SG92806A1 - Alignment method and apparatus for aligning cutting blade - Google Patents

Alignment method and apparatus for aligning cutting blade

Info

Publication number
SG92806A1
SG92806A1 SG200103979A SG200103979A SG92806A1 SG 92806 A1 SG92806 A1 SG 92806A1 SG 200103979 A SG200103979 A SG 200103979A SG 200103979 A SG200103979 A SG 200103979A SG 92806 A1 SG92806 A1 SG 92806A1
Authority
SG
Singapore
Prior art keywords
cutting blade
alignment method
aligning cutting
aligning
alignment
Prior art date
Application number
SG200103979A
Other languages
English (en)
Inventor
Kamigaki Masakado
Original Assignee
Disco Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Disco Corp filed Critical Disco Corp
Publication of SG92806A1 publication Critical patent/SG92806A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H01L21/3043—Making grooves, e.g. cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
    • B23D59/00—Accessories specially designed for sawing machines or sawing devices
    • B23D59/001—Measuring or control devices, e.g. for automatic control of work feed pressure on band saw blade
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
    • B28D5/0088—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work the supporting or holding device being angularly adjustable
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
    • B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
    • B28D5/023—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels with a cutting blade mounted on a carriage
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00—Cutting
    • Y10T83/02—Other than completely through work thickness
    • Y10T83/0333—Scoring
    • Y10T83/0348—Active means to control depth of score
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00—Cutting
    • Y10T83/04—Processes
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00—Cutting
    • Y10T83/162—With control means responsive to replaceable or selectable information program
    • Y10T83/173—Arithmetically determined program
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00—Cutting
    • Y10T83/162—With control means responsive to replaceable or selectable information program
    • Y10T83/173—Arithmetically determined program
    • Y10T83/175—With condition sensor
SG200103979A 2000-07-14 2001-06-26 Alignment method and apparatus for aligning cutting blade SG92806A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000214552A JP4640715B2 (ja) 2000-07-14 2000-07-14 アライメント方法及びアライメント装置

Publications (1)

Publication Number Publication Date
SG92806A1 true SG92806A1 (en) 2002-11-19

Family

ID=18710110

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200103979A SG92806A1 (en) 2000-07-14 2001-06-26 Alignment method and apparatus for aligning cutting blade

Country Status (4)

Country Link
US (1) US6494122B2 (de)
JP (1) JP4640715B2 (de)
DE (1) DE10133448B4 (de)
SG (1) SG92806A1 (de)

Families Citing this family (36)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6826986B2 (en) * 2001-05-05 2004-12-07 Ah Beng Lim Bi-directional singulation system and method
KR100391264B1 (ko) * 2001-07-31 2003-07-12 삼성전자주식회사 웨이퍼 절단 장치
JP2003124155A (ja) * 2001-10-12 2003-04-25 Disco Abrasive Syst Ltd 切削装置
JP4481667B2 (ja) * 2004-02-02 2010-06-16 株式会社ディスコ 切削方法
US7281535B2 (en) * 2004-02-23 2007-10-16 Towa Intercon Technology, Inc. Saw singulation
JP4554265B2 (ja) * 2004-04-21 2010-09-29 株式会社ディスコ 切削ブレードの位置ずれ検出方法
CN1313256C (zh) * 2004-08-30 2007-05-02 财团法人工业技术研究院 切割刀调整角度方法
JP4522234B2 (ja) * 2004-11-17 2010-08-11 株式会社ディスコ パネルの切削方法
JP4612441B2 (ja) * 2005-03-11 2011-01-12 株式会社ディスコ アライメント方法
JP4478053B2 (ja) * 2005-03-29 2010-06-09 株式会社ディスコ 半導体ウエーハ処理方法
US8053279B2 (en) * 2007-06-19 2011-11-08 Micron Technology, Inc. Methods and systems for imaging and cutting semiconductor wafers and other semiconductor workpieces
JP5127361B2 (ja) * 2007-08-22 2013-01-23 株式会社ディスコ パッケージ基板の分割方法
JP4382133B2 (ja) * 2008-03-11 2009-12-09 ファナック株式会社 シャトルを備えた加工機
JP5249651B2 (ja) * 2008-07-02 2013-07-31 株式会社フジクラ 基板材料切断装置及びその方法
US20100030365A1 (en) * 2008-07-30 2010-02-04 Pratt & Whitney Combined matching and inspection process in machining of fan case rub strips
JP5372429B2 (ja) * 2008-08-05 2013-12-18 株式会社ディスコ 板状物の分割方法
US8289388B2 (en) * 2009-05-14 2012-10-16 Asm Assembly Automation Ltd Alignment method for singulation system
WO2011139061A2 (ko) * 2010-05-04 2011-11-10 한미반도체 주식회사 반도체 자재 정렬방법
JP5777415B2 (ja) * 2011-06-10 2015-09-09 株式会社ディスコ 分割予定ライン検出方法
CN103381611A (zh) * 2013-07-11 2013-11-06 杭州金人自动控制设备有限公司 一种基于裁床的裁切刀位控制方法
WO2015063649A1 (en) * 2013-10-29 2015-05-07 Koninklijke Philips N.V. Separating a wafer of light emitting devices
JP6696897B2 (ja) * 2013-10-29 2020-05-20 ルミレッズ ホールディング ベーフェー 発光デバイスのウエハを分離する方法
JP6194811B2 (ja) * 2014-02-13 2017-09-13 コニカミノルタ株式会社 削り加工位置ドリフト量測定方法
JP6388823B2 (ja) * 2014-12-01 2018-09-12 株式会社ディスコ レーザー加工装置
JP6422355B2 (ja) 2015-01-29 2018-11-14 株式会社ディスコ アライメント方法
JP6486230B2 (ja) * 2015-07-22 2019-03-20 株式会社ディスコ アライメント方法
JP6656752B2 (ja) * 2016-01-22 2020-03-04 株式会社ディスコ パッケージウェーハの加工方法
JP6738687B2 (ja) * 2016-08-25 2020-08-12 株式会社ディスコ パッケージウエーハの加工方法
JP6845038B2 (ja) * 2017-02-27 2021-03-17 株式会社ディスコ パッケージ基板の分割方法
JP6912267B2 (ja) * 2017-05-09 2021-08-04 株式会社ディスコ レーザ加工方法
JP7028607B2 (ja) * 2017-11-06 2022-03-02 株式会社ディスコ 切削装置
JP7282450B2 (ja) * 2019-02-05 2023-05-29 株式会社ディスコ パッケージ基板の加工方法
JP6912745B1 (ja) * 2019-09-27 2021-08-04 株式会社東京精密 ダイシング装置及び方法
WO2021059937A1 (ja) * 2019-09-27 2021-04-01 株式会社東京精密 ダイシング装置及び方法
CN112330738A (zh) * 2020-01-08 2021-02-05 沈阳和研科技有限公司 一种划片机检测工件角度和步进的方法
JP7116330B2 (ja) 2020-01-31 2022-08-10 日亜化学工業株式会社 発光装置の製造方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE69205786T2 (de) * 1991-08-21 1996-03-28 Tokyo Seimitsu Co Ltd Blattpositiondetektionsvorrichtung.
JP3666068B2 (ja) * 1995-08-10 2005-06-29 株式会社ディスコ 切削方法
JP3223421B2 (ja) * 1996-08-13 2001-10-29 株式会社東京精密 ダイシング装置
US6250192B1 (en) * 1996-11-12 2001-06-26 Micron Technology, Inc. Method for sawing wafers employing multiple indexing techniques for multiple die dimensions
US6102023A (en) * 1997-07-02 2000-08-15 Disco Corporation Precision cutting apparatus and cutting method using the same
JP3203364B2 (ja) * 1997-12-01 2001-08-27 株式会社東京精密 アライメント方法及びその装置
JP3528659B2 (ja) * 1999-02-25 2004-05-17 株式会社村田製作所 セラミック板のダイシング方法および装置
JP4447074B2 (ja) * 1999-06-21 2010-04-07 株式会社ディスコ 切削装置

Also Published As

Publication number Publication date
DE10133448B4 (de) 2012-08-30
JP2002033295A (ja) 2002-01-31
US20020025616A1 (en) 2002-02-28
US6494122B2 (en) 2002-12-17
JP4640715B2 (ja) 2011-03-02
DE10133448A1 (de) 2002-01-24

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