KR20080058318A - 기판 유지 장치 - Google Patents
기판 유지 장치 Download PDFInfo
- Publication number
- KR20080058318A KR20080058318A KR1020080056555A KR20080056555A KR20080058318A KR 20080058318 A KR20080058318 A KR 20080058318A KR 1020080056555 A KR1020080056555 A KR 1020080056555A KR 20080056555 A KR20080056555 A KR 20080056555A KR 20080058318 A KR20080058318 A KR 20080058318A
- Authority
- KR
- South Korea
- Prior art keywords
- polishing
- semiconductor wafer
- substrate
- top ring
- pressure chamber
- Prior art date
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 145
- 238000005498 polishing Methods 0.000 claims abstract description 161
- 239000010409 thin film Substances 0.000 claims abstract description 46
- 239000010408 film Substances 0.000 claims abstract description 25
- 239000012530 fluid Substances 0.000 claims description 117
- 238000003825 pressing Methods 0.000 claims description 63
- 238000004891 communication Methods 0.000 claims description 24
- 238000000034 method Methods 0.000 claims description 14
- 239000000919 ceramic Substances 0.000 claims description 6
- 229920001971 elastomer Polymers 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 6
- 239000011810 insulating material Substances 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 238000009826 distribution Methods 0.000 abstract description 25
- 239000012774 insulation material Substances 0.000 abstract 1
- 239000004065 semiconductor Substances 0.000 description 189
- 239000012528 membrane Substances 0.000 description 75
- 239000007788 liquid Substances 0.000 description 27
- 230000002093 peripheral effect Effects 0.000 description 14
- 238000004140 cleaning Methods 0.000 description 11
- 230000001965 increasing effect Effects 0.000 description 11
- 238000000151 deposition Methods 0.000 description 8
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 8
- 230000008859 change Effects 0.000 description 6
- 239000010410 layer Substances 0.000 description 6
- 230000007246 mechanism Effects 0.000 description 6
- 239000013013 elastic material Substances 0.000 description 5
- 239000002245 particle Substances 0.000 description 5
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- 230000008021 deposition Effects 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- 229920000181 Ethylene propylene rubber Polymers 0.000 description 3
- 239000011230 binding agent Substances 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 3
- 230000001276 controlling effect Effects 0.000 description 3
- 230000005489 elastic deformation Effects 0.000 description 3
- 238000007517 polishing process Methods 0.000 description 3
- 229920003225 polyurethane elastomer Polymers 0.000 description 3
- 229920002379 silicone rubber Polymers 0.000 description 3
- 239000004945 silicone rubber Substances 0.000 description 3
- 229920001897 terpolymer Polymers 0.000 description 3
- 229920002943 EPDM rubber Polymers 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- HQQADJVZYDDRJT-UHFFFAOYSA-N ethene;prop-1-ene Chemical group C=C.CC=C HQQADJVZYDDRJT-UHFFFAOYSA-N 0.000 description 2
- 239000006260 foam Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 229920002635 polyurethane Polymers 0.000 description 2
- 239000004814 polyurethane Substances 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 239000003082 abrasive agent Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910000420 cerium oxide Inorganic materials 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000010485 coping Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000003028 elevating effect Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 238000007667 floating Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 238000005459 micromachining Methods 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- BMMGVYCKOGBVEV-UHFFFAOYSA-N oxo(oxoceriooxy)cerium Chemical compound [Ce]=O.O=[Ce]=O BMMGVYCKOGBVEV-UHFFFAOYSA-N 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 239000012260 resinous material Substances 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/30—Work carriers for single side lapping of plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/06—Work supports, e.g. adjustable steadies
- B24B41/061—Work supports, e.g. adjustable steadies axially supporting turning workpieces, e.g. magnetically, pneumatically
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
Description
Claims (6)
- 폴리싱면을 구비한 폴리싱 테이블, 및폴리싱 대상물인 기판을 유지하는 톱링을 구비하는 폴리싱장치에 있어서,상기 톱링은, 톱링 본체를 구비하고,상기 톱링 본체 내에는, 상기 기판과 접촉하게 되는 탄성 패드와, 상기 탄성 패드를 지지하고, 절연성 재료로 이루어지는 지지부재를 구비하며,상기 폴리싱장치는, 와전류를 이용하여 상기 기판에 형성된 박막의 막 두께를 측정하여 상기 기판에 대한 가압력을 제어하도록 구성된 것을 특징으로 하는 폴리싱장치.
- 제 1항에 있어서,상기 지지부재는, 플루오르화 수지 또는 세라믹으로 이루어지는 것을 특징으로 하는 폴리싱장치.
- 제 2항에 있어서,상기 탄성 패드는, 상기 지지부재의 하면을 덮음으로써 공간을 형성하고, 상기 공간에는, 상기 탄성 패드에 접촉하는 중앙 접촉부재 및 외측 접촉부재가 설치되고, 상기 탄성 패드, 중앙 접촉부재, 외측 접촉부재는 모두 고무재로 형성되어 있는 것을 특징으로 하는 폴리싱장치.
- 제 3항에 있어서,상기 중앙 접촉부재 및 외측 접촉부재는 각각 압력챔버를 형성하고, 상기 각각의 압력챔버에는 유체로가 연통되어 있는 것을 특징으로 하는 폴리싱장치.
- 제 4항에 있어서,상기 탄성 패드와 상기 지지부재에 의하여 형성된 공간에는 유체로가 연통되어 있는 것을 특징으로 하는 폴리싱장치.
- 폴리싱 대상물인 기판을 톱링에 유지하고, 폴리싱 테이블의 폴리싱면과 접촉하게 하여 폴리싱하는 기판 폴리싱방법에 있어서,와전류에 의하여 상기 기판에 형성된 박막의 막 두께를 측정하고, 상기 기판의 폴리싱면에 대한 가압력을 제어하면서 폴리싱을 행하는 것을 특징으로 하는 기판폴리싱방법.
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000311071 | 2000-10-11 | ||
JPJP-P-2000-00311071 | 2000-10-11 | ||
JPJP-P-2001-00013899 | 2001-01-22 | ||
JP2001013899A JP2002187060A (ja) | 2000-10-11 | 2001-01-22 | 基板保持装置、ポリッシング装置、及び研磨方法 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020010062477A Division KR100874148B1 (ko) | 2000-10-11 | 2001-10-10 | 기판 유지 장치 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20080058318A true KR20080058318A (ko) | 2008-06-25 |
KR100874712B1 KR100874712B1 (ko) | 2008-12-18 |
Family
ID=26601900
Family Applications (5)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020010062477A KR100874148B1 (ko) | 2000-10-11 | 2001-10-10 | 기판 유지 장치 |
KR1020080006629A KR100939555B1 (ko) | 2000-10-11 | 2008-01-22 | 기판 유지 장치 |
KR1020080056555A KR100874712B1 (ko) | 2000-10-11 | 2008-06-16 | 기판 유지 장치 |
KR1020090061614A KR101000420B1 (ko) | 2000-10-11 | 2009-07-07 | 가압 시트 |
KR1020090061609A KR100973766B1 (ko) | 2000-10-11 | 2009-07-07 | 탄성 패드 및 톱링 |
Family Applications Before (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020010062477A KR100874148B1 (ko) | 2000-10-11 | 2001-10-10 | 기판 유지 장치 |
KR1020080006629A KR100939555B1 (ko) | 2000-10-11 | 2008-01-22 | 기판 유지 장치 |
Family Applications After (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020090061614A KR101000420B1 (ko) | 2000-10-11 | 2009-07-07 | 가압 시트 |
KR1020090061609A KR100973766B1 (ko) | 2000-10-11 | 2009-07-07 | 탄성 패드 및 톱링 |
Country Status (7)
Country | Link |
---|---|
US (4) | US6852019B2 (ko) |
EP (4) | EP1852220A1 (ko) |
JP (1) | JP2002187060A (ko) |
KR (5) | KR100874148B1 (ko) |
DE (1) | DE60137007D1 (ko) |
SG (1) | SG97201A1 (ko) |
TW (1) | TW576773B (ko) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20180006483A (ko) * | 2014-03-27 | 2018-01-17 | 가부시키가이샤 에바라 세이사꾸쇼 | 탄성막, 기판 보유 지지 장치 및 연마 장치 |
Families Citing this family (68)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7198561B2 (en) * | 2000-07-25 | 2007-04-03 | Applied Materials, Inc. | Flexible membrane for multi-chamber carrier head |
JP2002187060A (ja) * | 2000-10-11 | 2002-07-02 | Ebara Corp | 基板保持装置、ポリッシング装置、及び研磨方法 |
JP2002208563A (ja) * | 2001-01-09 | 2002-07-26 | Ebara Corp | 被加工物の加工装置及び加工方法 |
US6939206B2 (en) | 2001-03-12 | 2005-09-06 | Asm Nutool, Inc. | Method and apparatus of sealing wafer backside for full-face electrochemical plating |
US6855037B2 (en) | 2001-03-12 | 2005-02-15 | Asm-Nutool, Inc. | Method of sealing wafer backside for full-face electrochemical plating |
KR100470227B1 (ko) * | 2001-06-07 | 2005-02-05 | 두산디앤디 주식회사 | 화학기계적 연마장치의 캐리어 헤드 |
JP3970561B2 (ja) * | 2001-07-10 | 2007-09-05 | 株式会社荏原製作所 | 基板保持装置及び基板研磨装置 |
US6863771B2 (en) * | 2001-07-25 | 2005-03-08 | Micron Technology, Inc. | Differential pressure application apparatus for use in polishing layers of semiconductor device structures and methods |
KR100939556B1 (ko) | 2001-12-06 | 2010-01-29 | 가부시키가이샤 에바라 세이사꾸쇼 | 탄성막 및 플렉시블 막 |
JP4353673B2 (ja) * | 2002-04-18 | 2009-10-28 | 株式会社荏原製作所 | ポリッシング方法 |
TWI238754B (en) * | 2002-11-07 | 2005-09-01 | Ebara Tech Inc | Vertically adjustable chemical mechanical polishing head having a pivot mechanism and method for use thereof |
JP4448297B2 (ja) * | 2002-12-27 | 2010-04-07 | 株式会社荏原製作所 | 基板研磨装置及び基板研磨方法 |
CN101306512A (zh) * | 2002-12-27 | 2008-11-19 | 株式会社荏原制作所 | 基片抛光设备 |
KR100481872B1 (ko) * | 2003-01-14 | 2005-04-11 | 삼성전자주식회사 | 폴리싱 헤드 및 화학적 기계적 연마 장치 |
KR100916829B1 (ko) | 2003-02-10 | 2009-09-14 | 가부시키가이샤 에바라 세이사꾸쇼 | 탄성 막 |
US7288465B2 (en) * | 2003-04-15 | 2007-10-30 | International Business Machines Corpoartion | Semiconductor wafer front side protection |
JP2005011977A (ja) * | 2003-06-18 | 2005-01-13 | Ebara Corp | 基板研磨装置および基板研磨方法 |
AU2003250921A1 (en) * | 2003-07-09 | 2005-01-28 | Peter Wolters Surface Technologies Gmbh And Co. Kg | Holder for flat workpieces, in particular semiconductor wafers for mechanochemical polishing |
US7055229B2 (en) * | 2003-12-31 | 2006-06-06 | Intel Corporation | Support system for semiconductor wafers and methods thereof |
US7566385B2 (en) * | 2004-02-23 | 2009-07-28 | E. I. Du Pont De Nemours And Company | Apparatus adapted for membrane-mediated electropolishing |
JP2005268566A (ja) * | 2004-03-19 | 2005-09-29 | Ebara Corp | 化学機械研磨装置の基板把持機構のヘッド構造 |
JP4822744B2 (ja) * | 2004-06-04 | 2011-11-24 | 三星電子株式会社 | 化学機械的研磨装置、キャリアヘッド及び区画リング |
EP2690652A3 (en) | 2004-11-01 | 2014-04-16 | Ebara Corporation | Polishing apparatus |
TWI386989B (zh) | 2005-02-25 | 2013-02-21 | Ebara Corp | 研磨裝置及研磨方法 |
JP4844186B2 (ja) * | 2005-03-18 | 2011-12-28 | 株式会社ニコン | プレート部材、基板保持装置、露光装置及び露光方法、並びにデバイス製造方法 |
JP2006305713A (ja) * | 2005-03-28 | 2006-11-09 | Nikon Corp | 吸着装置、研磨装置、半導体デバイス及び半導体デバイス製造方法 |
US7207871B1 (en) * | 2005-10-06 | 2007-04-24 | Applied Materials, Inc. | Carrier head with multiple chambers |
JP4787063B2 (ja) * | 2005-12-09 | 2011-10-05 | 株式会社荏原製作所 | 研磨装置及び研磨方法 |
US7364496B2 (en) * | 2006-03-03 | 2008-04-29 | Inopla Inc. | Polishing head for polishing semiconductor wafers |
DE202006004193U1 (de) * | 2006-03-14 | 2006-06-08 | Richter, Harald | Adapterplatte für einen Vakuumsauger |
JP4814677B2 (ja) * | 2006-03-31 | 2011-11-16 | 株式会社荏原製作所 | 基板保持装置および研磨装置 |
US20070238261A1 (en) * | 2006-04-05 | 2007-10-11 | Asml Netherlands B.V. | Device, lithographic apparatus and device manufacturing method |
JP4996331B2 (ja) * | 2007-05-17 | 2012-08-08 | 株式会社荏原製作所 | 基板研磨装置および基板研磨方法 |
JP4703608B2 (ja) * | 2007-06-28 | 2011-06-15 | 株式会社東芝 | ディスクリートトラック媒体の製造方法 |
US8194232B2 (en) * | 2007-07-24 | 2012-06-05 | Nikon Corporation | Movable body drive method and movable body drive system, pattern formation method and apparatus, exposure method and apparatus, position control method and position control system, and device manufacturing method |
DE102007041209B4 (de) * | 2007-08-31 | 2017-11-23 | Globalfoundries Dresden Module One Limited Liability Company & Co. Kg | Polierkopf, der Zonenkontrolle verwendet |
KR20100094466A (ko) * | 2007-11-20 | 2010-08-26 | 신에쯔 한도타이 가부시키가이샤 | 연마 헤드 및 연마 장치 |
JP5248127B2 (ja) * | 2008-01-30 | 2013-07-31 | 株式会社荏原製作所 | 研磨方法及び研磨装置 |
JP5377873B2 (ja) * | 2008-03-18 | 2013-12-25 | 株式会社東京精密 | ウェーハ研磨装置及び該研磨装置を用いたウェーハ研磨方法 |
JP5390807B2 (ja) * | 2008-08-21 | 2014-01-15 | 株式会社荏原製作所 | 研磨方法および装置 |
JP4833355B2 (ja) | 2008-08-29 | 2011-12-07 | 信越半導体株式会社 | 研磨ヘッド及び研磨装置 |
JP5392483B2 (ja) * | 2009-08-31 | 2014-01-22 | 不二越機械工業株式会社 | 研磨装置 |
JP5197644B2 (ja) * | 2010-02-08 | 2013-05-15 | 株式会社荏原製作所 | 研磨装置及び研磨方法 |
JP5648954B2 (ja) * | 2010-08-31 | 2015-01-07 | 不二越機械工業株式会社 | 研磨装置 |
KR101283285B1 (ko) | 2011-07-07 | 2013-07-11 | 단국대학교 산학협력단 | 유체 누설 공급 장치 |
US20130078812A1 (en) * | 2011-09-23 | 2013-03-28 | Strasbaugh | Wafer Carrier with Flexible Pressure Plate |
JP2011255505A (ja) * | 2011-09-26 | 2011-12-22 | Ebara Corp | 研磨装置 |
KR101244221B1 (ko) | 2011-12-08 | 2013-03-18 | 주식회사 케이씨텍 | 캐리어 헤드의 멤브레인 |
US9706605B2 (en) * | 2012-03-30 | 2017-07-11 | Applied Materials, Inc. | Substrate support with feedthrough structure |
US9016675B2 (en) * | 2012-07-06 | 2015-04-28 | Asm Technology Singapore Pte Ltd | Apparatus and method for supporting a workpiece during processing |
JP6158637B2 (ja) * | 2012-08-28 | 2017-07-05 | 株式会社荏原製作所 | 弾性膜及び基板保持装置 |
US9610672B2 (en) | 2014-06-27 | 2017-04-04 | Applied Materials, Inc. | Configurable pressure design for multizone chemical mechanical planarization polishing head |
JP6463303B2 (ja) * | 2016-05-13 | 2019-01-30 | 株式会社荏原製作所 | 弾性膜、基板保持装置、基板研磨装置、基板保持装置における基板吸着判定方法および圧力制御方法 |
JP2017094441A (ja) * | 2015-11-24 | 2017-06-01 | 株式会社荏原製作所 | 基板研磨装置の校正方法、校正装置および校正プログラム |
KR102160328B1 (ko) * | 2017-02-01 | 2020-09-25 | 강준모 | 화학기계적연마장치용 캐리어헤드 |
CN208584374U (zh) * | 2018-02-26 | 2019-03-08 | 凯斯科技股份有限公司 | 基板处理装置 |
JP7003838B2 (ja) | 2018-05-17 | 2022-01-21 | 株式会社Sumco | 研磨ヘッド及びこれを用いたウェーハ研磨装置及び研磨方法 |
US20200055160A1 (en) * | 2018-08-14 | 2020-02-20 | Taiwan Semiconductor Manufacturing Co., Ltd. | Chemical mechanical polishing method and apparatus |
JP7349791B2 (ja) * | 2019-01-16 | 2023-09-25 | 株式会社東京精密 | Cmp装置 |
US11325223B2 (en) * | 2019-08-23 | 2022-05-10 | Applied Materials, Inc. | Carrier head with segmented substrate chuck |
JP7352168B2 (ja) | 2019-11-06 | 2023-09-28 | 三益半導体工業株式会社 | 搬送ヘッドおよび搬送装置 |
KR20210061273A (ko) * | 2019-11-19 | 2021-05-27 | 가부시키가이샤 에바라 세이사꾸쇼 | 기판을 보유 지지하기 위한 톱링 및 기판 처리 장치 |
KR20220122720A (ko) * | 2020-06-26 | 2022-09-02 | 어플라이드 머티어리얼스, 인코포레이티드 | 변형가능한 기판 척 |
WO2022005919A1 (en) | 2020-06-29 | 2022-01-06 | Applied Materials, Inc | Polishing carrier head with multiple angular pressurizable zones |
CN111823129B (zh) * | 2020-07-17 | 2021-11-19 | 中国科学院微电子研究所 | 研磨头气动装置及研磨头 |
CN112355887B (zh) * | 2020-11-10 | 2021-09-17 | 蚌埠高华电子股份有限公司 | 一种磁吸定位式揭片辅助器及其使用方法 |
US20240082983A1 (en) * | 2021-03-17 | 2024-03-14 | Micro Engineering, Inc. | Polishing head, and polishing treatment device |
CN113977451B (zh) * | 2021-10-25 | 2023-08-25 | 长鑫存储技术有限公司 | 半导体设备的检测系统及检测方法 |
Family Cites Families (39)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03234468A (ja) * | 1990-02-06 | 1991-10-18 | Canon Inc | スタンパの金型取付面の研磨方法およびその研磨機 |
JP3311116B2 (ja) | 1993-10-28 | 2002-08-05 | 株式会社東芝 | 半導体製造装置 |
US5820448A (en) * | 1993-12-27 | 1998-10-13 | Applied Materials, Inc. | Carrier head with a layer of conformable material for a chemical mechanical polishing system |
US5643053A (en) | 1993-12-27 | 1997-07-01 | Applied Materials, Inc. | Chemical mechanical polishing apparatus with improved polishing control |
JPH07241764A (ja) | 1994-03-04 | 1995-09-19 | Fujitsu Ltd | 研磨装置と研磨方法 |
JP3158934B2 (ja) * | 1995-02-28 | 2001-04-23 | 三菱マテリアル株式会社 | ウェーハ研磨装置 |
US5559428A (en) | 1995-04-10 | 1996-09-24 | International Business Machines Corporation | In-situ monitoring of the change in thickness of films |
US5908530A (en) | 1995-05-18 | 1999-06-01 | Obsidian, Inc. | Apparatus for chemical mechanical polishing |
JP3724869B2 (ja) | 1995-10-09 | 2005-12-07 | 株式会社荏原製作所 | ポリッシング装置および方法 |
US6146259A (en) | 1996-11-08 | 2000-11-14 | Applied Materials, Inc. | Carrier head with local pressure control for a chemical mechanical polishing apparatus |
US6183354B1 (en) * | 1996-11-08 | 2001-02-06 | Applied Materials, Inc. | Carrier head with a flexible membrane for a chemical mechanical polishing system |
US5941758A (en) | 1996-11-13 | 1999-08-24 | Intel Corporation | Method and apparatus for chemical-mechanical polishing |
JP3303963B2 (ja) | 1997-01-20 | 2002-07-22 | 株式会社東京精密 | ウェーハの厚み加工量測定装置 |
US6056632A (en) * | 1997-02-13 | 2000-05-02 | Speedfam-Ipec Corp. | Semiconductor wafer polishing apparatus with a variable polishing force wafer carrier head |
US5882245A (en) * | 1997-02-28 | 1999-03-16 | Advanced Ceramics Research, Inc. | Polymer carrier gears for polishing of flat objects |
TW431942B (en) * | 1997-04-04 | 2001-05-01 | Tokyo Seimitsu Co Ltd | Polishing device |
JP3027551B2 (ja) | 1997-07-03 | 2000-04-04 | キヤノン株式会社 | 基板保持装置ならびに該基板保持装置を用いた研磨方法および研磨装置 |
US5964653A (en) | 1997-07-11 | 1999-10-12 | Applied Materials, Inc. | Carrier head with a flexible membrane for a chemical mechanical polishing system |
JPH11129154A (ja) | 1997-10-31 | 1999-05-18 | Tokyo Seimitsu Co Ltd | 半導体ウェーハの研磨装置 |
JPH11226865A (ja) | 1997-12-11 | 1999-08-24 | Speedfam Co Ltd | キャリア及びcmp装置 |
JP3086437B2 (ja) | 1997-12-15 | 2000-09-11 | 松下電器産業株式会社 | 化学的機械研磨装置及び化学的機械研磨方法 |
US6080050A (en) * | 1997-12-31 | 2000-06-27 | Applied Materials, Inc. | Carrier head including a flexible membrane and a compliant backing member for a chemical mechanical polishing apparatus |
JPH11262857A (ja) * | 1998-03-18 | 1999-09-28 | Rohm Co Ltd | 半導体ウェハの研磨装置 |
JPH11294503A (ja) | 1998-04-06 | 1999-10-29 | Shinko Electric Co Ltd | 無人搬送車の位置決め装置 |
US6210255B1 (en) | 1998-09-08 | 2001-04-03 | Applied Materials, Inc. | Carrier head for chemical mechanical polishing a substrate |
US6159079A (en) | 1998-09-08 | 2000-12-12 | Applied Materials, Inc. | Carrier head for chemical mechanical polishing a substrate |
US6165058A (en) | 1998-12-09 | 2000-12-26 | Applied Materials, Inc. | Carrier head for chemical mechanical polishing |
US6422927B1 (en) | 1998-12-30 | 2002-07-23 | Applied Materials, Inc. | Carrier head with controllable pressure and loading area for chemical mechanical polishing |
US6093089A (en) * | 1999-01-25 | 2000-07-25 | United Microelectronics Corp. | Apparatus for controlling uniformity of polished material |
JP3859381B2 (ja) | 1999-02-09 | 2006-12-20 | 株式会社荏原製作所 | 基板把持装置及び研磨装置 |
US6368189B1 (en) | 1999-03-03 | 2002-04-09 | Mitsubishi Materials Corporation | Apparatus and method for chemical-mechanical polishing (CMP) head having direct pneumatic wafer polishing pressure |
JP2000263421A (ja) | 1999-03-11 | 2000-09-26 | Toshiba Mach Co Ltd | ポリシング装置 |
US6527624B1 (en) * | 1999-03-26 | 2003-03-04 | Applied Materials, Inc. | Carrier head for providing a polishing slurry |
US6077151A (en) * | 1999-05-17 | 2000-06-20 | Vlsi Technology, Inc. | Temperature control carrier head for chemical mechanical polishing process |
US6776692B1 (en) | 1999-07-09 | 2004-08-17 | Applied Materials Inc. | Closed-loop control of wafer polishing in a chemical mechanical polishing system |
SG90746A1 (en) | 1999-10-15 | 2002-08-20 | Ebara Corp | Apparatus and method for polishing workpiece |
US6450868B1 (en) * | 2000-03-27 | 2002-09-17 | Applied Materials, Inc. | Carrier head with multi-part flexible membrane |
US6857945B1 (en) | 2000-07-25 | 2005-02-22 | Applied Materials, Inc. | Multi-chamber carrier head with a flexible membrane |
JP2002187060A (ja) * | 2000-10-11 | 2002-07-02 | Ebara Corp | 基板保持装置、ポリッシング装置、及び研磨方法 |
-
2001
- 2001-01-22 JP JP2001013899A patent/JP2002187060A/ja active Pending
- 2001-10-09 SG SG200106234A patent/SG97201A1/en unknown
- 2001-10-09 TW TW090124898A patent/TW576773B/zh not_active IP Right Cessation
- 2001-10-10 KR KR1020010062477A patent/KR100874148B1/ko active IP Right Grant
- 2001-10-11 EP EP07014804A patent/EP1852220A1/en not_active Withdrawn
- 2001-10-11 DE DE60137007T patent/DE60137007D1/de not_active Expired - Lifetime
- 2001-10-11 EP EP08007317A patent/EP1944123B1/en not_active Expired - Lifetime
- 2001-10-11 EP EP01124458A patent/EP1197292B1/en not_active Expired - Lifetime
- 2001-10-11 US US09/973,842 patent/US6852019B2/en not_active Expired - Lifetime
- 2001-10-11 EP EP08007303A patent/EP1935566B1/en not_active Expired - Lifetime
-
2005
- 2005-01-05 US US11/028,629 patent/US7083507B2/en not_active Expired - Lifetime
-
2006
- 2006-06-14 US US11/452,218 patent/US7491117B2/en not_active Expired - Lifetime
-
2008
- 2008-01-22 KR KR1020080006629A patent/KR100939555B1/ko active IP Right Grant
- 2008-06-16 KR KR1020080056555A patent/KR100874712B1/ko active IP Right Grant
- 2008-10-16 US US12/285,936 patent/US7850509B2/en not_active Expired - Fee Related
-
2009
- 2009-07-07 KR KR1020090061614A patent/KR101000420B1/ko active IP Right Grant
- 2009-07-07 KR KR1020090061609A patent/KR100973766B1/ko active IP Right Grant
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20180006483A (ko) * | 2014-03-27 | 2018-01-17 | 가부시키가이샤 에바라 세이사꾸쇼 | 탄성막, 기판 보유 지지 장치 및 연마 장치 |
US10213896B2 (en) | 2014-03-27 | 2019-02-26 | Ebara Corporation | Elastic membrane, substrate holding apparatus, and polishing apparatus |
Also Published As
Publication number | Publication date |
---|---|
EP1935566A2 (en) | 2008-06-25 |
EP1197292A3 (en) | 2002-07-31 |
KR20020028845A (ko) | 2002-04-17 |
KR100874148B1 (ko) | 2008-12-15 |
EP1944123A3 (en) | 2008-07-23 |
KR20090082329A (ko) | 2009-07-30 |
EP1935566B1 (en) | 2012-05-16 |
US7083507B2 (en) | 2006-08-01 |
EP1944123A2 (en) | 2008-07-16 |
EP1852220A1 (en) | 2007-11-07 |
KR101000420B1 (ko) | 2010-12-13 |
KR100939555B1 (ko) | 2010-01-29 |
EP1944123B1 (en) | 2011-07-13 |
JP2002187060A (ja) | 2002-07-02 |
KR100973766B1 (ko) | 2010-08-04 |
EP1935566A3 (en) | 2008-07-23 |
KR100874712B1 (ko) | 2008-12-18 |
US20020042246A1 (en) | 2002-04-11 |
DE60137007D1 (de) | 2009-01-29 |
US20060234609A1 (en) | 2006-10-19 |
TW576773B (en) | 2004-02-21 |
EP1197292B1 (en) | 2008-12-17 |
US20090061748A1 (en) | 2009-03-05 |
US6852019B2 (en) | 2005-02-08 |
SG97201A1 (en) | 2003-07-18 |
KR20080011240A (ko) | 2008-01-31 |
US7850509B2 (en) | 2010-12-14 |
KR20090099037A (ko) | 2009-09-21 |
US7491117B2 (en) | 2009-02-17 |
US20050118935A1 (en) | 2005-06-02 |
EP1197292A2 (en) | 2002-04-17 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR100874712B1 (ko) | 기판 유지 장치 | |
US7632173B2 (en) | Substrate holding apparatus and polishing apparatus | |
US7897007B2 (en) | Substrate holding apparatus and substrate polishing apparatus | |
KR101044738B1 (ko) | 기판홀딩장치, 폴리싱장치 및 기판홀딩장치에 의해 기판을 홀딩하고 폴리싱 표면에 대해 기판을 프레스하는 방법 | |
JP4107835B2 (ja) | 基板保持装置及びポリッシング装置 | |
JP3989234B2 (ja) | 基板保持装置及びポリッシング装置 | |
JP4049579B2 (ja) | 基板保持装置及びポリッシング装置 | |
JP3856634B2 (ja) | 基板保持装置及び該基板保持装置を備えたポリッシング装置 | |
JP2008188767A (ja) | 基板保持装置 | |
JP4620072B2 (ja) | ポリッシング装置 | |
JP3902715B2 (ja) | ポリッシング装置 | |
JP2008066761A (ja) | 基板保持装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A107 | Divisional application of patent | ||
A201 | Request for examination | ||
E701 | Decision to grant or registration of patent right | ||
GRNT | Written decision to grant | ||
FPAY | Annual fee payment |
Payment date: 20121121 Year of fee payment: 5 |
|
FPAY | Annual fee payment |
Payment date: 20131118 Year of fee payment: 6 |
|
FPAY | Annual fee payment |
Payment date: 20141120 Year of fee payment: 7 |
|
FPAY | Annual fee payment |
Payment date: 20151118 Year of fee payment: 8 |
|
FPAY | Annual fee payment |
Payment date: 20161123 Year of fee payment: 9 |
|
FPAY | Annual fee payment |
Payment date: 20171117 Year of fee payment: 10 |
|
FPAY | Annual fee payment |
Payment date: 20181115 Year of fee payment: 11 |