2 (en) 2006-10-31
EP1636649A2 (en) 2006-03-22
US20040253537A1 (en) 2004-12-16
EP1636649B1 (en) 2014-08-13
EP1636649A4 (en) 2009-09-16

Similar Documents

Publication Publication Date Title
TW200506520A (en) Novel photosensitive resin compositions
TWI266147B (en) Novel photosensitive resin compositions
TW200627068A (en) Resist composition, process for producing resist pattern, and compound
TW200505950A (en) Organic polymers electronic devices, and methods
ATE523562T1 (de) Härtbare zusammensetzung
WO2001044200A3 (en) Selective neurokinin antagonists
WO2008093831A1 (ja) ブロック共重合体並びにそれを用いた組成物、液状組成物、発光性薄膜及び高分子発光素子
TW200801049A (en) Lactone-containing compound, polymer, resist composition, and patterning process
TW200619239A (en) Positive resist composition and method for forming resist pattern
SG168462A1 (en) Novel copolymer and photoresist composition comprising the same
WO2008008077A3 (en) Functionalized polysiloxane polymers
CN107429059A (zh) 能量敏感性树脂组合物
RU2008149932A (ru) Высокомолекулярный конъюгат подофиллотоксинов
TW200641522A (en) Positive resist composition, method for forming resist pattern and compound
EP1826196A3 (en) Vinyl ether compounds
ATE490986T1 (de) Polymer, vernetztes polymer, zusammensetzung für ein feststoffpolymer-elektrolyt, feststoffpolymer-elektrolyt und klebstoffzusammensetzung
TW200632560A (en) Silicon-containing photosensitive composition, manufacturing method of thin film pattern using the same, protection film for electronic machine, gate insulation film and thin film transistor
TW200628508A (en) Radiation curable resin, liquid crystal sealing material, and liquid crystal display cell using same
KR960042232A (ko) 내식성 감광성 내식막 스트립퍼 조성물
FI850829L (fi) Foerlaekemedel foer allopurinol.
WO2003029898A1 (fr) Composition de resine photosensible
DE60133019D1 (de) Metallaminkomplex enthaltende fluorpolymer- zusammensetzungen
WO2008105398A1 (ja) Ｃｂｐ化合物
TW200636388A (en) Photosensitive resin composition for forming lens
TW200512543A (en) Polyamide resin, positive-working photosensitive resin composition, method for producing pattern-formed resin film, semiconductor device, display device, and method for producing the semiconductor device and the display device

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees