JP2004247674A - ワイヤボンディング方法 - Google Patents

ワイヤボンディング方法 Download PDF

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Publication number
JP2004247674A
JP2004247674A JP2003038314A JP2003038314A JP2004247674A JP 2004247674 A JP2004247674 A JP 2004247674A JP 2003038314 A JP2003038314 A JP 2003038314A JP 2003038314 A JP2003038314 A JP 2003038314A JP 2004247674 A JP2004247674 A JP 2004247674A
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JP
Japan
Prior art keywords
wire
bump
bonding
conductor
capillary
Prior art date
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Pending
Application number
JP2003038314A
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English (en)
Japanese (ja)
Inventor
Tatsunari Mitsui
竜成 三井
Koji Watanabe
広司 渡辺
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinkawa Ltd
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Shinkawa Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Ltd filed Critical Shinkawa Ltd
Priority to JP2003038314A priority Critical patent/JP2004247674A/ja
Priority to TW092135143A priority patent/TW200421506A/zh
Priority to KR1020040000474A priority patent/KR20040074914A/ko
Priority to US10/781,188 priority patent/US7025247B2/en
Publication of JP2004247674A publication Critical patent/JP2004247674A/ja
Pending legal-status Critical Current

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    • A—HUMAN NECESSITIES
    • A01—AGRICULTURE; FORESTRY; ANIMAL HUSBANDRY; HUNTING; TRAPPING; FISHING
    • A01K—ANIMAL HUSBANDRY; AVICULTURE; APICULTURE; PISCICULTURE; FISHING; REARING OR BREEDING ANIMALS, NOT OTHERWISE PROVIDED FOR; NEW BREEDS OF ANIMALS
    • A01K13/00—Devices for grooming or caring of animals, e.g. curry-combs; Fetlock rings; Tail-holders; Devices for preventing crib-biting; Washing devices; Protection against weather conditions or insects
    • A01K13/001—Washing, cleaning, or drying devices
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    • H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004—Wire welding
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    • A46—BRUSHWARE
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    • A46B9/04—Arranged like in or for toothbrushes
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  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Environmental Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Animal Husbandry (AREA)
  • Biodiversity & Conservation Biology (AREA)
  • Zoology (AREA)
  • Animal Behavior & Ethology (AREA)
  • Wire Bonding (AREA)
JP2003038314A 2003-02-17 2003-02-17 ワイヤボンディング方法 Pending JP2004247674A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2003038314A JP2004247674A (ja) 2003-02-17 2003-02-17 ワイヤボンディング方法
TW092135143A TW200421506A (en) 2003-02-17 2003-12-12 Wire bonding method
KR1020040000474A KR20040074914A (ko) 2003-02-17 2004-01-06 와이어본딩 방법
US10/781,188 US7025247B2 (en) 2003-02-17 2004-02-17 Wire bonding method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003038314A JP2004247674A (ja) 2003-02-17 2003-02-17 ワイヤボンディング方法

Publications (1)

Publication Number Publication Date
JP2004247674A true JP2004247674A (ja) 2004-09-02

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Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003038314A Pending JP2004247674A (ja) 2003-02-17 2003-02-17 ワイヤボンディング方法

Country Status (4)

Country Link
US (1) US7025247B2 (enExample)
JP (1) JP2004247674A (enExample)
KR (1) KR20040074914A (enExample)
TW (1) TW200421506A (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007281389A (ja) * 2006-04-12 2007-10-25 Rohm Co Ltd ワイヤボンディング方法
JP2010067786A (ja) * 2008-09-10 2010-03-25 Kaijo Corp ワイヤボンディング方法、ワイヤボンディング装置及びワイヤボンディング制御プログラム
JP2011222813A (ja) * 2010-04-12 2011-11-04 Denso Corp ワイヤボンディング方法

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7188759B2 (en) * 2004-09-08 2007-03-13 Kulicke And Soffa Industries, Inc. Methods for forming conductive bumps and wire loops
JP4137061B2 (ja) * 2005-01-11 2008-08-20 株式会社カイジョー ワイヤループ形状、そのワイヤループ形状を備えた半導体装置、ワイヤボンディング方法
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US7025247B2 (en) 2006-04-11

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