JP4694405B2 - ワイヤボンディング方法 - Google Patents
ワイヤボンディング方法 Download PDFInfo
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- JP4694405B2 JP4694405B2 JP2006109402A JP2006109402A JP4694405B2 JP 4694405 B2 JP4694405 B2 JP 4694405B2 JP 2006109402 A JP2006109402 A JP 2006109402A JP 2006109402 A JP2006109402 A JP 2006109402A JP 4694405 B2 JP4694405 B2 JP 4694405B2
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- wire
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- H01L24/42—Wire connectors; Manufacturing methods related thereto
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Description
H 距離
S 回路基板
Sa スルーホール
Sd ハンダ
V 距離
W ワイヤ
W1 ファーストボンディング部
W1a 冠部
W2 セカンドボンディング部
W2a くさび状部
W2b 冠部
W2c くびれ部
W3 連結部
Wb 溶融ボール
1 リードフレーム(導通支持部材)
2 受光素子(電子素子)
2a 電極
3 駆動IC
4 樹脂パッケージ
4a レンズ
11 ボンディングパッド
12 パッド(接続対象部)
13 外部リード
Claims (3)
- 接続対象部を有する導通支持部材に搭載された電子素子の電極に対して、キャピラリに挿通されたワイヤの一端を接合するファーストボンディング工程と、
上記ワイヤの他端を上記接続対象部に接合するセカンドボンディング工程と、を有するワイヤボンディング方法であって、
上記セカンドボンディング工程は、上記キャピラリを上記接続対象部に対して押し付けることにより、上記導通支持部材側に残存した上記ワイヤの上記他端をくさび状部により上記接続対象部に接合するとともに、上記ワイヤを切断する工程と、
上記ワイヤを一度切断した後に、上記キャピラリから突出した上記ワイヤの先端寄りの部分を溶融させることにより溶融ボールを形成する工程と、
上記キャピラリを上記接続対象部に接近させることにより、上記溶融ボールを上記ワイヤの上記他端に付着させ、上記くさび状部および上記接続対象部を覆うように、上記ワイヤの径よりも大きい径を有する冠部を形成する工程と、
上記ワイヤを送り出しながら上記キャピラリを上記接続対象部から上記冠部の上端よりも上方に離間させる工程と、
上記キャピラリを上記接続対象部から離間する方向に対して直角な方向にスライドさせることにより、上記冠部の上端よりも上方の部分において上記ワイヤにくびれ部を形成する工程と、
上記キャピラリを上記接続対象部からさらに離間させることにより、上記くびれ部において上記ワイヤを切断する工程と、を有することを特徴とする、ワイヤボンディング方法。 - 上記溶融ボールを上記ワイヤの上記他端に付着させる工程においては、上記キャピラリと上記導通支持部材とを当接させない、請求項1に記載のワイヤボンディング方法。
- 上記ワイヤを送り出しながら上記キャピラリを上記接続対象部から離間させる工程においては、上記キャピラリの先端と上記接続対象部との距離が、上記ワイヤの直径の1.3〜2.2倍となる位置に上記キャピラリを移動させ、
上記くびれ部を形成する工程においては、上記ワイヤの直径の1.0〜1.7倍の距離をスライドさせる、請求項1または2に記載のワイヤボンディング方法。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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JP2006109402A JP4694405B2 (ja) | 2006-04-12 | 2006-04-12 | ワイヤボンディング方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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JP2006109402A JP4694405B2 (ja) | 2006-04-12 | 2006-04-12 | ワイヤボンディング方法 |
Publications (2)
Publication Number | Publication Date |
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JP2007281389A JP2007281389A (ja) | 2007-10-25 |
JP4694405B2 true JP4694405B2 (ja) | 2011-06-08 |
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Application Number | Title | Priority Date | Filing Date |
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JP2006109402A Expired - Fee Related JP4694405B2 (ja) | 2006-04-12 | 2006-04-12 | ワイヤボンディング方法 |
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Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61280626A (ja) * | 1985-05-08 | 1986-12-11 | Sanyo Electric Co Ltd | ワイヤボンデイング方法 |
JPH0449631A (ja) * | 1990-06-19 | 1992-02-19 | Oki Electric Ind Co Ltd | ワイヤボンディング方法 |
JP2000031613A (ja) * | 1998-07-08 | 2000-01-28 | Mitsubishi Electric Corp | 電気回路基板および突出接点形成方法および突出接点形成装置 |
JP2002517092A (ja) * | 1998-05-27 | 2002-06-11 | ローベルト ボツシユ ゲゼルシヤフト ミツト ベシユレンクテル ハフツング | 電気的な接続部を形成するための方法およびコンタクト部 |
JP2004247674A (ja) * | 2003-02-17 | 2004-09-02 | Shinkawa Ltd | ワイヤボンディング方法 |
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- 2006-04-12 JP JP2006109402A patent/JP4694405B2/ja not_active Expired - Fee Related
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61280626A (ja) * | 1985-05-08 | 1986-12-11 | Sanyo Electric Co Ltd | ワイヤボンデイング方法 |
JPH0449631A (ja) * | 1990-06-19 | 1992-02-19 | Oki Electric Ind Co Ltd | ワイヤボンディング方法 |
JP2002517092A (ja) * | 1998-05-27 | 2002-06-11 | ローベルト ボツシユ ゲゼルシヤフト ミツト ベシユレンクテル ハフツング | 電気的な接続部を形成するための方法およびコンタクト部 |
JP2000031613A (ja) * | 1998-07-08 | 2000-01-28 | Mitsubishi Electric Corp | 電気回路基板および突出接点形成方法および突出接点形成装置 |
JP2004247674A (ja) * | 2003-02-17 | 2004-09-02 | Shinkawa Ltd | ワイヤボンディング方法 |
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