KR20080011240A - 기판 유지 장치 - Google Patents
기판 유지 장치 Download PDFInfo
- Publication number
- KR20080011240A KR20080011240A KR1020080006629A KR20080006629A KR20080011240A KR 20080011240 A KR20080011240 A KR 20080011240A KR 1020080006629 A KR1020080006629 A KR 1020080006629A KR 20080006629 A KR20080006629 A KR 20080006629A KR 20080011240 A KR20080011240 A KR 20080011240A
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- South Korea
- Prior art keywords
- pressure chamber
- semiconductor wafer
- substrate
- contact
- elastic
- Prior art date
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- BMMGVYCKOGBVEV-UHFFFAOYSA-N oxo(oxoceriooxy)cerium Chemical compound [Ce]=O.O=[Ce]=O BMMGVYCKOGBVEV-UHFFFAOYSA-N 0.000 description 1
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Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/30—Work carriers for single side lapping of plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/06—Work supports, e.g. adjustable steadies
- B24B41/061—Work supports, e.g. adjustable steadies axially supporting turning workpieces, e.g. magnetically, pneumatically
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
Description
Claims (15)
- 폴리싱될 기판을 유지시키고, 상기 기판을 폴리싱면에 대하여 가압하는 기판 유지 장치에 있어서,기판을 유지시키는 톱 링 본체;상기 기판과 접촉하게 되는 탄성 패드;상기 탄성 패드를 지지하는 지지 부재;상기 지지 부재의 하부면 상에 장착되고, 상기 탄성 패드와 접촉하게 되는 탄성 멤브레인을 각각 구비하며, 상기 탄성 패드에 대해 독립적으로 가압되는 복수의 접촉 부재;상기 접촉 부재 내에 형성되는 제1압력챔버;상기 접촉 부재의 외측에 형성되는 제2압력챔버; 및상기 제1압력챔버와 제2압력챔버 안으로 유체를 독립적으로 공급하거나 상기 제1압력챔버 및 상기 제압력2챔버 내부를 진공 상태로 만드는 유체원을 포함하여 이루어지는 것을 특징으로 하는 기판 유지 장치.
- 제 1항에 있어서,상기 복수의 접촉 부재는 기설정된 간격으로 떨어져 있는 것을 특징으로 하는 기판 유지 장치.
- 제 1항에 있어서,상기 유체원은 온도가 제어된 유체를 상기 제1압력챔버 및 상기 제2압력챔버 안으로 각각 공급하는 것을 특징으로 하는 기판 유지 장치.
- 제 1항에 있어서,상기 제1압력챔버로 공급되는 상기 유체가 상기 기판의 접촉면과 접촉하도록 하는 연통부가 상기 접촉 부재의 상기 탄성 멤브레인의 하부면 내에 형성되는 것을 특징으로 하는 기판 유지 장치.
- 제 1항에 있어서,상기 접촉 부재는 상기 탄성 멤브레인을 분리가능하게 유지시키는 유지 부재를 포함하는 것을 특징으로 하는 기판 유지 장치.
- 제 5항에 있어서,상기 접촉 부재의 상기 유지 부재는 상기 지지 부재 상에 분리가능하게 장착되는 것을 특징으로 하는 기판 유지 장치.
- 제 1항에 있어서,상기 접촉 부재의 상기 탄성 멤브레인의 원주 에지로부터 반경 방향으로 돌출하는 돌출부가 상기 탄성 멤브레인의 하부면 상에 제공되는 것을 특징으로 하는 기판 유지 장치.
- 제 1항에 있어서,상기 접촉 부재는 상기 기판의 중앙부에 대응하는 위치에 배치된 중앙 접촉 부재와, 상기 중앙 접촉 부재의 외측에 배치된 외측 접촉 부재를 포함하는 것을 특징으로 하는 기판 유지 장치.
- 제 8항에 있어서,상기 외측 접촉 부재는 상기 기판의 외측 주위부에 대응하는 위치에 장착되는 것을 특징으로 하는 기판 유지 장치.
- 제 9항에 있어서,상기 기판의 주위 부분을 유지시키기 위하여 상기 톱 링 본체에 고정되거나 상기 톱 링 본체와 일체형으로 성형되는 리테이너 링을 더 포함하는 것을 특징으로 하는 기판 유지 장치.
- 제 10항에 있어서,상기 톱 링 본체는 그 내부에 형성되어, 상기 탄성 패드의 외주면과 상기 리테이너 링 사이에 형성된 갭 안으로 세정액을 공급하는 세정액 통로를 포함하는 것을 특징으로 하는 기판 유지 장치.
- 제 10항에 있어서,상기 리테이너 링은, 상기 리테이너 링과 상기 톱 링 본체 사이에 탄성 부재를 개재하지 않고, 상기 톱 링 본체에 고정되는 것을 특징으로 하는 기판 유지 장치.
- 제 1항에 있어서,상기 접촉 부재의 상기 탄성 멤브레인은 부분적으로 상이한 두께를 가지는 것을 특징으로 하는 기판 유지 장치.
- 제 1항에 있어서,상기 접촉 부재의 상기 탄성 멤브레인은 부분적으로 비탄성 부재를 포함하는 것을 특징으로 하는 기판 유지 장치.
- 제 1에 있어서,상기 지지 부재는 절연 물질로 만들어지는 것을 특징으로 하는 기판 유지 장치.
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000311071 | 2000-10-11 | ||
JPJP-P-2000-00311071 | 2000-10-11 | ||
JP2001013899A JP2002187060A (ja) | 2000-10-11 | 2001-01-22 | 基板保持装置、ポリッシング装置、及び研磨方法 |
JPJP-P-2001-00013899 | 2001-01-22 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020010062477A Division KR100874148B1 (ko) | 2000-10-11 | 2001-10-10 | 기판 유지 장치 |
Related Child Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020090061609A Division KR100973766B1 (ko) | 2000-10-11 | 2009-07-07 | 탄성 패드 및 톱링 |
KR1020090061614A Division KR101000420B1 (ko) | 2000-10-11 | 2009-07-07 | 가압 시트 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20080011240A true KR20080011240A (ko) | 2008-01-31 |
KR100939555B1 KR100939555B1 (ko) | 2010-01-29 |
Family
ID=26601900
Family Applications (5)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020010062477A KR100874148B1 (ko) | 2000-10-11 | 2001-10-10 | 기판 유지 장치 |
KR1020080006629A KR100939555B1 (ko) | 2000-10-11 | 2008-01-22 | 기판 유지 장치 |
KR1020080056555A KR100874712B1 (ko) | 2000-10-11 | 2008-06-16 | 기판 유지 장치 |
KR1020090061609A KR100973766B1 (ko) | 2000-10-11 | 2009-07-07 | 탄성 패드 및 톱링 |
KR1020090061614A KR101000420B1 (ko) | 2000-10-11 | 2009-07-07 | 가압 시트 |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020010062477A KR100874148B1 (ko) | 2000-10-11 | 2001-10-10 | 기판 유지 장치 |
Family Applications After (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020080056555A KR100874712B1 (ko) | 2000-10-11 | 2008-06-16 | 기판 유지 장치 |
KR1020090061609A KR100973766B1 (ko) | 2000-10-11 | 2009-07-07 | 탄성 패드 및 톱링 |
KR1020090061614A KR101000420B1 (ko) | 2000-10-11 | 2009-07-07 | 가압 시트 |
Country Status (7)
Country | Link |
---|---|
US (4) | US6852019B2 (ko) |
EP (4) | EP1197292B1 (ko) |
JP (1) | JP2002187060A (ko) |
KR (5) | KR100874148B1 (ko) |
DE (1) | DE60137007D1 (ko) |
SG (1) | SG97201A1 (ko) |
TW (1) | TW576773B (ko) |
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JP2002208563A (ja) * | 2001-01-09 | 2002-07-26 | Ebara Corp | 被加工物の加工装置及び加工方法 |
US6855037B2 (en) | 2001-03-12 | 2005-02-15 | Asm-Nutool, Inc. | Method of sealing wafer backside for full-face electrochemical plating |
US6939206B2 (en) * | 2001-03-12 | 2005-09-06 | Asm Nutool, Inc. | Method and apparatus of sealing wafer backside for full-face electrochemical plating |
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US20020042246A1 (en) | 2002-04-11 |
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SG97201A1 (en) | 2003-07-18 |
US20050118935A1 (en) | 2005-06-02 |
US7083507B2 (en) | 2006-08-01 |
EP1197292A3 (en) | 2002-07-31 |
US20060234609A1 (en) | 2006-10-19 |
EP1944123B1 (en) | 2011-07-13 |
KR20090082329A (ko) | 2009-07-30 |
EP1935566A2 (en) | 2008-06-25 |
EP1935566A3 (en) | 2008-07-23 |
US6852019B2 (en) | 2005-02-08 |
EP1935566B1 (en) | 2012-05-16 |
JP2002187060A (ja) | 2002-07-02 |
EP1197292B1 (en) | 2008-12-17 |
KR100874712B1 (ko) | 2008-12-18 |
KR20020028845A (ko) | 2002-04-17 |
TW576773B (en) | 2004-02-21 |
EP1944123A2 (en) | 2008-07-16 |
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