JP2004247674A - ワイヤボンディング方法 - Google Patents

ワイヤボンディング方法 Download PDF

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Publication number
JP2004247674A
JP2004247674A JP2003038314A JP2003038314A JP2004247674A JP 2004247674 A JP2004247674 A JP 2004247674A JP 2003038314 A JP2003038314 A JP 2003038314A JP 2003038314 A JP2003038314 A JP 2003038314A JP 2004247674 A JP2004247674 A JP 2004247674A
Authority
JP
Japan
Prior art keywords
wire
bump
bonding
conductor
capillary
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2003038314A
Other languages
English (en)
Japanese (ja)
Inventor
Tatsunari Mitsui
竜成 三井
Koji Watanabe
広司 渡辺
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinkawa Ltd
Original Assignee
Shinkawa Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Ltd filed Critical Shinkawa Ltd
Priority to JP2003038314A priority Critical patent/JP2004247674A/ja
Priority to TW092135143A priority patent/TW200421506A/zh
Priority to KR1020040000474A priority patent/KR20040074914A/ko
Priority to US10/781,188 priority patent/US7025247B2/en
Publication of JP2004247674A publication Critical patent/JP2004247674A/ja
Pending legal-status Critical Current

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Classifications

    • A—HUMAN NECESSITIES
    • A01—AGRICULTURE; FORESTRY; ANIMAL HUSBANDRY; HUNTING; TRAPPING; FISHING
    • A01K—ANIMAL HUSBANDRY; AVICULTURE; APICULTURE; PISCICULTURE; FISHING; REARING OR BREEDING ANIMALS, NOT OTHERWISE PROVIDED FOR; NEW BREEDS OF ANIMALS
    • A01K13/00—Devices for grooming or caring of animals, e.g. curry-combs; Fetlock rings; Tail-holders; Devices for preventing crib-biting; Washing devices; Protection against weather conditions or insects
    • A01K13/001—Washing, cleaning, or drying devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004—Wire welding
    • A—HUMAN NECESSITIES
    • A46—BRUSHWARE
    • A46B—BRUSHES
    • A46B9/00—Arrangements of the bristles in the brush body
    • A46B9/02—Position or arrangement of bristles in relation to surface of the brush body, e.g. inclined, in rows, in groups
    • A46B9/04—Arranged like in or for toothbrushes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/015—Manufacture or treatment of bond wires
    • H10W72/01551—Changing the shapes of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07511—Treating the bonding area before connecting, e.g. by applying flux or cleaning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07521—Aligning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/29—Bond pads specially adapted therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5434—Dispositions of bond wires the connected ends being on auxiliary connecting means on bond pads, e.g. on other bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/951—Materials of bond pads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Life Sciences & Earth Sciences (AREA)
  • Environmental Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Animal Behavior & Ethology (AREA)
  • Zoology (AREA)
  • Animal Husbandry (AREA)
  • Biodiversity & Conservation Biology (AREA)
  • Wire Bonding (AREA)
JP2003038314A 2003-02-17 2003-02-17 ワイヤボンディング方法 Pending JP2004247674A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2003038314A JP2004247674A (ja) 2003-02-17 2003-02-17 ワイヤボンディング方法
TW092135143A TW200421506A (en) 2003-02-17 2003-12-12 Wire bonding method
KR1020040000474A KR20040074914A (ko) 2003-02-17 2004-01-06 와이어본딩 방법
US10/781,188 US7025247B2 (en) 2003-02-17 2004-02-17 Wire bonding method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003038314A JP2004247674A (ja) 2003-02-17 2003-02-17 ワイヤボンディング方法

Publications (1)

Publication Number Publication Date
JP2004247674A true JP2004247674A (ja) 2004-09-02

Family

ID=32866387

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003038314A Pending JP2004247674A (ja) 2003-02-17 2003-02-17 ワイヤボンディング方法

Country Status (4)

Country Link
US (1) US7025247B2 (enExample)
JP (1) JP2004247674A (enExample)
KR (1) KR20040074914A (enExample)
TW (1) TW200421506A (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007281389A (ja) * 2006-04-12 2007-10-25 Rohm Co Ltd ワイヤボンディング方法
JP2010067786A (ja) * 2008-09-10 2010-03-25 Kaijo Corp ワイヤボンディング方法、ワイヤボンディング装置及びワイヤボンディング制御プログラム
JP2011222813A (ja) * 2010-04-12 2011-11-04 Denso Corp ワイヤボンディング方法

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7188759B2 (en) * 2004-09-08 2007-03-13 Kulicke And Soffa Industries, Inc. Methods for forming conductive bumps and wire loops
JP4137061B2 (ja) * 2005-01-11 2008-08-20 株式会社カイジョー ワイヤループ形状、そのワイヤループ形状を備えた半導体装置、ワイヤボンディング方法
JP4298665B2 (ja) * 2005-02-08 2009-07-22 株式会社新川 ワイヤボンディング方法
KR20060091622A (ko) * 2005-02-16 2006-08-21 삼성테크윈 주식회사 와이어 본딩 방법
US20070216026A1 (en) * 2006-03-20 2007-09-20 Adams Zhu Aluminum bump bonding for fine aluminum wire
US20090042339A1 (en) * 2007-08-10 2009-02-12 Texas Instruments Incorporated Packaged integrated circuits and methods to form a packaged integrated circuit
KR101610827B1 (ko) 2009-12-03 2016-04-08 삼성전자주식회사 본딩 구조물의 형성 방법
US9082753B2 (en) * 2013-11-12 2015-07-14 Invensas Corporation Severing bond wire by kinking and twisting
KR102621753B1 (ko) 2018-09-28 2024-01-05 삼성전자주식회사 본딩 와이어, 이를 포함하는 반도체 패키지, 및 와이어 본딩 방법
WO2022013955A1 (ja) * 2020-07-15 2022-01-20 株式会社新川 ワイヤボンディング装置及び半導体装置の製造方法
CN119725286A (zh) * 2023-09-28 2025-03-28 恩智浦美国有限公司 封装半导体装置和其制作方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5485949A (en) * 1993-04-30 1996-01-23 Matsushita Electric Industrial Co., Ltd. Capillary for a wire bonding apparatus and a method for forming an electric connection bump using the capillary
JP3344235B2 (ja) 1996-10-07 2002-11-11 株式会社デンソー ワイヤボンディング方法
JP3913134B2 (ja) * 2002-08-08 2007-05-09 株式会社カイジョー バンプの形成方法及びバンプ
JP3570551B2 (ja) 2001-03-16 2004-09-29 株式会社カイジョー ワイヤボンディング方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007281389A (ja) * 2006-04-12 2007-10-25 Rohm Co Ltd ワイヤボンディング方法
JP2010067786A (ja) * 2008-09-10 2010-03-25 Kaijo Corp ワイヤボンディング方法、ワイヤボンディング装置及びワイヤボンディング制御プログラム
JP2011222813A (ja) * 2010-04-12 2011-11-04 Denso Corp ワイヤボンディング方法

Also Published As

Publication number Publication date
TW200421506A (en) 2004-10-16
US7025247B2 (en) 2006-04-11
KR20040074914A (ko) 2004-08-26
US20040164127A1 (en) 2004-08-26
TWI300601B (enExample) 2008-09-01

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