TW200421506A - Wire bonding method - Google Patents

Wire bonding method Download PDF

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Publication number
TW200421506A
TW200421506A TW092135143A TW92135143A TW200421506A TW 200421506 A TW200421506 A TW 200421506A TW 092135143 A TW092135143 A TW 092135143A TW 92135143 A TW92135143 A TW 92135143A TW 200421506 A TW200421506 A TW 200421506A
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TW
Taiwan
Prior art keywords
conductor
capillary
bonding
lead
inclined wedge
Prior art date
Application number
TW092135143A
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English (en)
Other versions
TWI300601B (zh
Inventor
Tatsunari Mii
Hiroshi Watanabe
Original Assignee
Shinkawa Kk
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Publication date
Application filed by Shinkawa Kk filed Critical Shinkawa Kk
Publication of TW200421506A publication Critical patent/TW200421506A/zh
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Publication of TWI300601B publication Critical patent/TWI300601B/zh

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    • H—ELECTRICITY
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    • H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • A—HUMAN NECESSITIES
    • A01—AGRICULTURE; FORESTRY; ANIMAL HUSBANDRY; HUNTING; TRAPPING; FISHING
    • A01K—ANIMAL HUSBANDRY; AVICULTURE; APICULTURE; PISCICULTURE; FISHING; REARING OR BREEDING ANIMALS, NOT OTHERWISE PROVIDED FOR; NEW BREEDS OF ANIMALS
    • A01K13/00—Devices for grooming or caring of animals, e.g. curry-combs; Fetlock rings; Tail-holders; Devices for preventing crib-biting; Washing devices; Protection against weather conditions or insects
    • A01K13/001—Washing, cleaning, or drying devices
    • A—HUMAN NECESSITIES
    • A46—BRUSHWARE
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    • A46B9/04—Arranged like in or for toothbrushes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004—Wire welding
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  • Wire Bonding (AREA)

Description

200421506 玫、發明說明： [發明所屬之技術領域] 本發明係有關於二導體間進行打線的打線方法。 [先前技術] / 體上^成突塊於第2導體上之後，於第i導體與第2導 大塊間連接引線的打線方法而言，舉例 文獻 1及專利文獻2。 (專利文獻1) 曰本專利特開平10— 1 12471號公報 (專利文獻2) 曰本專利特開2002- 280410號公報 塊 =獻1’係於第2導體上進行焊球接合來形成突 於第#體相反側的位置對突塊進行其楔塊接合後 實成弧狀而上進行1次接合’接著自第1導體側將引線 脊成弧狀，而於突塊上進行2次接合。 專利文獻2,係在第2導體上進行 塊後，向上移動毛细瞢，i A+ 按《來形成犬 0…將前述毛細管移動至斑第丨 導體相反側的位置，再度向下移動前述毛細 。第1 楔塊後，於第1道M U A 、 S而开》成傾斜 才六兄俊於第i導體上進彳f1 體側將引線彎成弧肤，A1 , 4第1導 .成弧狀，而於前述突塊上 行2次接合。 ^㊉塊上進 [發明内容] 專利文獻1，係具有專利文獻2的【 的問題。在突塊形成後的楔塊接合及引線部的2所把載 ϋ ，亦即 200421506 曲面間的接合發生接合位置 , 偏移11 Μ，結果會發生引線 •号曲，並發生相鄰引線間的 J强觸又雖然可藉由將突堍 後的楔塊接合向後形成為彎 丐曲办狀來抑制引線尾部的發生 ’不過由於無法於引線與突 .L… 一大塊的接合中確保充分的傾斜及 干面，故無法防止引線盘$ # j 、大塊接合後所發生的引線與電路 基板的接觸、以及引線與配線間的接觸。 專利文獻2 ’係如盆申士主直4丨丨β阁始 ”甲δ月專利靶圍第2項及【0011】 欄所記载’於配線部上進行焊球接合，在使毛細管上昇後 =突塊的中心朝與第丨導體側相反的方向移動，此後再 又。下緊壓，藉毛細管的外壁面於突塊上形成傾斜模塊。 ❹’由於在傾斜楔塊上進行2次接合’故不會發生專利 文獻1的問題。 專利文獻2,由於係向下緊麼毛細管，藉毛細管的外 2面於犬塊上形成傾斜楔塊，故形成較專利讀i寬的傾 斜面及平面。不過，由於在突塊形成後，將毛細管向上移 動至引線部分之後，於突塊上形成前述傾斜楔塊，故並未 形成寬度較充分的平面。傾斜楔塊的面積狹小，則缺乏接 口的可罪性，並且’ 2次接合的引線容易歪曲，而盔法獲 得穩定的引線弧。 本發明的課題在於提供纟突塊上形Μ寬廣的傾斜模 塊並獲得接合可靠性提高且穩定的引線弧的打線方法。 用來解決上述問題的本發明為一種打線方法，係在第 1導體上進行1次接合後，力第2導體上進行2次接合， 乂於4第1導體與第2導體間進行打線者；其特徵在於： 200421506 β於該f 2㈣上進行焊球接合來形成突塊，使毛細管 上昇至突塊形成時擠入該毛細管貫通孔而形成的缺口部分 的高度以内，然後使毛細管朝與該第1導體側相反的方向 移動，接著下降毛細管並形成傾斜楔塊之後切斷引線，此 後於該第i導體進行該i次接合，接著自該第1導體側將 引線彎成弧狀，並於該突塊上部之傾斜楔塊上進行該2次 接合。 [實施方式] 錄藉第1圖及第2圖來說明本發明一實施形態之打線 方法。第2⑻圖係表示使用本發明—實施形態之打線方法 於晶片與配線間進行打線之狀態之一例。於陶瓷基板或印 =基板等基板或導線架等所構成的電路基i上安裝形成 焊墊2a的晶片2。又於電路基板i上形成配線3。於配線 3 士形成突塊1〇，引線4連接於焊墊2a與突塊1〇間。5 表不供引線4插穿的毛細管。 其次，第2(b)圖所示之打線藉由以下之步驟進行。首 先如第1 (a)圖所示，藉未圖示之電焊槍於插穿毛細管5 的貫通孔5a的引線4前端形成焊球4a。其次如帛ι⑻圖 所不’下降毛細管5，於配線3上進行焊球接合。 糟此，焊球4a的一部份擠入貫通孔5a内，於突塊1〇 5上形成缺二部> 11。接著如第1⑷圖所示，使毛細管上昇 5，使毛細管5下端的端緣部5b位在缺口部分1 1的高度 以内。 其次，如第1(d)圖所示，沿與焊墊2a側（參考第2(b) 200421506 圖）相反的方向傾斜向下移 示，下降毛細管5,藉該毛妾者如第1⑷圖所 成傾斜楔塊12,使毛細管的下端面在突塊1〇上形 於以革έS上歼5而切斷引線4。如此，由 ，、：官5的端緣部5b橫向緊麼缺口部分u之後下降 塊1〇上形成傾斜楔塊12 坦的傾斜楔塊U。 X回積更大且千 其第職示，藉電谭搶於引線4前端形成谭 衣4b °接者如第2(a)圖 墊“ 使毛細官5位於晶片2的焊 ^ 仃人接合。其次如第2⑻圖所*，進行引線4 ㈠成弧狀，使引線4位於突塊1〇的傾斜楔塊12上部， 於^棋塊12上對引線4進行2次接合後切斷引線*。 第3圖係表示使用本發明—實施形態的打線方法於晶 二配線間進行打線的狀態之另一例。於前述實施形態中 、’形成突塊1G於配線3上’在焊墊2a上進行ι次接合， 並在突塊U)上的傾斜楔塊12進行2次接合。於第^的 情形’藉由第1(a)至第i⑷圖的步驟，在焊塾2&上形成突 塊1〇,於配線3側的相反側形成突塊1〇上的傾斜椒塊Μ 。，且’藉由帛2⑷及第2⑻圖的步驟，於配線3上進行 1次接合’並在突塊10上的傾斜楔塊12進行2次接合後 切斷引線4 ° #即’於第1圖及第2圖的情形’焊塾2a係 成為第冑體’配線3係成為第2導體。於第3圖的情心 ，配線3係成為第1導體，焊墊2a係成為第2導體。 本發明之打線方法，由於係在第1導體上進行i次接 合後，於第2導體上進行2次接合，以於該第1導體與該 200421506 第2導體間進行打線者；於該、 形成突塊，使毛細管^ —上進行焊球接合來 孔而形成的缺口部分的：穴塊形成時擠入該毛細管貫通 1 ^ ^ /i,l i 、回又以内，然後使毛細管朝與該第 _ / ’目的方向移動，接著在下降毛細管並形成傾斜 1之後切斷引線，此後於該第1導體進行該1次接合， 接著自β帛1導體側將引線彎成弧狀，而於該突塊上部的 傾斜模塊上進行該2次接合，故在突塊上形成更寬廣的傾 斜楔塊，並獲得接合可靠性提高且穩定的引線弧。 【圖式簡單說明】 (一）圖式部分 第1 (a)〜（f)圖係表示本發明一實施形態的打線方法的 步驟圖。 第2(a)、（b)圖係表示第1圖的後續步驟的步驟圖。 第3圖係表示使用本發明一實施形態的打線方法於晶 片與配線間進行打線的狀態之一例。 (二）元件代表符號 1 電路基板 2 晶片 2a 焊墊 3 配線 4 引線 4a ' 4b 焊球 5 毛細管 5a 貫通孔 200421506 5b 端緣部 10 突塊 11 缺口部分 12 傾斜楔塊
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Claims (1)

  1. 200421506 拾、申請專利範圍： 1 · 一種打線方法，係在第1導體上進行1次接合 罘2導體上進行2次接合，以於該第丨導體與第2導體 間進行打線者；其特徵在於： 上曰於該第2導體上進行焊球接合來形成突塊，使毛細管 二：至突塊形成時擠入該毛細管貫通孔而形成的缺口部分 移：度以内’然後使毛細管朝與該第1導體側相反的方向 著下降毛細管並形成傾斜楔塊之後切斷引線，此 引線：：1導體進行該1次接合，接著自該第1導體側將 k L 、弧狀，並於該突塊上部之傾斜楔塊上進行該2次 拾壹、囷式： 如次頁 12
TW092135143A 2003-02-17 2003-12-12 Wire bonding method TW200421506A (en)

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