TW200505280A - Manufacturing method and manufacturing apparatus of organic thin film - Google Patents

Manufacturing method and manufacturing apparatus of organic thin film

Info

Publication number
TW200505280A
TW200505280A TW093103561A TW93103561A TW200505280A TW 200505280 A TW200505280 A TW 200505280A TW 093103561 A TW093103561 A TW 093103561A TW 93103561 A TW93103561 A TW 93103561A TW 200505280 A TW200505280 A TW 200505280A
Authority
TW
Taiwan
Prior art keywords
thin film
manufacturing
deposition apparatus
organic material
organic thin
Prior art date
Application number
TW093103561A
Other languages
English (en)
Inventor
Noriyuki Matsukaze
Hiroshi Kimura
Original Assignee
Fuji Electric Holdings
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Electric Holdings filed Critical Fuji Electric Holdings
Publication of TW200505280A publication Critical patent/TW200505280A/zh

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02C—SPECTACLES; SUNGLASSES OR GOGGLES INSOFAR AS THEY HAVE THE SAME FEATURES AS SPECTACLES; CONTACT LENSES
    • G02C9/00—Attaching auxiliary optical parts
    • G02C9/04—Attaching auxiliary optical parts by fitting over or clamping on
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/12—Organic material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/228—Gas flow assisted PVD deposition
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/243—Crucibles for source material
    • G—PHYSICS
    • G02—OPTICS
    • G02C—SPECTACLES; SUNGLASSES OR GOGGLES INSOFAR AS THEY HAVE THE SAME FEATURES AS SPECTACLES; CONTACT LENSES
    • G02C5/00—Constructions of non-optical parts
    • G02C5/02—Bridges; Browbars; Intermediate bars
    • G—PHYSICS
    • G02—OPTICS
    • G02C—SPECTACLES; SUNGLASSES OR GOGGLES INSOFAR AS THEY HAVE THE SAME FEATURES AS SPECTACLES; CONTACT LENSES
    • G02C5/00—Constructions of non-optical parts
    • G02C5/12—Nose pads; Nose-engaging surfaces of bridges or rims
    • G—PHYSICS
    • G02—OPTICS
    • G02C—SPECTACLES; SUNGLASSES OR GOGGLES INSOFAR AS THEY HAVE THE SAME FEATURES AS SPECTACLES; CONTACT LENSES
    • G02C7/00—Optical parts
    • G02C7/10—Filters, e.g. for facilitating adaptation of the eyes to the dark; Sunglasses
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/40—Thermal treatment, e.g. annealing in the presence of a solvent vapour
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/60—Forming conductive regions or layers, e.g. electrodes
    • G—PHYSICS
    • G02—OPTICS
    • G02C—SPECTACLES; SUNGLASSES OR GOGGLES INSOFAR AS THEY HAVE THE SAME FEATURES AS SPECTACLES; CONTACT LENSES
    • G02C2200/00—Generic mechanical aspects applicable to one or more of the groups G02C1/00 - G02C5/00 and G02C9/00 - G02C13/00 and their subgroups
    • G02C2200/02—Magnetic means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Ophthalmology & Optometry (AREA)
  • Optics & Photonics (AREA)
  • General Physics & Mathematics (AREA)
  • General Health & Medical Sciences (AREA)
  • Physical Vapour Deposition (AREA)
  • Electroluminescent Light Sources (AREA)
TW093103561A 2003-07-17 2004-02-13 Manufacturing method and manufacturing apparatus of organic thin film TW200505280A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003276262A JP4013859B2 (ja) 2003-07-17 2003-07-17 有機薄膜の製造装置

Publications (1)

Publication Number Publication Date
TW200505280A true TW200505280A (en) 2005-02-01

Family

ID=32040898

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093103561A TW200505280A (en) 2003-07-17 2004-02-13 Manufacturing method and manufacturing apparatus of organic thin film

Country Status (5)

Country Link
US (1) US20050011443A1 (zh)
JP (1) JP4013859B2 (zh)
KR (1) KR100826743B1 (zh)
GB (1) GB2403955B (zh)
TW (1) TW200505280A (zh)

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JP2004014311A (ja) * 2002-06-07 2004-01-15 Sony Corp 有機薄膜の形成方法
JP2006225757A (ja) * 2005-01-21 2006-08-31 Mitsubishi Heavy Ind Ltd 真空蒸着装置
JP4673190B2 (ja) * 2005-11-01 2011-04-20 長州産業株式会社 薄膜堆積用分子線源とその分子線量制御方法
KR20080019808A (ko) * 2006-08-29 2008-03-05 주성엔지니어링(주) 유기 박막 증착 장치 및 방법
JP2009149916A (ja) * 2006-09-14 2009-07-09 Ulvac Japan Ltd 真空蒸気処理装置
JP5173175B2 (ja) * 2006-09-29 2013-03-27 東京エレクトロン株式会社 蒸着装置
KR20080045974A (ko) * 2006-11-21 2008-05-26 삼성전자주식회사 박막 증착장치 및 박막 증착방법
WO2008117690A1 (ja) * 2007-03-26 2008-10-02 Ulvac, Inc. 蒸着源、蒸着装置、成膜方法
KR101128747B1 (ko) * 2007-09-10 2012-03-23 가부시키가이샤 알박 유기 박막 제조 방법
JP5297046B2 (ja) * 2008-01-16 2013-09-25 キヤノントッキ株式会社 成膜装置
KR101060652B1 (ko) 2008-04-14 2011-08-31 엘아이지에이디피 주식회사 유기물 증착장치 및 이를 이용한 증착 방법
US20090267891A1 (en) * 2008-04-25 2009-10-29 Bamidele Ali Virtual paper
KR101499228B1 (ko) * 2008-12-08 2015-03-05 삼성디스플레이 주식회사 증착 장치 및 증착 방법
JP5395478B2 (ja) * 2009-03-18 2014-01-22 株式会社半導体エネルギー研究所 製造装置
JP5452178B2 (ja) * 2009-11-12 2014-03-26 株式会社日立ハイテクノロジーズ 真空蒸着装置、真空蒸着方法、および、有機ｅｌ表示装置の製造方法
CN102115869B (zh) * 2009-12-31 2013-11-20 鸿富锦精密工业（深圳）有限公司 镀膜装置
KR101019947B1 (ko) * 2010-06-10 2011-03-09 에스엔유 프리시젼 주식회사 유기 반도체 제조장치
KR101198039B1 (ko) * 2010-09-20 2012-11-06 에스엔유 프리시젼 주식회사 모노머 증착장치 및 모노머 증착장치의 배기방법
WO2012053532A1 (ja) * 2010-10-20 2012-04-26 株式会社アルバック 有機膜形成装置及び有機膜形成方法
CN102477545B (zh) * 2010-11-23 2015-04-15 北京北方微电子基地设备工艺研究中心有限责任公司 进气装置和具有它的等离子体化学气相沉积设备
WO2012077590A1 (ja) * 2010-12-09 2012-06-14 株式会社アルバック 有機薄膜形成装置
JP5511767B2 (ja) * 2011-10-27 2014-06-04 東京エレクトロン株式会社 蒸着装置
KR101959975B1 (ko) * 2012-07-10 2019-07-16 삼성디스플레이 주식회사 유기층 증착 장치, 이를 이용한 유기 발광 디스플레이 장치의 제조 방법 및 이에 따라 제조된 유기 발광 디스플레이 장치
EP2747122B1 (en) * 2012-12-20 2019-07-03 Applied Materials, Inc. Plasma enhanced deposition arrangement for evaporation of dielectric materials, deposition apparatus and methods of operating thereof
CN105765101A (zh) * 2013-11-16 2016-07-13 纽升股份有限公司 用于监测真空反应器设备中的硒蒸气的方法
KR102231490B1 (ko) * 2014-09-02 2021-03-25 삼성디스플레이 주식회사 유기 전계 발광 소자
KR101932943B1 (ko) * 2014-12-05 2018-12-27 어플라이드 머티어리얼스, 인코포레이티드 재료 증착 시스템 및 재료 증착 시스템에서 재료를 증착하기 위한 방법
CN104561905B (zh) * 2014-12-29 2017-07-14 昆山国显光电有限公司 一种线性蒸发源
CN106222626A (zh) * 2016-09-06 2016-12-14 中山瑞科新能源有限公司 一种高效率的进片与抽气装置
DE102017109249B4 (de) * 2017-04-28 2022-08-11 VON ARDENNE Asset GmbH & Co. KG Feststoffpartikel-Quelle, Prozessieranordnung und Verfahren
US11168394B2 (en) 2018-03-14 2021-11-09 CeeVeeTech, LLC Method and apparatus for making a vapor of precise concentration by sublimation
JP7129280B2 (ja) * 2018-08-28 2022-09-01 株式会社カネカ ガスキャリア蒸着装置
CN113957390B (zh) * 2020-07-21 2024-03-08 宝山钢铁股份有限公司 一种具有气垫缓冲腔的真空镀膜装置
CN113957389B (zh) * 2020-07-21 2023-08-11 宝山钢铁股份有限公司 一种具有多孔降噪及均匀化分配金属蒸汽的真空镀膜装置
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Also Published As

Publication number Publication date
GB2403955B (en) 2006-05-24
GB2403955A (en) 2005-01-19
JP2005036296A (ja) 2005-02-10
US20050011443A1 (en) 2005-01-20
GB0403645D0 (en) 2004-03-24
KR100826743B1 (ko) 2008-04-30
JP4013859B2 (ja) 2007-11-28
KR20050010470A (ko) 2005-01-27

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