TW200308079A - Semiconductor device and semiconductor memory using the same - Google Patents
Semiconductor device and semiconductor memory using the same Download PDFInfo
- Publication number
- TW200308079A TW200308079A TW092104783A TW92104783A TW200308079A TW 200308079 A TW200308079 A TW 200308079A TW 092104783 A TW092104783 A TW 092104783A TW 92104783 A TW92104783 A TW 92104783A TW 200308079 A TW200308079 A TW 200308079A
- Authority
- TW
- Taiwan
- Prior art keywords
- transistor
- source
- layer
- region
- semiconductor memory
- Prior art date
Links
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- UIWYJDYFSGRHKR-UHFFFAOYSA-N gadolinium atom Chemical compound [Gd] UIWYJDYFSGRHKR-UHFFFAOYSA-N 0.000 description 1
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- 229910052734 helium Inorganic materials 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
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- 239000011810 insulating material Substances 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
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- 230000001568 sexual effect Effects 0.000 description 1
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- SBEQWOXEGHQIMW-UHFFFAOYSA-N silicon Chemical compound [Si].[Si] SBEQWOXEGHQIMW-UHFFFAOYSA-N 0.000 description 1
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- LEONUFNNVUYDNQ-UHFFFAOYSA-N vanadium atom Chemical compound [V] LEONUFNNVUYDNQ-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B41/00—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates
- H10B41/30—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates characterised by the memory core region
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B69/00—Erasable-and-programmable ROM [EPROM] devices not provided for in groups H10B41/00 - H10B63/00, e.g. ultraviolet erasable-and-programmable ROM [UVEPROM] devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
- H01L27/10—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a repetitive configuration
- H01L27/105—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a repetitive configuration including field-effect components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/788—Field effect transistors with field effect produced by an insulated gate with floating gate
- H01L29/7887—Programmable transistors with more than two possible different levels of programmation
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B41/00—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates
- H10B41/30—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates characterised by the memory core region
- H10B41/35—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates characterised by the memory core region with a cell select transistor, e.g. NAND
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B41/00—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates
- H10B41/20—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates characterised by three-dimensional arrangements, e.g. with cells on different height levels
- H10B41/23—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates characterised by three-dimensional arrangements, e.g. with cells on different height levels with source and drain on different levels, e.g. with sloping channels
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Ceramic Engineering (AREA)
- Semiconductor Memories (AREA)
- Non-Volatile Memory (AREA)
- Read Only Memory (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002089744 | 2002-03-27 | ||
| JP2003036005A JP4472934B2 (ja) | 2002-03-27 | 2003-02-14 | 半導体装置および半導体メモリ |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW200308079A true TW200308079A (en) | 2003-12-16 |
Family
ID=27807028
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW092104783A TW200308079A (en) | 2002-03-27 | 2003-03-06 | Semiconductor device and semiconductor memory using the same |
Country Status (6)
| Country | Link |
|---|---|
| US (2) | US6984863B2 (ko) |
| EP (1) | EP1349215A2 (ko) |
| JP (1) | JP4472934B2 (ko) |
| KR (1) | KR20030078023A (ko) |
| CN (1) | CN1447436A (ko) |
| TW (1) | TW200308079A (ko) |
Families Citing this family (25)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004214495A (ja) * | 2003-01-07 | 2004-07-29 | Innotech Corp | トランジスタとそれを用いた半導体メモリ、および半導体メモリの製造方法 |
| US6914825B2 (en) * | 2003-04-03 | 2005-07-05 | Ememory Technology Inc. | Semiconductor memory device having improved data retention |
| US6936883B2 (en) * | 2003-04-07 | 2005-08-30 | Silicon Storage Technology, Inc. | Bi-directional read/program non-volatile floating gate memory cell and array thereof, and method of formation |
| US6967143B2 (en) * | 2003-04-30 | 2005-11-22 | Freescale Semiconductor, Inc. | Semiconductor fabrication process with asymmetrical conductive spacers |
| US7192876B2 (en) * | 2003-05-22 | 2007-03-20 | Freescale Semiconductor, Inc. | Transistor with independent gate structures |
| JP4532405B2 (ja) * | 2003-06-04 | 2010-08-25 | 富士通セミコンダクター株式会社 | 不揮発性半導体メモリ |
| US7202523B2 (en) * | 2003-11-17 | 2007-04-10 | Micron Technology, Inc. | NROM flash memory devices on ultrathin silicon |
| KR100618819B1 (ko) * | 2004-02-06 | 2006-08-31 | 삼성전자주식회사 | 오버레이 마진이 개선된 반도체 소자 및 그 제조방법 |
| JP4557678B2 (ja) * | 2004-02-13 | 2010-10-06 | イノテック株式会社 | 半導体記憶装置 |
| US7087950B2 (en) * | 2004-04-30 | 2006-08-08 | Infineon Technologies Ag | Flash memory cell, flash memory device and manufacturing method thereof |
| EP1837917A1 (en) * | 2006-03-21 | 2007-09-26 | Semiconductor Energy Laboratory Co., Ltd. | Nonvolatile semiconductor memory device |
| JP5164406B2 (ja) * | 2006-03-21 | 2013-03-21 | 株式会社半導体エネルギー研究所 | 不揮発性半導体記憶装置 |
| KR101488516B1 (ko) * | 2006-03-21 | 2015-02-02 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 불휘발성 반도체 기억장치 |
| JP2007288175A (ja) * | 2006-03-21 | 2007-11-01 | Semiconductor Energy Lab Co Ltd | 不揮発性半導体記憶装置 |
| JP5164404B2 (ja) * | 2006-03-21 | 2013-03-21 | 株式会社半導体エネルギー研究所 | 不揮発性半導体記憶装置 |
| TWI416738B (zh) | 2006-03-21 | 2013-11-21 | Semiconductor Energy Lab | 非揮發性半導體記憶體裝置 |
| JP5164405B2 (ja) * | 2006-03-21 | 2013-03-21 | 株式会社半導体エネルギー研究所 | 不揮発性半導体記憶装置 |
| EP1840947A3 (en) | 2006-03-31 | 2008-08-13 | Semiconductor Energy Laboratory Co., Ltd. | Nonvolatile semiconductor memory device |
| JP5466815B2 (ja) * | 2006-03-31 | 2014-04-09 | 株式会社半導体エネルギー研究所 | 半導体装置 |
| JP2007294911A (ja) * | 2006-03-31 | 2007-11-08 | Semiconductor Energy Lab Co Ltd | 不揮発性半導体記憶装置 |
| JP5483659B2 (ja) * | 2006-03-31 | 2014-05-07 | 株式会社半導体エネルギー研究所 | 半導体装置 |
| US7494860B2 (en) * | 2006-08-16 | 2009-02-24 | Sandisk Corporation | Methods of forming nonvolatile memories with L-shaped floating gates |
| US7755132B2 (en) | 2006-08-16 | 2010-07-13 | Sandisk Corporation | Nonvolatile memories with shaped floating gates |
| JP5270205B2 (ja) | 2008-03-24 | 2013-08-21 | 株式会社Ｄｎｐファインケミカル | インクジェット記録用油性緑色インク組成物およびインクジェット記録用油性インクセット |
| KR101096907B1 (ko) * | 2009-10-05 | 2011-12-22 | 주식회사 하이닉스반도체 | 반도체 소자 및 그 형성방법 |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5379255A (en) * | 1992-12-14 | 1995-01-03 | Texas Instruments Incorporated | Three dimensional famos memory devices and methods of fabricating |
| JP4397491B2 (ja) | 1999-11-30 | 2010-01-13 | 財団法人国際科学振興財団 | １１１面方位を表面に有するシリコンを用いた半導体装置およびその形成方法 |
| JP3283872B1 (ja) | 2001-04-12 | 2002-05-20 | イノテック株式会社 | 半導体記憶装置、その製造方法及び半導体記憶装置の駆動方法 |
| JP3249811B1 (ja) | 2000-11-09 | 2002-01-21 | イノテック株式会社 | 半導体記憶装置、その製造方法及び半導体記憶装置の駆動方法 |
| JP3249812B1 (ja) | 2001-05-14 | 2002-01-21 | イノテック株式会社 | 半導体記憶装置及びその製造方法 |
| JP4191975B2 (ja) * | 2001-11-01 | 2008-12-03 | イノテック株式会社 | トランジスタとそれを用いた半導体メモリ、およびトランジスタの製造方法 |
| JP2003224215A (ja) * | 2001-11-22 | 2003-08-08 | Innotech Corp | トランジスタとそれを用いた半導体メモリ、およびトランジスタの駆動方法 |
| JP2004072060A (ja) * | 2001-11-22 | 2004-03-04 | Innotech Corp | トランジスタとそれを用いた半導体メモリ、およびトランジスタの駆動方法 |
| US6861315B1 (en) * | 2003-08-14 | 2005-03-01 | Silicon Storage Technology, Inc. | Method of manufacturing an array of bi-directional nonvolatile memory cells |
-
2003
- 2003-02-14 JP JP2003036005A patent/JP4472934B2/ja not_active Expired - Lifetime
- 2003-03-06 TW TW092104783A patent/TW200308079A/zh unknown
- 2003-03-26 KR KR10-2003-0018958A patent/KR20030078023A/ko not_active Application Discontinuation
- 2003-03-26 EP EP03006801A patent/EP1349215A2/en not_active Withdrawn
- 2003-03-27 US US10/397,377 patent/US6984863B2/en not_active Expired - Fee Related
- 2003-03-27 CN CN03128647A patent/CN1447436A/zh active Pending
-
2005
- 2005-09-28 US US11/236,629 patent/US7221029B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP2004006658A (ja) | 2004-01-08 |
| JP4472934B2 (ja) | 2010-06-02 |
| KR20030078023A (ko) | 2003-10-04 |
| CN1447436A (zh) | 2003-10-08 |
| US6984863B2 (en) | 2006-01-10 |
| US20030183872A1 (en) | 2003-10-02 |
| US7221029B2 (en) | 2007-05-22 |
| EP1349215A2 (en) | 2003-10-01 |
| US20060027857A1 (en) | 2006-02-09 |
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