TW200420630A - Method and apparatus for production of fluorine-containing polyimide film - Google Patents
Method and apparatus for production of fluorine-containing polyimide filmInfo
- Publication number
- TW200420630A TW200420630A TW093105976A TW93105976A TW200420630A TW 200420630 A TW200420630 A TW 200420630A TW 093105976 A TW093105976 A TW 093105976A TW 93105976 A TW93105976 A TW 93105976A TW 200420630 A TW200420630 A TW 200420630A
- Authority
- TW
- Taiwan
- Prior art keywords
- fluorine
- containing polyimide
- coating film
- forming
- film
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02K—DYNAMO-ELECTRIC MACHINES
- H02K7/00—Arrangements for handling mechanical energy structurally associated with dynamo-electric machines, e.g. structural association with mechanical driving motors or auxiliary dynamo-electric machines
- H02K7/10—Structural association with clutches, brakes, gears, pulleys or mechanical starters
- H02K7/116—Structural association with clutches, brakes, gears, pulleys or mechanical starters with gears
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1039—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors comprising halogen-containing substituents
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02K—DYNAMO-ELECTRIC MACHINES
- H02K21/00—Synchronous motors having permanent magnets; Synchronous generators having permanent magnets
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D1/00—Processes for applying liquids or other fluent materials
- B05D1/002—Processes for applying liquids or other fluent materials the substrate being rotated
- B05D1/005—Spin coating
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2379/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
- C08J2379/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08J2379/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0346—Organic insulating material consisting of one material containing N
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Manufacturing & Machinery (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Power Engineering (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Optical Integrated Circuits (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003059332A JP4184834B2 (ja) | 2003-03-06 | 2003-03-06 | フッ素含有ポリイミドフィルムの製造方法および製造装置 |
JP2003059331A JP2004269591A (ja) | 2003-03-06 | 2003-03-06 | フッ素含有ポリイミドフィルムの製造方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW200420630A true TW200420630A (en) | 2004-10-16 |
Family
ID=32828981
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW093105976A TW200420630A (en) | 2003-03-06 | 2004-03-05 | Method and apparatus for production of fluorine-containing polyimide film |
Country Status (5)
Country | Link |
---|---|
US (1) | US7364771B2 (zh) |
EP (1) | EP1454945A1 (zh) |
KR (1) | KR100802151B1 (zh) |
CN (1) | CN1569995A (zh) |
TW (1) | TW200420630A (zh) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW200635982A (en) * | 2005-03-11 | 2006-10-16 | Nippon Catalytic Chem Ind | Production method of polyimide solution and fluorinated polyimide solution |
WO2013069725A1 (ja) * | 2011-11-11 | 2013-05-16 | 三菱瓦斯化学株式会社 | 透明耐熱ガスバリア性フィルムの製造方法 |
TW201338639A (zh) * | 2012-03-02 | 2013-09-16 | Hon Hai Prec Ind Co Ltd | 光電電路板的製造方法 |
JP6473932B2 (ja) * | 2014-05-29 | 2019-02-27 | パナソニックIpマネジメント株式会社 | 支持基板付き樹脂基板、及び、その製造方法、並びに、その樹脂基板を用いた電子デバイス |
JP7021887B2 (ja) * | 2016-09-30 | 2022-02-17 | 住友化学株式会社 | 光学フィルムの製造方法 |
CN106707690B (zh) * | 2017-01-04 | 2021-08-20 | 中国科学院光电技术研究所 | 光刻胶涂覆方法和装置 |
CN110416370B (zh) * | 2019-08-23 | 2022-08-12 | 米昂光伏科技(上海)有限公司 | 太阳能电池板防水成膜装置 |
CN111589616B (zh) * | 2020-06-03 | 2021-08-10 | 江苏中大包装材料有限公司 | 一种半导体表面绝缘薄膜加工装置 |
Family Cites Families (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4595548A (en) * | 1984-08-23 | 1986-06-17 | The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration | Process for preparing essentially colorless polyimide film containing phenoxy-linked diamines |
US5428102A (en) * | 1987-07-15 | 1995-06-27 | The United States Of America As Represented By The United States National Aeronautics And Space Administration | Low dielectric polyimides |
US5068131A (en) * | 1988-10-11 | 1991-11-26 | Ethyl Corporation | Method for production of electronic coatings |
JPH0420527A (ja) | 1990-05-15 | 1992-01-24 | Nippon Oil & Fats Co Ltd | 改質ポリイミド樹脂及びその製造方法 |
JP2851019B2 (ja) | 1990-09-28 | 1999-01-27 | 日本電信電話株式会社 | 全フッ素化ポリイミド,全フッ素化ポリアミド酸およびそれらの製造方法 |
US5233018A (en) | 1990-09-28 | 1993-08-03 | Nippon Telegraph And Telephone Corporation | Perfluorinated polyimide, perfluorinated poly(amic acid), starting compounds therefor, and methods for preparing them |
JPH0527414A (ja) * | 1991-07-23 | 1993-02-05 | Shin Etsu Chem Co Ltd | 半導体用ペリクルおよびその製造方法 |
JPH05166712A (ja) | 1991-12-18 | 1993-07-02 | Dainippon Screen Mfg Co Ltd | 回転塗布方法 |
JPH05291127A (ja) | 1992-04-16 | 1993-11-05 | Fujitsu Ltd | 半導体製造装置およびそれを用いた半導体装置の製造方法 |
JP3276449B2 (ja) | 1993-05-13 | 2002-04-22 | 富士通株式会社 | 回転塗布方法 |
JPH06320100A (ja) | 1993-05-18 | 1994-11-22 | Mitsubishi Plastics Ind Ltd | スピンコーター |
JP3296458B2 (ja) | 1994-03-01 | 2002-07-02 | 日本電信電話株式会社 | 高分子フィルム光導波路及びその製造方法 |
JPH088170A (ja) | 1994-06-23 | 1996-01-12 | Fujitsu Ltd | ポリイミド樹脂膜の形成方法及びポリイミド樹脂膜形成装置 |
US5695817A (en) * | 1994-08-08 | 1997-12-09 | Tokyo Electron Limited | Method of forming a coating film |
JP3401121B2 (ja) * | 1995-04-21 | 2003-04-28 | 大日本スクリーン製造株式会社 | 基板への回転式塗布装置 |
JPH0915608A (ja) | 1995-07-03 | 1997-01-17 | Nippon Telegr & Teleph Corp <Ntt> | 低複屈折ポリイミド膜の製造方法 |
JPH1043665A (ja) | 1996-08-06 | 1998-02-17 | Sony Corp | スピンコーター |
TW418452B (en) * | 1997-10-31 | 2001-01-11 | Tokyo Electron Ltd | Coating process |
JP4054159B2 (ja) | 2000-03-08 | 2008-02-27 | 東京エレクトロン株式会社 | 基板処理方法及びその装置 |
JP3587776B2 (ja) | 2000-10-10 | 2004-11-10 | 東京エレクトロン株式会社 | 塗布装置及び塗布方法 |
JP2002143749A (ja) | 2000-11-08 | 2002-05-21 | Sony Corp | 回転塗布装置 |
JP2002177857A (ja) | 2000-12-08 | 2002-06-25 | Ariizumi Sekkei:Kk | ミスト無発生スピンコーター |
JP4631160B2 (ja) | 2000-12-15 | 2011-02-16 | 凸版印刷株式会社 | スピンコート方法及びスピンコート装置 |
JP2002239443A (ja) | 2001-02-15 | 2002-08-27 | Able:Kk | スピンコーター |
-
2004
- 2004-03-05 EP EP04251311A patent/EP1454945A1/en not_active Withdrawn
- 2004-03-05 TW TW093105976A patent/TW200420630A/zh unknown
- 2004-03-05 KR KR1020040015134A patent/KR100802151B1/ko not_active IP Right Cessation
- 2004-03-05 US US10/795,122 patent/US7364771B2/en not_active Expired - Fee Related
- 2004-03-08 CN CNA2004100330845A patent/CN1569995A/zh active Pending
Also Published As
Publication number | Publication date |
---|---|
CN1569995A (zh) | 2005-01-26 |
EP1454945A1 (en) | 2004-09-08 |
KR100802151B1 (ko) | 2008-02-11 |
US20040234686A1 (en) | 2004-11-25 |
US7364771B2 (en) | 2008-04-29 |
KR20040079321A (ko) | 2004-09-14 |
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