SG97201A1 - Substrate holding apparatus - Google Patents

Substrate holding apparatus

Info

Publication number
SG97201A1
SG97201A1 SG200106234A SG200106234A SG97201A1 SG 97201 A1 SG97201 A1 SG 97201A1 SG 200106234 A SG200106234 A SG 200106234A SG 200106234 A SG200106234 A SG 200106234A SG 97201 A1 SG97201 A1 SG 97201A1
Authority
SG
Singapore
Prior art keywords
substrate holding
holding apparatus
substrate
holding
Prior art date
Application number
SG200106234A
Other languages
English (en)
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Publication of SG97201A1 publication Critical patent/SG97201A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/06—Work supports, e.g. adjustable steadies
    • B24B41/061—Work supports, e.g. adjustable steadies axially supporting turning workpieces, e.g. magnetically, pneumatically

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
SG200106234A 2000-10-11 2001-10-09 Substrate holding apparatus SG97201A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2000311071 2000-10-11
JP2001013899A JP2002187060A (ja) 2000-10-11 2001-01-22 基板保持装置、ポリッシング装置、及び研磨方法

Publications (1)

Publication Number Publication Date
SG97201A1 true SG97201A1 (en) 2003-07-18

Family

ID=26601900

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200106234A SG97201A1 (en) 2000-10-11 2001-10-09 Substrate holding apparatus

Country Status (7)

Country Link
US (4) US6852019B2 (de)
EP (4) EP1852220A1 (de)
JP (1) JP2002187060A (de)
KR (5) KR100874148B1 (de)
DE (1) DE60137007D1 (de)
SG (1) SG97201A1 (de)
TW (1) TW576773B (de)

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KR20210061273A (ko) * 2019-11-19 2021-05-27 가부시키가이샤 에바라 세이사꾸쇼 기판을 보유 지지하기 위한 톱링 및 기판 처리 장치
JP7436684B2 (ja) * 2020-06-26 2024-02-22 アプライド マテリアルズ インコーポレイテッド 変形可能な基板チャック
JP7447285B2 (ja) 2020-06-29 2024-03-11 アプライド マテリアルズ インコーポレイテッド 複数の角度方向加圧可能区域を有する研磨キャリアヘッド
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CN113977451B (zh) * 2021-10-25 2023-08-25 长鑫存储技术有限公司 半导体设备的检测系统及检测方法

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Also Published As

Publication number Publication date
US7083507B2 (en) 2006-08-01
KR100874148B1 (ko) 2008-12-15
KR20090082329A (ko) 2009-07-30
JP2002187060A (ja) 2002-07-02
EP1197292A3 (de) 2002-07-31
EP1197292B1 (de) 2008-12-17
KR101000420B1 (ko) 2010-12-13
EP1935566A3 (de) 2008-07-23
US20060234609A1 (en) 2006-10-19
EP1944123B1 (de) 2011-07-13
US7850509B2 (en) 2010-12-14
KR20080011240A (ko) 2008-01-31
KR20080058318A (ko) 2008-06-25
US20020042246A1 (en) 2002-04-11
US20090061748A1 (en) 2009-03-05
US7491117B2 (en) 2009-02-17
US20050118935A1 (en) 2005-06-02
EP1935566B1 (de) 2012-05-16
KR100874712B1 (ko) 2008-12-18
EP1852220A1 (de) 2007-11-07
KR100939555B1 (ko) 2010-01-29
EP1944123A3 (de) 2008-07-23
KR20090099037A (ko) 2009-09-21
US6852019B2 (en) 2005-02-08
DE60137007D1 (de) 2009-01-29
EP1197292A2 (de) 2002-04-17
EP1935566A2 (de) 2008-06-25
KR100973766B1 (ko) 2010-08-04
KR20020028845A (ko) 2002-04-17
TW576773B (en) 2004-02-21
EP1944123A2 (de) 2008-07-16

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