TW200428486A - Substrate treatment device - Google Patents
Substrate treatment device Download PDFInfo
- Publication number
- TW200428486A TW200428486A TW093110254A TW93110254A TW200428486A TW 200428486 A TW200428486 A TW 200428486A TW 093110254 A TW093110254 A TW 093110254A TW 93110254 A TW93110254 A TW 93110254A TW 200428486 A TW200428486 A TW 200428486A
- Authority
- TW
- Taiwan
- Prior art keywords
- substrate
- conveying
- nozzle
- nozzles
- supplied
- Prior art date
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 101
- 238000012545 processing Methods 0.000 claims abstract description 54
- 230000003028 elevating effect Effects 0.000 claims abstract 2
- 239000007788 liquid Substances 0.000 claims description 42
- 238000012546 transfer Methods 0.000 abstract description 2
- 239000002904 solvent Substances 0.000 abstract 1
- 238000011084 recovery Methods 0.000 description 11
- 238000005406 washing Methods 0.000 description 4
- 238000004140 cleaning Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000011010 flushing procedure Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000011144 upstream manufacturing Methods 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 230000002411 adverse Effects 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 238000013459 approach Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67706—Mechanical details, e.g. roller, belt
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Cleaning By Liquid Or Steam (AREA)
- Spray Control Apparatus (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003108949A JP3995044B2 (ja) | 2003-04-14 | 2003-04-14 | 基板処理装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200428486A true TW200428486A (en) | 2004-12-16 |
| TWI335616B TWI335616B (enrdf_load_stackoverflow) | 2011-01-01 |
Family
ID=33470263
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW093110254A TW200428486A (en) | 2003-04-14 | 2004-04-13 | Substrate treatment device |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP3995044B2 (enrdf_load_stackoverflow) |
| KR (1) | KR20040089561A (enrdf_load_stackoverflow) |
| TW (1) | TW200428486A (enrdf_load_stackoverflow) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4849914B2 (ja) * | 2006-03-13 | 2012-01-11 | 東京エレクトロン株式会社 | 基板処理装置、基板処理方法、コンピュータ読取可能な記憶媒体 |
| JP4824723B2 (ja) * | 2008-06-17 | 2011-11-30 | 東京エレクトロン株式会社 | 基板処理装置及び基板処理方法 |
| JP5303231B2 (ja) * | 2008-09-30 | 2013-10-02 | 東京応化工業株式会社 | 塗布装置 |
| CN108015024B (zh) * | 2017-12-01 | 2021-03-05 | 浙江德尔威工程机械设备有限公司 | 一种玻璃清洗装置 |
-
2003
- 2003-04-14 JP JP2003108949A patent/JP3995044B2/ja not_active Expired - Fee Related
-
2004
- 2004-04-12 KR KR1020040024825A patent/KR20040089561A/ko not_active Withdrawn
- 2004-04-13 TW TW093110254A patent/TW200428486A/zh not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| TWI335616B (enrdf_load_stackoverflow) | 2011-01-01 |
| JP3995044B2 (ja) | 2007-10-24 |
| JP2004313872A (ja) | 2004-11-11 |
| KR20040089561A (ko) | 2004-10-21 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |