KR20040089561A - 기판 처리장치 - Google Patents

기판 처리장치 Download PDF

Info

Publication number
KR20040089561A
KR20040089561A KR1020040024825A KR20040024825A KR20040089561A KR 20040089561 A KR20040089561 A KR 20040089561A KR 1020040024825 A KR1020040024825 A KR 1020040024825A KR 20040024825 A KR20040024825 A KR 20040024825A KR 20040089561 A KR20040089561 A KR 20040089561A
Authority
KR
South Korea
Prior art keywords
substrate
supply
processing apparatus
conveying
nozzles
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR1020040024825A
Other languages
English (en)
Korean (ko)
Inventor
시마이후토시
가와타시게루
Original Assignee
도쿄 오카 고교 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 도쿄 오카 고교 가부시키가이샤 filed Critical 도쿄 오카 고교 가부시키가이샤
Publication of KR20040089561A publication Critical patent/KR20040089561A/ko
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Spray Control Apparatus (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
KR1020040024825A 2003-04-14 2004-04-12 기판 처리장치 Withdrawn KR20040089561A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2003108949A JP3995044B2 (ja) 2003-04-14 2003-04-14 基板処理装置
JPJP-P-2003-00108949 2003-04-14

Publications (1)

Publication Number Publication Date
KR20040089561A true KR20040089561A (ko) 2004-10-21

Family

ID=33470263

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020040024825A Withdrawn KR20040089561A (ko) 2003-04-14 2004-04-12 기판 처리장치

Country Status (3)

Country Link
JP (1) JP3995044B2 (enrdf_load_stackoverflow)
KR (1) KR20040089561A (enrdf_load_stackoverflow)
TW (1) TW200428486A (enrdf_load_stackoverflow)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4849914B2 (ja) * 2006-03-13 2012-01-11 東京エレクトロン株式会社 基板処理装置、基板処理方法、コンピュータ読取可能な記憶媒体
JP4824723B2 (ja) * 2008-06-17 2011-11-30 東京エレクトロン株式会社 基板処理装置及び基板処理方法
JP5303231B2 (ja) * 2008-09-30 2013-10-02 東京応化工業株式会社 塗布装置
CN108015024B (zh) * 2017-12-01 2021-03-05 浙江德尔威工程机械设备有限公司 一种玻璃清洗装置

Also Published As

Publication number Publication date
TWI335616B (enrdf_load_stackoverflow) 2011-01-01
JP3995044B2 (ja) 2007-10-24
TW200428486A (en) 2004-12-16
JP2004313872A (ja) 2004-11-11

Similar Documents

Publication Publication Date Title
KR100671251B1 (ko) 기판 처리 장치
KR100500170B1 (ko) 기판의 수평 및 상하 이송장치
US4938257A (en) Printed circuit cleaning apparatus
JP5841449B2 (ja) 拭き取りパッド及びこのパッドを用いたノズルメンテナンス装置並びに塗布処理装置
TWI343088B (enrdf_load_stackoverflow)
JP2007007639A (ja) 塗布方法及び塗布装置
JP2012160735A (ja) 塗布方法及び塗布装置
KR20040089561A (ko) 기판 처리장치
US5378307A (en) Fluid treatment apparatus
TW548697B (en) Substrate processing device
CN100470754C (zh) 基板的输送装置以及输送方法
JP3579348B2 (ja) 傾斜式液切り装置
JP2004174308A (ja) 板材の洗浄設備
KR20110010064A (ko) 기판 반송 장치
JP2000286320A (ja) 基板搬送装置
KR100899363B1 (ko) 기판의 경사조절장치
JP4046697B2 (ja) 両面エッチングシステム
JP3865978B2 (ja) 基板処理装置
JP2001102283A5 (enrdf_load_stackoverflow)
JP4043410B2 (ja) インライン式現像処理装置
JPH0453023Y2 (enrdf_load_stackoverflow)
JP4005462B2 (ja) 搬送式基板処理装置
JPH0764091A (ja) ラビング処理後の角形基板の洗浄方法並びに洗浄装置
KR102194739B1 (ko) 기판들의 하측면을 습윤 처리하기 위한 장치
JPH06112118A (ja) 処理液塗布装置

Legal Events

Date Code Title Description
PA0109 Patent application

Patent event code: PA01091R01D

Comment text: Patent Application

Patent event date: 20040412

PG1501 Laying open of application
PC1203 Withdrawal of no request for examination
WITN Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid