TW200403802A - Semiconductor integrated circuit device and its manufacturing method - Google Patents

Semiconductor integrated circuit device and its manufacturing method Download PDF

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Publication number
TW200403802A
TW200403802A TW092115541A TW92115541A TW200403802A TW 200403802 A TW200403802 A TW 200403802A TW 092115541 A TW092115541 A TW 092115541A TW 92115541 A TW92115541 A TW 92115541A TW 200403802 A TW200403802 A TW 200403802A
Authority
TW
Taiwan
Prior art keywords
layer
film
aforementioned
integrated circuit
semiconductor
Prior art date
Application number
TW092115541A
Other languages
English (en)
Chinese (zh)
Other versions
TWI297192B (https=
Inventor
Fumio Otsuka
Katsuhiko Ichinose
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Publication of TW200403802A publication Critical patent/TW200403802A/zh
Application granted granted Critical
Publication of TWI297192B publication Critical patent/TWI297192B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/60—Insulated-gate field-effect transistors [IGFET]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/01—Manufacture or treatment
    • H10D84/0123—Integrating together multiple components covered by H10D12/00 or H10D30/00, e.g. integrating multiple IGBTs
    • H10D84/0126—Integrating together multiple components covered by H10D12/00 or H10D30/00, e.g. integrating multiple IGBTs the components including insulated gates, e.g. IGFETs
    • H10D84/0165—Integrating together multiple components covered by H10D12/00 or H10D30/00, e.g. integrating multiple IGBTs the components including insulated gates, e.g. IGFETs the components including complementary IGFETs, e.g. CMOS devices
    • H10D84/0188—Manufacturing their isolation regions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/01—Manufacture or treatment
    • H10D84/02—Manufacture or treatment characterised by using material-based technologies
    • H10D84/03—Manufacture or treatment characterised by using material-based technologies using Group IV technology, e.g. silicon technology or silicon-carbide [SiC] technology
    • H10D84/038—Manufacture or treatment characterised by using material-based technologies using Group IV technology, e.g. silicon technology or silicon-carbide [SiC] technology using silicon technology, e.g. SiGe
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W10/00—Isolation regions in semiconductor bodies between components of integrated devices
    • H10W10/01—Manufacture or treatment
    • H10W10/011—Manufacture or treatment of isolation regions comprising dielectric materials
    • H10W10/014—Manufacture or treatment of isolation regions comprising dielectric materials using trench refilling with dielectric materials, e.g. shallow trench isolations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W10/00—Isolation regions in semiconductor bodies between components of integrated devices
    • H10W10/01—Manufacture or treatment
    • H10W10/011—Manufacture or treatment of isolation regions comprising dielectric materials
    • H10W10/014—Manufacture or treatment of isolation regions comprising dielectric materials using trench refilling with dielectric materials, e.g. shallow trench isolations
    • H10W10/0143—Manufacture or treatment of isolation regions comprising dielectric materials using trench refilling with dielectric materials, e.g. shallow trench isolations comprising concurrently refilling multiple trenches having different shapes or dimensions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W10/00—Isolation regions in semiconductor bodies between components of integrated devices
    • H10W10/10—Isolation regions comprising dielectric materials
    • H10W10/17—Isolation regions comprising dielectric materials formed using trench refilling with dielectric materials, e.g. shallow trench isolations

Landscapes

  • Element Separation (AREA)
  • Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
  • Insulated Gate Type Field-Effect Transistor (AREA)
TW092115541A 2002-06-25 2003-06-09 Semiconductor integrated circuit device and its manufacturing method TW200403802A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002184292A JP4421811B2 (ja) 2002-06-25 2002-06-25 半導体集積回路装置およびその製造方法

Publications (2)

Publication Number Publication Date
TW200403802A true TW200403802A (en) 2004-03-01
TWI297192B TWI297192B (https=) 2008-05-21

Family

ID=30112248

Family Applications (1)

Application Number Title Priority Date Filing Date
TW092115541A TW200403802A (en) 2002-06-25 2003-06-09 Semiconductor integrated circuit device and its manufacturing method

Country Status (4)

Country Link
US (1) US6847093B2 (https=)
JP (1) JP4421811B2 (https=)
KR (1) KR20040002665A (https=)
TW (1) TW200403802A (https=)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4750342B2 (ja) * 2002-07-03 2011-08-17 ルネサスエレクトロニクス株式会社 Ｍｏｓ−ｆｅｔおよびその製造方法、並びに半導体装置
JP4368095B2 (ja) * 2002-08-21 2009-11-18 富士通マイクロエレクトロニクス株式会社 半導体装置及びその製造方法
US20040164373A1 (en) 2003-02-25 2004-08-26 Koester Steven John Shallow trench isolation structure for strained Si on SiGe
US7238985B2 (en) * 2003-08-13 2007-07-03 International Rectifier Corporation Trench type mosgated device with strained layer on trench sidewall
JP2005197405A (ja) 2004-01-06 2005-07-21 Toshiba Corp 半導体装置とその製造方法
US7462549B2 (en) * 2004-01-12 2008-12-09 Advanced Micro Devices, Inc. Shallow trench isolation process and structure with minimized strained silicon consumption
JP2005252067A (ja) * 2004-03-05 2005-09-15 Toshiba Corp 電界効果トランジスタ及びその製造方法
US7371658B2 (en) * 2004-06-17 2008-05-13 Texas Instruments Incorporated Trench isolation structure and a method of manufacture therefor
KR100620707B1 (ko) * 2004-12-31 2006-09-13 동부일렉트로닉스 주식회사 반도체 소자의 ｓｔｉ 형성 방법
US7465972B2 (en) 2005-01-21 2008-12-16 Taiwan Semiconductor Manufacturing Company, Ltd. High performance CMOS device design
US20060292762A1 (en) * 2005-06-22 2006-12-28 Epion Corporation Replacement gate field effect transistor with germanium or SiGe channel and manufacturing method for same using gas-cluster ion irradiation
US7323392B2 (en) * 2006-03-28 2008-01-29 Taiwan Semiconductor Manufacturing Company, Ltd. High performance transistor with a highly stressed channel
JP2008091614A (ja) * 2006-10-02 2008-04-17 Toshiba Corp 半導体装置およびその製造方法
JP5563186B2 (ja) * 2007-03-30 2014-07-30 ピーエスフォー ルクスコ エスエイアールエル 半導体装置及びその製造方法
JP5592750B2 (ja) * 2010-10-14 2014-09-17 株式会社東芝 半導体装置
US9698044B2 (en) * 2011-12-01 2017-07-04 Taiwan Semiconductor Manufacturing Company, Ltd. Localized carrier lifetime reduction
KR101831936B1 (ko) * 2011-12-22 2018-02-26 삼성전자주식회사 박막 형성 방법 및 이를 이용한 반도체 소자의 제조 방법
US8828851B2 (en) * 2012-02-01 2014-09-09 Stmicroeletronics, Inc. Method to enable the formation of silicon germanium channel of FDSOI devices for PFET threshold voltage engineering
US9209066B2 (en) * 2013-03-01 2015-12-08 Taiwan Semiconductor Manufacturing Company, Ltd. Isolation structure of semiconductor device
US9099324B2 (en) * 2013-10-24 2015-08-04 Taiwan Semiconductor Manufacturing Co., Ltd. Semiconductor device with trench isolation
US9960273B2 (en) * 2015-11-16 2018-05-01 Taiwan Semiconductor Manufacturing Company, Ltd. Integrated circuit structure with substrate isolation and un-doped channel
DE102017126435B4 (de) * 2017-08-31 2022-07-28 Taiwan Semiconductor Manufacturing Company, Ltd. Fin-feldeffekttransistorvorrichtung und verfahren
US10497577B2 (en) 2017-08-31 2019-12-03 Taiwan Semiconductor Manufacturing Company, Ltd. Fin field-effect transistor device and method
US11594597B2 (en) 2019-10-25 2023-02-28 Taiwan Semiconductor Manufacturing Company, Ltd. Selective polysilicon growth for deep trench polysilicon isolation structure
US20240429166A1 (en) * 2023-06-23 2024-12-26 International Business Machines Corporation Trench isolation structures for backside contacts

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5250448A (en) * 1990-01-31 1993-10-05 Kabushiki Kaisha Toshiba Method of fabricating a miniaturized heterojunction bipolar transistor
JP2980497B2 (ja) * 1993-11-15 1999-11-22 株式会社東芝 誘電体分離型バイポーラトランジスタの製造方法
US6399970B2 (en) * 1996-09-17 2002-06-04 Matsushita Electric Industrial Co., Ltd. FET having a Si/SiGeC heterojunction channel
JP3762136B2 (ja) * 1998-04-24 2006-04-05 株式会社東芝 半導体装置
US6274894B1 (en) * 1999-08-17 2001-08-14 Advanced Micro Devices, Inc. Low-bandgap source and drain formation for short-channel MOS transistors

Also Published As

Publication number Publication date
TWI297192B (https=) 2008-05-21
JP4421811B2 (ja) 2010-02-24
JP2004031559A (ja) 2004-01-29
US6847093B2 (en) 2005-01-25
US20040009636A1 (en) 2004-01-15
KR20040002665A (ko) 2004-01-07

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