TWI300601B - - Google Patents

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Publication number
TWI300601B
TWI300601B TW092135143A TW92135143A TWI300601B TW I300601 B TWI300601 B TW I300601B TW 092135143 A TW092135143 A TW 092135143A TW 92135143 A TW92135143 A TW 92135143A TW I300601 B TWI300601 B TW I300601B
Authority
TW
Taiwan
Prior art keywords
capillary
conductor
lead
hole
solder ball
Prior art date
Application number
TW092135143A
Other languages
English (en)
Other versions
TW200421506A (en
Original Assignee
Shinkawa Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Kk filed Critical Shinkawa Kk
Publication of TW200421506A publication Critical patent/TW200421506A/zh
Application granted granted Critical
Publication of TWI300601B publication Critical patent/TWI300601B/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • A—HUMAN NECESSITIES
    • A01—AGRICULTURE; FORESTRY; ANIMAL HUSBANDRY; HUNTING; TRAPPING; FISHING
    • A01K—ANIMAL HUSBANDRY; AVICULTURE; APICULTURE; PISCICULTURE; FISHING; REARING OR BREEDING ANIMALS, NOT OTHERWISE PROVIDED FOR; NEW BREEDS OF ANIMALS
    • A01K13/00—Devices for grooming or caring of animals, e.g. curry-combs; Fetlock rings; Tail-holders; Devices for preventing crib-biting; Washing devices; Protection against weather conditions or insects
    • A01K13/001—Washing, cleaning, or drying devices
    • A—HUMAN NECESSITIES
    • A46—BRUSHWARE
    • A46B—BRUSHES
    • A46B9/00—Arrangements of the bristles in the brush body
    • A46B9/02—Position or arrangement of bristles in relation to surface of the brush body, e.g. inclined, in rows, in groups
    • A46B9/04—Arranged like in or for toothbrushes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004—Wire welding
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    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Environmental Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Zoology (AREA)
  • Animal Husbandry (AREA)
  • Biodiversity & Conservation Biology (AREA)
  • Animal Behavior & Ethology (AREA)
  • Wire Bonding (AREA)

Description

1300601 狄、發明說明： [發明所屬之技術領域] 本發明係有關於二導體間推 [先前技術]導—的打線方法。 在形成突塊於第2導體上之後，於導 體上的突塊間連接引線的打線 丨及專利文獻2。 ㈣線方法而舉例如專利文獻 (專利文獻1) 日本專利特開平10— 1 12471號公報 (專利文獻2) 曰本專利特開2002— 280410號公報 塊 =文獻1’係於第2導體上進行焊球接合來形成突 導體相反側的位置對突塊進行其楔塊接合後 彎二 進们次接合，接著自第1導體側將引線 弩成弧狀，而於突塊上進行2次接合。 =文獻2,係在帛2㈣上進行焊球接合來形成突 導"，：上移動毛細管，其次將前述毛細管移動至與第1 ^ 再度向下移動前述毛細管而形成傾斜 模塊後’於第1導體上進行1次接合，接著自前述第i導 體彎成弧狀，而於前述突塊上部的傾斜楔 灯2次接合。 [發明内容] 的門Γ】^1，係具有專利文獻2❾【_】搁所記載 的㈣。在突塊形成後的楔塊接合及引線部的接合，亦即 1300601 曲面間的接合發生接合位置偏移情形下，結果會發生引線 :,曲’並發生相鄰引線間的接觸。又，雖然可藉由將突塊 後的楔塊接合向後形成為彎曲形狀來抑制引線尾部的發生 ，不過由於無法於引線與突塊的接合中確保充分的傾斜及 平面’故無法防止引線與突塊接合後所發生的引線與電路 基板的接觸、以及引線與配線間的接觸。 專利文獻2,係如其申請專利範圍第2項及【〇〇11】 攔所記載，於配線部上進行焊球接合，在使毛細管上昇後 ，自突塊的中心朝與第丨導體側相反的方向移動，此後再 度向下緊壓，藉毛細管的外壁面於突塊上形成傾斜楔塊。 接著’由於在傾斜楔塊上進# 2次接合，故不會發生專利 文獻1的問題。 專利文獻2,由於係向下緊壓毛細管，藉毛細管的外 壁面於突塊上形成傾斜楔塊’故形成較專利城ι寬的傾 斜面及平面。不過’由於在突塊形成後，將毛細管向上移 動至：線邛为之後，於突塊上形成前述傾斜楔塊，故並未 形成寬度較充分的平面。傾斜楔塊的面積狹小，則缺乏接 口的可#性’並且’ 2次接合的引線容易歪曲，而盔 得穩定的引線弧i …、獲 本發明的課題在於提供在突塊上形成更寬廣的傾斜換 塊，並獲得接合可靠性提高且穩定的51線弧的打線方法。 用來解決上述問題的本發明為一種打線方法，係在第 1導體上進行1次接合後’於第2導體上進行2次接合， 以於該第i導體與第2導體間進行打線者；其特徵在於'

Claims (1)

1300601 專利申請案第92135143號申請專利範圍修$ + 2008年 1 月 拾、申請專利範圍： 進行1次接合後， 1導體與第2導體 1 · 一種打線方法，係在第1導體上 於第2導體上進行2次接合，以於該第 間進行打線者；其特徵在於： 於自毛細管貫通孔延伸之引線端部形成焊球，於該第 2導體上’在使該引線之焊球擠入該毛細管貫通孔之引線 =的焊球-部分形成於突塊之前，以該毛細管緊壓來形成 大塊’使该毛細管上昇至突塊形成時擠入該毛細管貫通孔
而形成的隆起部分的高度以内’使毛細管朝與該第上導體 側相反的方向移動，下降毛細管並於該突塊形成傾斜楔均 ，切斷該引線’於該第i導體上進行該i次接 :導體側將引線f成弧狀，並於該突塊上 = 行該2次接合。 叮佚現上 拾壹、圖式： 如次頁 12 正替換頁I 柒、指定代表圖： (一） 本案指定代表圖為：第（1 )圖。 (二) 本代表圖之元件代表符號簡單說明： 捌、本案若有化學式時，請揭示最能顯示發明特徵的化學式 1 電路基板 3 配線 4 引線 4a、4b 焊球 5 毛細管 5 a 貫通孔 5b 端緣部 10 突塊 11 隆起部分 12 傾斜楔塊
TW092135143A 2003-02-17 2003-12-12 Wire bonding method TW200421506A (en)

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JP4137061B2 (ja) * 2005-01-11 2008-08-20 株式会社カイジョー ワイヤループ形状、そのワイヤループ形状を備えた半導体装置、ワイヤボンディング方法
JP4298665B2 (ja) 2005-02-08 2009-07-22 株式会社新川 ワイヤボンディング方法
KR20060091622A (ko) * 2005-02-16 2006-08-21 삼성테크윈 주식회사 와이어 본딩 방법
US20070216026A1 (en) * 2006-03-20 2007-09-20 Adams Zhu Aluminum bump bonding for fine aluminum wire
JP4694405B2 (ja) * 2006-04-12 2011-06-08 ローム株式会社 ワイヤボンディング方法
US20090042339A1 (en) * 2007-08-10 2009-02-12 Texas Instruments Incorporated Packaged integrated circuits and methods to form a packaged integrated circuit
JP4625858B2 (ja) * 2008-09-10 2011-02-02 株式会社カイジョー ワイヤボンディング方法、ワイヤボンディング装置及びワイヤボンディング制御プログラム
KR101610827B1 (ko) 2009-12-03 2016-04-08 삼성전자주식회사 본딩 구조물의 형성 방법
JP5359977B2 (ja) * 2010-04-12 2013-12-04 株式会社デンソー ワイヤボンディング方法
US9082753B2 (en) * 2013-11-12 2015-07-14 Invensas Corporation Severing bond wire by kinking and twisting
KR102621753B1 (ko) 2018-09-28 2024-01-05 삼성전자주식회사 본딩 와이어, 이를 포함하는 반도체 패키지, 및 와이어 본딩 방법
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