JPH0453023Y2 - - Google Patents
Info
- Publication number
- JPH0453023Y2 JPH0453023Y2 JP9235987U JP9235987U JPH0453023Y2 JP H0453023 Y2 JPH0453023 Y2 JP H0453023Y2 JP 9235987 U JP9235987 U JP 9235987U JP 9235987 U JP9235987 U JP 9235987U JP H0453023 Y2 JPH0453023 Y2 JP H0453023Y2
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- circuit board
- liquid
- spray
- etching
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000007788 liquid Substances 0.000 claims description 28
- 239000007921 spray Substances 0.000 claims description 25
- 238000005406 washing Methods 0.000 claims description 8
- 238000005507 spraying Methods 0.000 claims description 4
- 238000005096 rolling process Methods 0.000 claims description 2
- 238000005530 etching Methods 0.000 description 17
- 239000000758 substrate Substances 0.000 description 11
- 238000010586 diagram Methods 0.000 description 7
- 230000018109 developmental process Effects 0.000 description 4
- 238000011282 treatment Methods 0.000 description 4
- 239000000243 solution Substances 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 230000007547 defect Effects 0.000 description 1
- 238000005238 degreasing Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000006386 neutralization reaction Methods 0.000 description 1
- 238000011017 operating method Methods 0.000 description 1
- 238000005554 pickling Methods 0.000 description 1
- 230000007261 regionalization Effects 0.000 description 1
Landscapes
- Physical Or Chemical Processes And Apparatus (AREA)
- ing And Chemical Polishing (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9235987U JPH0453023Y2 (enrdf_load_stackoverflow) | 1987-06-16 | 1987-06-16 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9235987U JPH0453023Y2 (enrdf_load_stackoverflow) | 1987-06-16 | 1987-06-16 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63201374U JPS63201374U (enrdf_load_stackoverflow) | 1988-12-26 |
| JPH0453023Y2 true JPH0453023Y2 (enrdf_load_stackoverflow) | 1992-12-14 |
Family
ID=30953997
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9235987U Expired JPH0453023Y2 (enrdf_load_stackoverflow) | 1987-06-16 | 1987-06-16 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0453023Y2 (enrdf_load_stackoverflow) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013140934A (ja) * | 2012-01-04 | 2013-07-18 | Samsung Electro-Mechanics Co Ltd | 垂直移送治具及びこれを用いた湿式処理装置 |
-
1987
- 1987-06-16 JP JP9235987U patent/JPH0453023Y2/ja not_active Expired
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013140934A (ja) * | 2012-01-04 | 2013-07-18 | Samsung Electro-Mechanics Co Ltd | 垂直移送治具及びこれを用いた湿式処理装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63201374U (enrdf_load_stackoverflow) | 1988-12-26 |
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