TW200421506A - Wire bonding method - Google Patents

Wire bonding method Download PDF

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Publication number
TW200421506A
TW200421506A TW092135143A TW92135143A TW200421506A TW 200421506 A TW200421506 A TW 200421506A TW 092135143 A TW092135143 A TW 092135143A TW 92135143 A TW92135143 A TW 92135143A TW 200421506 A TW200421506 A TW 200421506A
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TW
Taiwan
Prior art keywords
conductor
capillary
bonding
lead
inclined wedge
Prior art date
Application number
TW092135143A
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English (en)
Chinese (zh)
Other versions
TWI300601B (enExample
Inventor
Tatsunari Mii
Hiroshi Watanabe
Original Assignee
Shinkawa Kk
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Publication date
Application filed by Shinkawa Kk filed Critical Shinkawa Kk
Publication of TW200421506A publication Critical patent/TW200421506A/zh
Application granted granted Critical
Publication of TWI300601B publication Critical patent/TWI300601B/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004—Wire welding
    • A—HUMAN NECESSITIES
    • A01—AGRICULTURE; FORESTRY; ANIMAL HUSBANDRY; HUNTING; TRAPPING; FISHING
    • A01K—ANIMAL HUSBANDRY; AVICULTURE; APICULTURE; PISCICULTURE; FISHING; REARING OR BREEDING ANIMALS, NOT OTHERWISE PROVIDED FOR; NEW BREEDS OF ANIMALS
    • A01K13/00—Devices for grooming or caring of animals, e.g. curry-combs; Fetlock rings; Tail-holders; Devices for preventing crib-biting; Washing devices; Protection against weather conditions or insects
    • A01K13/001—Washing, cleaning, or drying devices
    • A—HUMAN NECESSITIES
    • A46—BRUSHWARE
    • A46B—BRUSHES
    • A46B9/00—Arrangements of the bristles in the brush body
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    • A46B9/04—Arranged like in or for toothbrushes
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    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
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    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
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    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
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    • H01L2924/15787—Ceramics, e.g. crystalline carbides, nitrides or oxides

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  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Environmental Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Animal Husbandry (AREA)
  • Biodiversity & Conservation Biology (AREA)
  • Zoology (AREA)
  • Animal Behavior & Ethology (AREA)
  • Wire Bonding (AREA)
TW092135143A 2003-02-17 2003-12-12 Wire bonding method TW200421506A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003038314A JP2004247674A (ja) 2003-02-17 2003-02-17 ワイヤボンディング方法

Publications (2)

Publication Number Publication Date
TW200421506A true TW200421506A (en) 2004-10-16
TWI300601B TWI300601B (enExample) 2008-09-01

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Family Applications (1)

Application Number Title Priority Date Filing Date
TW092135143A TW200421506A (en) 2003-02-17 2003-12-12 Wire bonding method

Country Status (4)

Country Link
US (1) US7025247B2 (enExample)
JP (1) JP2004247674A (enExample)
KR (1) KR20040074914A (enExample)
TW (1) TW200421506A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI827950B (zh) * 2020-07-15 2024-01-01 日商新川股份有限公司 打線接合裝置及半導體裝置的製造方法

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US7188759B2 (en) * 2004-09-08 2007-03-13 Kulicke And Soffa Industries, Inc. Methods for forming conductive bumps and wire loops
JP4137061B2 (ja) * 2005-01-11 2008-08-20 株式会社カイジョー ワイヤループ形状、そのワイヤループ形状を備えた半導体装置、ワイヤボンディング方法
JP4298665B2 (ja) * 2005-02-08 2009-07-22 株式会社新川 ワイヤボンディング方法
KR20060091622A (ko) * 2005-02-16 2006-08-21 삼성테크윈 주식회사 와이어 본딩 방법
US20070216026A1 (en) * 2006-03-20 2007-09-20 Adams Zhu Aluminum bump bonding for fine aluminum wire
JP4694405B2 (ja) * 2006-04-12 2011-06-08 ローム株式会社 ワイヤボンディング方法
US20090042339A1 (en) * 2007-08-10 2009-02-12 Texas Instruments Incorporated Packaged integrated circuits and methods to form a packaged integrated circuit
JP4625858B2 (ja) * 2008-09-10 2011-02-02 株式会社カイジョー ワイヤボンディング方法、ワイヤボンディング装置及びワイヤボンディング制御プログラム
KR101610827B1 (ko) 2009-12-03 2016-04-08 삼성전자주식회사 본딩 구조물의 형성 방법
JP5359977B2 (ja) * 2010-04-12 2013-12-04 株式会社デンソー ワイヤボンディング方法
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